Abstract: A uniform coding system for a flash memory is disclosed. A statistic decision unit determines a coding word according to a plurality of inputs. An inverse unit controllably inverts input data to be encoded. The input data are then encoded into encoded data according to a statistic determined by the statistic decision unit.

Abstract: A method and system for obtaining a reference block on which reference voltages may be found for a MLC flash memory are disclosed. A first block and a second block are provided in the flash memory. A memory controller alternatively controls one of the first and the second blocks to act as the reference block and the other one as a cycle block in a respective period, during which the reference block stays idle and the cycle block is subjected to program/erase cycles.

Abstract: A method of dynamic data storage for error correction in a memory device is disclosed. Data for storage is received, and the received data is then encoded and associated error correction code (ECC) is generated. The encoded data is stored in a portion of a data partition of the memory device, wherein percentage of the stored data in the data partition is determined according to an amount of corrected errors associated with the data partition or is predetermined.

Abstract: A method and system of finding a read voltage for a flash memory is disclosed. Data are read from array cells of the flash memory with a default read voltage, and a recorded state bit number that is recorded during programming is also read. Determine an optimal read voltage if the readout data do not pass the error correction control (ECC). Data are then re-read from the array cells of the flash memory with the determined optimal read voltage.

Abstract: A method and system for adaptively finding reference voltages for reading data from a multi-level cell (MLC) flash memory is disclosed. According to one embodiment, a first total number of cells of the flash memory above a first threshold voltage in a shifted threshold voltage distribution is provided. Search to find a second threshold voltage such that a second total number of the cells above the second threshold voltage is approximate to the first total number. An initial reference voltage or voltages of the initial threshold voltage distribution are shifted with an amount approximate to a voltage difference between the second threshold voltage and the first threshold voltage, thereby resulting in a new reference voltage or voltages for reading the data from the MLC flash memory.

Abstract: A method of reducing coupling effect in a flash memory is disclosed. A neighboring page is read, and a flag is set active if the neighboring page is an interfering page. Data are read from the neighboring page at least two more times using at least two distinct read voltages respectively. The threshold-voltage distributions associated with an original page and the neighboring page are transferred according to the read data and the flag.

Abstract: A method and system for obtaining a reference block on which reference voltages may be found for a MLC flash memory are disclosed. A first block and a second block are provided in the flash memory. A memory controller alternatively controls one of the first and the second blocks to act as the reference block and the other one as a cycle block in a respective period, during which the reference block stays idle and the cycle block is subjected to program/erase cycles.

Abstract: A method and system for adaptively finding reference voltages for reading data from a multi-level cell (MLC) flash memory is disclosed. According to one embodiment, information about an initial threshold voltage distribution is firstly provided. A first threshold voltage in the initial threshold voltage distribution is then associated with a second threshold voltage in a shifted threshold voltage distribution to be determined, such that the information corresponding to the first threshold voltage is approximate to the information corresponding to the second threshold voltage. Accordingly, initial reference voltage or voltages of the initial threshold voltage distribution are shifted with an amount approximate to difference between the first threshold voltage and the second threshold voltage, thereby resulting in new reference voltage or voltages for reading the data from the MLC flash memory.

Abstract: A method and system for adaptively finding reference voltages for reading data from a multi-level cell (MLC) flash memory is disclosed. According to one embodiment, information about an initial threshold voltage distribution is firstly provided. A first threshold voltage in the initial threshold voltage distribution is then associated with a second threshold voltage in a shifted threshold voltage distribution to be determined, such that the information corresponding to the first threshold voltage is approximate to the information corresponding to the second threshold voltage. Accordingly, initial reference voltage or voltages of the initial threshold voltage distribution are shifted with an amount approximate to difference between the first threshold voltage and the second threshold voltage, thereby resulting in new reference voltage or voltages for reading the data from the MLC flash memory.

Abstract: A programming method for programming stored bits in floating gates of a flash memory cell or selected flash memory cells of a flash memory array is utilized for applying SSI injection on said flash memory cell or said selected flash memory cells of a flash memory array is disclosed. Constant charges at the drain regions of said flash memory cell or said selected flash memory cells of the flash memory array is implemented with a capacitor and a related switch for suppressing variant injected-charges-related properties in applying the SSI injection. A constant biasing current, which may be implemented with a constant current source or a current mirror equipped with a constant current source, is applied on source regions of said flash memory cell or said selected flash memory cells of the flash memory array for enhancing the suppression of said variant biasing properties.

Abstract: A programming method for programming stored bits in floating gates of a flash memory cell or selected flash memory cells of a flash memory array is utilized for applying SSI injection on said flash memory cell or said selected flash memory cells of a flash memory array is disclosed. Constant charges at the drain regions of said flash memory cell or said selected flash memory cells of the flash memory array is implemented with a capacitor and a related switch for suppressing variant injected-charges-related properties in applying the SSI injection. A constant biasing current, which may be implemented with a constant current source or a current mirror equipped with a constant current source, is applied on source regions of said flash memory cell or said selected flash memory cells of the flash memory array for enhancing the suppression of said variant biasing properties.

Abstract: A method for reading a memory array is disclosed. The method includes turning on the column of select gates; preprogramming a first right floating gate to a high threshold and a first left floating gate coupled to a same first word line as the first right floating gate to a low threshold; charging a voltage of the right data line to a first predetermined value; charging a voltage of the first word line to a second predetermined value which is between the high threshold of the first right floating gate and the low threshold of the first left floating gate; charging a voltage of a second word line coupled to a second right floating gate to a third predetermined value; and comparing a current of the left data line with a fourth predetermined value.

Abstract: A memory structure formed between two doping regions in a semiconductor substrate includes two conductive blocks functioning as floating gates formed at two sides of a first conductive line functioning as a select gat and insulated from the first conductive line with two first dielectric spacers therebetween, wherein the two conductive blocks each have a raised top and raised parts of sides relative to the top of the first conductive line. A first dielectric layer is formed on the tops and the parts of the sides of the two conductive blocks. A second conductive line functioning as a word line is formed on the first dielectric layer, wherein the second conductive line has a part deposited between the two conductive blocks and is substantially perpendicular to the first conductive line and two doping region functioning as bit lines.

Abstract: A method for reading a memory array is disclosed. The method includes turning on the column of select gates; preprogramming a first right floating gate to a high threshold and a first left floating gate coupled to a same first word line as the first right floating gate to a low threshold; charging a voltage of the right data line to a first predetermined value; charging a voltage of the first word line to a second predetermined value which is between the high threshold of the first right floating gate and the low threshold of the first left floating gate; charging a voltage of a second word line coupled to a second right floating gate to a third predetermined value; and comparing a current of the left data line with a fourth predetermined value.

Abstract: A method for microstructure assembly is disclosed, which comprises steps of: providing a carrier having a plurality of joint formed thereon; forming a pedestal on each joint; forming a droplet on each pedestal; placing a microstructure on each droplet; removing each droplet for enabling the corresponding microstructure to couple with the joint corresponding thereto. In the aforesaid method, the use of the plural droplets is to align the plural microstructures in an automatic manner so as to enable each microstructure to couple with its corresponding joint smoothly. In a preferred aspect, an apparatus for microstructure assembly can be provided with respect to the aforesaid method, which is capable of automating the process of microstructure alignment and assembly.

Abstract: A method for verifying a programmed flash memory. When reading a memory cell, a voltage applied to a drain of the memory cell is a read drain voltage. First, a word line is enabled by applying a verification gate voltage. Next, a first bit line, which is connected to the drain of the memory cell, is enabled and a verification drain voltage, which is higher than the read drain voltage, is applied to the first bit line. Then, a second bit line is enabled and grounded. Thereafter, a third bit line is enabled and a verification isolation voltage is applied. Then, a drain current of the first bit line is sensed, wherein the drain current flows through the first bit line, the memory cell, and the second bit line. Finally, it is judged whether or not the memory cell is successfully programmed according to the drain current.

Abstract: A memory structure formed between two doping regions in a semiconductor substrate includes two conductive blocks functioning as floating gates formed at two sides of a first conductive line functioning as a select gat and insulated from the first conductive line with two first dielectric spacers therebetween, wherein the two conductive blocks each have a raised top and raised parts of sides relative to the top of the first conductive line. A first dielectric layer is formed on the tops and the parts of the sides of the two conductive blocks. A second conductive line functioning as a word line is formed on the first dielectric layer, wherein the second conductive line has a part deposited between the two conductive blocks and is substantially perpendicular to the first conductive line and two doping region functioning as bit lines.

Abstract: A protection device and a method for manufacturing integrated circuit devices protect against plasma charge damage, and related charge damage during manufacture. The protection device comprises a dynamic threshold, NMOS/PMOS pair having their respective gate terminals coupled to the semiconductor bulk in which the channel regions are formed. With proper metal connection, the structure protects against plasma charge damage on the integrated circuit device during manufacture, and can also be operated to protect against abnormal voltages during operation of the circuit.

Abstract: A protection circuit to discharge plasma-induced charges in a semiconductor device or integrated circuit includes a PMOS transistor and a diode. The PMOS transistor includes a substrate, a drain, a source, and a gate, the source being coupled to receive the plasma-induced charges. The diode has a positive terminal coupled to the substrate of the PMOS transistor and a negative terminal coupled the gate of the PMOS transistor.

Abstract: A protection circuit to discharge plasma-induced charges in a semiconductor device or integrated circuit includes a PMOS transistor and a diode. The PMOS transistor includes a substrate, a drain, a source, and a gate, the source being coupled to receive the plasma-induced charges. The diode has a positive terminal coupled to the substrate of the PMOS transistor and a negative terminal coupled the gate of the PMOS transistor.