Abstract: A memory device is connectable to a protection circuit for plasma-induced charge damage protection and includes a memory array including a plurality of word lines and a plurality of diodes each coupled between a corresponding one of the word lines and the protection circuit.

Abstract: A layout of flash memory having symmetric select transistors includes a memory cell array and a polysilicon gate. The polysilicon gate forms a plurality of select transistors in coordination with a plurality of pairs of sources/drains, so as to connect to the memory cell array. The polysilicon is perpendicularly extended toward a direction of the memory cell array, thereby overcoming a drawback as select transistors being unsymmetrical in a prior flash memory structure.

Abstract: A method for verifying a programmed flash memory. When reading a memory cell, a voltage applied to a drain of the memory cell is a read drain voltage. First, a word line is enabled by applying a verification gate voltage. Next, a first bit line, which is connected to the drain of the memory cell, is enabled and a verification drain voltage, which is higher than the read drain voltage, is applied to the first bit line. Then, a second bit line is enabled and grounded. Thereafter, a third bit line is enabled and a verification isolation voltage is applied. Then, a drain current of the first bit line is sensed, wherein the drain current flows through the first bit line, the memory cell, and the second bit line. Finally, it is judged whether or not the memory cell is successfully programmed according to the drain current.

Abstract: A layout of flash memory having symmetric select transistors includes a memory cell array and a polysilicon gate. The polysilicon gate forms a plurality of select transistors in coordination with a plurality of pairs of sources/drains, so as to connect to the memory cell array. The polysilicon is perpendicularly extended toward a direction of the memory cell array, thereby overcoming a drawback as select transistors being unsymmetrical in a prior flash memory structure.

Abstract: The present invention includes methods to pre-erase non-volatile memory cells using an electrical erase signal prior to dividing a wafer into dies. Particular aspects of the present invention are described in the claims, specification and drawings.

Abstract: A semiconductor device that includes a semiconductor substrate including a memory cell region and a dummy cell region, a plurality of substantially parallel bit lines in the semiconductor substrate, a plurality of memory cell gate dielectrics provided over the bit lines in the memory cell region, the memory cell gate dielectrics comprising an oxide-nitrideoxide (ONO) layer, a plurality of dummy cell gate dielectrics provided over the plurality of bit lines in the dummy cell region, wherein the dummy cell gate dielectrics is non-trapping for electric charges, and a plurality of substantially parallel word lines over the memory cell gate dielectrics and the dummy cell gate dielectrics.

Abstract: A semiconductor memory device is provided, including one or more bit lines, one or more word lines, and a dummy word line, which is coupled to a positive bias. A memory cell and dummy cell are coupled to a bit line and may be coupled to a word line and dummy word line respectively. Coupling the dummy word line to a positive bias at least during an erase operation prevents the dummy cells from being over-erased, which occurs when the dummy word line is coupled to ground.

Abstract: Programming a flash memory cell comprises receiving a first Vt corresponding to a first bit stored in the flash memory cell and receiving a second Vt corresponding to a second bit stored in the flash memory cell. In additon, programming the flash memory cell comprises programming one of the first bit and the second bit of the flash memory cell with a first programming voltage if the first Vt and the second Vt both correspond to a low Vt state prior to programming the flash memory cell. Furthermore, the first programming voltage is &Dgr;V lower than a second programming voltage that is used to program one of the first bit and the second bit of the flash memory cell if either of the first Vt and the second Vt correspond to a high Vt state prior to programming the flash memory cell.

Abstract: The present invention is related to methods and systems for refreshing non-volatile memories. A rewrite operation is performed followed by a refresh operation. The refresh operation is performed within a fixed time beginning at the byte cells associated with the selected bit line and proceeding to sequentially refersh cells associated with other bit lines. Cell currents are measured, and if a cell current meets a first criteria, the corresponding cell is refreshed.

Abstract: Programming a flash memory cell comprises receiving a first Vt corresponding to a first bit stored in the flash memory cell and receiving a second Vt corresponding to a second bit stored in the flash memory cell. In additon, programming the flash memory cell comprises programming one of the first bit and the second bit of the flash memory cell with a first programming voltage if the first Vt and the second Vt both correspond to a low Vt state prior to programming the flash memory cell. Furthermore, the first programming voltage is &Dgr;V lower than a second programming voltage that is used to program one of the first bit and the second bit of the flash memory cell if either of the first Vt and the second Vt correspond to a high Vt state prior to programming the flash memory cell.

Abstract: A semiconductor memory device is provided, including one or more bit lines, one or more word lines, and a dummy word line, which is coupled to a positive bias. A memory cell and dummy cell are coupled to a bit line and may be coupled to a word line and dummy word line respectively. Coupling the dummy word line to a positive bias at least during an erase operation prevents the dummy cells from being over-erased, which occurs when the dummy word line is coupled to ground.

Abstract: A protection device and a method for manufacturing integrated circuit devices protect against plasma charge damage, and related charge damage during manufacture. The protection device comprises a dynamic threshold, NMOS/PMOS pair having their respective gate terminals coupled to the semiconductor bulk in which the channel regions are formed. With proper metal connection, the structure protects against plasma charge damage on the integrated circuit device during manufacture, and can also be operated to protect against abnormal voltages during operation of the circuit.

Abstract: A method for operating a memory cell of a multi-level NROM is described. The memory cell of the multi-level NROM comprises a nitride layer, wherein the nitride layer comprises a plurality of charge-trapping regions to store locally a plurality of charges as the first bit memory and the second bit of memory. The stored charges of the second bit of memory forms an electrical barrier, which in turns affects the size of the threshold electric current of the first bit. The different threshold electrical currents of the first bit, which are affected by the size of the electrical barrier, define the various memory states of the memory cell of the multi-level NROM.

Abstract: A method for determining the necessity for refreshing memory cells of a flash memory that includes providing a first reference memory cell, measuring a current of the first reference memory cell, providing a second reference memory cell, measuring a current of the second reference memory cell, measuring a cell current of one of the memory cells of the flash memory, comparing the measured cell current to the current of the first reference memory cell, comparing the measured cell current to the current of the second reference memory cell, and refreshing the memory cell when the measured cell current is greater than the current of the first reference memory cell but less than the current of the second reference memory cell.

Abstract: The present invention is related to methods and systems for refreshing non-volatile memories. A refresh token associated with a first wordline is located. A determination is made as to whether a first cell current for a first cell coupled to the first wordline is within a first range. At least partly in response to determining that the first cell current is within the first range, the first cell is refreshed.

Abstract: The present invention provides a memory array fabricated by complementary metal-oxide-semiconductor salicide process. The memory array comprises a semiconductor substrate. Multitudes of first isolation devices are aligned in the semiconductor substrate and second isolation devices aligned on the semiconductor substrate. The alignment of the second isolation devices is parallel to one of the first isolation devices. Some polysilicon lines are on the second isolation devices therefor have null memory function. A conductive structure is below a surface of the semiconductor substrate. The conductive structure is located between the first isolation devices. A conductive contact is on the conductive structure. The correspondence of the first isolation devices and the polysilicon lines can prevent the conductive structures from short effect.

Abstract: The present invention includes methods to pre-erase non-volatile memory cells using an electrical erase signal prior to dividing a wafer into dies. Particular aspects of the present invention are described in the claims, specification and drawings.

Abstract: A silicon nitride read only memory and associated method of data programming and erasing. The read only memory includes a first type ion-doped semiconductor substrate, an oxide-nitride-oxide (ONO) composite layer over the semiconductor substrate, a first type ion-doped gate conductive layer over the ONO layer and a second type ion doped source/drain region in the substrate on each side of the ONO layer, wherein the second type ions have an electrical polarity opposite to the first type ions. Data is programmed into the silicon nitride read only memory by channel hot electron injection and data is erased from the silicon nitride read only memory by negative gate channel erase method. Since the gate conductive layer and the channel layer are identically doped, the energy gap between the two layers reduced. Hence, operating voltage of the gate terminal is lowered and damage to the tunnel oxide layer by hot holes is reduced.

Abstract: A method for operating a memory cell of a multi-level NROM is described. The memory cell of the multi-level NROM comprises a nitride layer, wherein the nitride layer comprises a plurality of charge-trapping regions to store locally a plurality of charges as the first bit memory and the second bit of memory. The stored charges of the second bit of memory forms an electrical barrier, which in turns affects the size of the threshold electric current of the first bit. The different threshold electrical currents of the first bit, which are affected by the size of the electrical barrier, define the various memory states of the memory cell of the multi-level NROM.

Abstract: An flash memory erase method. A bias Vg is applied to a gate of a memory cell. A bias Vd is applied to a source/drain region of the memory cell to execute an erase operation. The bias Vd is increased from an initial value to a predetermined value over time. During the increase of the bias Vd, no inspection is performed. Whether the memory of each memory cell has been erased is inspected. If the erase operation is complete, the erase operation is over. If not, a voltage raise erase-inspection step is performed at least once until it is confirmed that the memory of all the memory cells has been erase. Each voltage raise erase-inspection step includes an erase step with a raised voltage and an inspection step afterwards.