Patents by Inventor Ming Liang
Ming Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12048040Abstract: Embodiments of this application relate to the communication field, and in particular, to a multi-link communication method and an apparatus. A STA in a STA MLD sends an information frame on a link corresponding to the station, and the information frame is used to indicate a STA in an awake state in the STA MLD. An AP MLD receives the information frame, and sends a downlink message frame on a one or more links corresponding to a part of or all of STAs in the awake state in the STA MLD, to assist the part of or all of the stations in fast accessing a channel without waiting for a NAVSyncDelay time period.Type: GrantFiled: September 12, 2022Date of Patent: July 23, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Ming Gan, Yifan Zhou, Yunbo Li, Yuchen Guo, Jian Yu, Dandan Liang
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Patent number: 12044011Abstract: This invention, in embodiments, relates to a roofing material comprising (a) a coated substrate having a top surface and a back surface, and (b) a plurality of roofing granules applied to the top surface of the coated substrate. The plurality of roofing granules comprises from 50% to 100% of unitary, uncoated, non-mineral based particles. This invention, in embodiments, further relates to a method of preparing such roofing material.Type: GrantFiled: May 3, 2023Date of Patent: July 23, 2024Assignee: BMIC LLCInventors: Daniel E. Boss, Ming-Liang Shiao, Luis Duque
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Publication number: 20240243769Abstract: A radio frequency (RF) front-end circuit of a wireless communication device is provided. The RF front-end circuit includes a receiving amplifier, a down-converter, an up-converter, a transmitting amplifier and an output driver, where the receiving amplifier and the down-converter are configured to process received signals according to a local oscillation (LO) signal, and the up-converter, the transmitting amplifier and the output driver are configured to process transmitted signals according to the LO signal. The receiving amplifier, the up-converter or the transmitting amplifier includes a transformer load. The transformer load includes a switchable inductor. When the wireless communication device operates in a first mode, the LO signal has a first frequency, and the switchable inductor has a first inductance. When the wireless communication device operates in a second mode, the LO signal has a second frequency, and the switchable inductor has a second inductance.Type: ApplicationFiled: January 4, 2024Publication date: July 18, 2024Applicant: MediaTek Inc.Inventors: Tsung-Ming Chen, Wei-Kai Hong, Ting-Wei Liang, Wei-Pang Chao, Po-Yu Chang
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Publication number: 20240243956Abstract: The application provides a short training sequence design method and apparatus. The method includes: determining a short training sequence, where the short training sequence may be obtained based on an existing sequence, and the short training sequence with comparatively good performance may be obtained through simulation calculation, for example, by adjusting a parameter; and sending a short training field on a target channel, where the short training field is obtained by performing inverse fast Fourier transformation IFFT on the short training sequence, and a bandwidth of the target channel is greater than 160 MHz.Type: ApplicationFiled: January 4, 2024Publication date: July 18, 2024Inventors: Xin Zuo, Ming Gan, Dandan Liang
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Publication number: 20240241885Abstract: Disclosed embodiments provide techniques for dynamic data collection. The dynamic data collection includes determining a data generation temporal pattern. Based on the data generation temporal pattern, a data collection strategy is created. The data collection strategy can be based on one or more data collection goals. The data collection strategy can contain specific details on how data is to be collected. A data infrastructure evaluation is performed, which provides pricing models for resources such as electricity and/or network bandwidth. A data collection policy is created based on the data collection strategy and the data infrastructure evaluation. The data collection policy can contain specific details on when data is to be collected and what strategy to use for the collection. A data transfer schedule is created based on the data collection policy. The data transfer schedule determines when to collect data from one or more data source devices.Type: ApplicationFiled: January 17, 2023Publication date: July 18, 2024Inventors: Fan Jing Meng, Guang Han Sui, Peng Hui Jiang, Xing Tian, Li Jian Wang, Cheng Fang Wang, Hua Ye, Ming Liang Zu, Jun Su
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Patent number: 12041760Abstract: A transistor includes a gate structure that has a first gate dielectric layer and a second gate dielectric layer. The first gate dielectric layer is disposed over the substrate. The first gate dielectric layer contains a first type of dielectric material that has a first dielectric constant. The second gate dielectric layer is disposed over the first gate dielectric layer. The second gate dielectric layer contains a second type of dielectric material that has a second dielectric constant. The second dielectric constant is greater than the first dielectric constant. The first dielectric constant and the second dielectric constant are each greater than a dielectric constant of silicon oxide.Type: GrantFiled: August 9, 2022Date of Patent: July 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Yu Hsu, Jian-Hao Chen, Chia-Wei Chen, Shan-Mei Liao, Hui-Chi Chen, Yu-Chia Liang, Shih-Hao Lin, Kuei-Lun Lin, Kuo-Feng Yu, Feng-Cheng Yang, Yen-Ming Chen
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Patent number: 12040283Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.Type: GrantFiled: April 19, 2023Date of Patent: July 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai, Ming-Hung Tseng, Yen-Liang Lin, Chun-Ti Lu, Chung-Ming Weng
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Patent number: 12035511Abstract: The invention provides a chassis structure, a server, and a method of dissipating heat from server. The chassis structure comprises chassis body, two fan components, two tray components, and a power supply. The chassis body defines a receiving space bounded by two spaced partitions, the two partitions divide the receiving space into a middle cavity and two side cavities. The fan components are at one end of each side cavity and are connected to the chassis body. The two tray components carry slots for inserting hard disks. The power supply is arranged in the middle cavity and supplies power to the hard disks inserted in the slots, the power supply also has a fan, the power supply positioned at one end of the middle cavity.Type: GrantFiled: June 28, 2022Date of Patent: July 9, 2024Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.Inventors: Han-Yu Li, Wen-Hu Lu, Li-Yi Yin, Ming-Liang Zhang, Shu-Tong Wang
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Publication number: 20240223072Abstract: A power converter having a feedback voltage adjusting mechanism for a negative voltage is provided. Input terminals of an operational amplifier are respectively connected to a zero voltage and a first terminal of a first resistor. A second terminal of the first resistor is connected to a second terminal of a low-side switch. A first current source is connected to an output terminal of the operational amplifier and a first terminal of a second resistor. A second terminal of the second resistor is connected to the first terminal of the first resistor. The first current source outputs a first current according to a signal output by the operational amplifier. A second current source outputs a second current being m times the first current and is connected to a first terminal of a third resistor. A voltage of the first terminal of the third resistor is a feedback voltage.Type: ApplicationFiled: May 9, 2023Publication date: July 4, 2024Inventor: MING-LIANG TSAI
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Patent number: 12024888Abstract: This invention, in embodiments, relates to a roofing system comprising (a) a roofing substrate having a roofing surface, (b) a first roofing tile overlying the roofing surface, the first roofing tile having a front surface, a back surface, a top edge, and a bottom edge, and (c) a second roofing tile overlying the first roofing tile, the second roofing tile having a front surface, a back surface, a top edge, and a bottom edge. At least one sealant line is applied to (i) the back surface of the second roofing tile in an area that overlays the first roofing tile, (ii) the front surface of the first roofing tile in an area in which the second roofing tile overlays the first roofing tile, or (iii) both (i) and (ii). The at least one sealant line is configured to adhere the second roofing tile to the first roofing tile.Type: GrantFiled: May 2, 2023Date of Patent: July 2, 2024Assignee: BMIC LLCInventors: Ming-Liang Shiao, Brian Lee, Daniel E. Boss, Ramil Marcelo L. Mercado
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Publication number: 20240209631Abstract: Some embodiments of the present disclosure relate to an roofing shingle comprising a low penetration point asphalt reinforced glass mat. In some embodiments, the reinforced glass mat comprises a glass mat and a reinforcement material. In some embodiments, the glass mat comprises a web of glass fibers. In some embodiments, the reinforcement material is embedded into the web of glass fibers of the glass mat. In some embodiments, the reinforced glass mat comprises a sufficient amount of the reinforcement material, so as to result in a nail shank shear resistance of 13 lbs to 17 lbs, according to ASTM 1761 at 140° F. Methods of making the roofing shingle and methods of forming a roofing shingle from the roofing shingle are also disclosed herein.Type: ApplicationFiled: March 5, 2024Publication date: June 27, 2024Inventors: Ming-Liang Shiao, Jim Svec, Brian Lee
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Publication number: 20240200334Abstract: Roofing shingles are disclosed that are capable of self-adhering to a roof deck or underlayment and/or other roofing shingles and that require few or no mechanical fasteners to remain attached to the roof. By appropriate positioning of sealant lines on the shingle, direct adhesion between the shingle and the roof deck or underlayment and/or other roofing shingles can be achieved. If the shingle is laminated, the layers may be mechanically attached with indentations in the common bond area. The nail zone of the shingle may be visually indicated with fines and/or one or more paint lines. A roofing system comprising a plurality of courses of the shingles is also disclosed.Type: ApplicationFiled: February 26, 2024Publication date: June 20, 2024Inventors: Daniel E. Boss, Ming-Liang Shiao, James Svec, Chris Searcy, Nicholas Thurston
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Publication number: 20240203843Abstract: A semiconductor package is provided, including a package forming method and a power supply module. The semiconductor package may include a first chip comprising a first surface, and a second surface opposite the first surface. The semiconductor package may also include a chip interconnect component located on the second surface of the first chip. In addition, the semiconductor package may include a second chip located on the chip interconnect component, comprising a third surface in contact with the chip interconnect component, and a fourth surface opposite the third surface. The chip interconnect component comprises an electrically conductive frame, one side of the electrically conductive frame is electrically connected to the second surface of the first chip, and the other side of the electrically conductive frame is electrically connected to the third surface of the second chip.Type: ApplicationFiled: December 7, 2023Publication date: June 20, 2024Applicant: SHENZHEN STS MICROELECTRONICS CO., LTD.Inventors: Lin LIANG, Qiao CHEN, Junjie QIU, Yi Ming LIANG
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Patent number: 12013457Abstract: Systems and methods for integrating radar and LIDAR data are disclosed. In particular, a computing system can access radar sensor data and LIDAR data for the area around the autonomous vehicle. The computing system can determine, using the one or more machine-learned models, one or more objects in the area of the autonomous vehicle. The computing system can, for a respective object, select a plurality of radar points from the radar sensor data. The computing system can generate a similarity score for each selected radar point. The computing system can generate weight associated with each radar point based on the similarity score. The computing system can calculate predicted velocity for the respective object based on a weighted average of a plurality of velocities associated with the plurality of radar points. The computing system can generate a proposed motion plan based on the predicted velocity for the respective object.Type: GrantFiled: January 15, 2021Date of Patent: June 18, 2024Assignee: UATC, LLCInventors: Raquel Urtasun, Bin Yang, Ming Liang, Sergio Casas, Runsheng Benson Guo
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Publication number: 20240191442Abstract: A retractable apparatus includes a housing unit, a rotating unit and a retractable unit. The housing unit is formed with a housing teeth set therein. The rotating unit is disposed in and rotatable relative the housing unit. An end portion of the rotating unit is formed with a shaft teeth set engaging the housing teeth set. The shaft teeth set and the housing teeth set cooperatively prevent the rotating unit from rotating relative to the housing unit in a first turning direction. The shaft teeth set cooperates with the housing teeth set to allow the rotating unit to rotate in a second turning direction opposite to the first turning direction relative to the housing unit.Type: ApplicationFiled: February 10, 2023Publication date: June 13, 2024Applicant: SHIH YU AUTO PARTS CO., LTD.Inventor: Ming-Liang HU
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Patent number: 12004576Abstract: An absorbent garment has a pair of breast cups, each having a layer of moisture-wicking one-way transport material, an inner layer of absorbent terry cloth, an inner layer of foam, and an outer layer of water-resistant material. An inner face of the absorbent terry cloth is fully laminated to an outer face of the one-way transport material. An outer face of the absorbent terry cloth is fully laminated to an inner face of the foam. An outer edge of the one-way transport material is coupled to an outer edge of the foam. An outer face of the foam is fully laminated to an inner face of the water-resistant material. The absorbent terry cloth has an outer edge that does not extend to the outer edges of the one-way transport material or the foam such that the absorbent terry cloth is fully enclosed between the one-way transport material and the foam.Type: GrantFiled: November 3, 2022Date of Patent: June 11, 2024Assignee: Mast Industries (Far East) LimitedInventors: Ursula Giovanna Todaro, Suet Hing Yip, Ka Lai Tam, Jennifer Ostroski, Chang Ming Liang
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Patent number: 12000149Abstract: A roofing system including a cap shingle and a method of producing a cap shingle are disclosed. In one embodiment, the cap shingle is formed with a continuous or discontinuous self-sealing adhesive that is applied along a ridgeline direction and can provide high wind resistance, without the use of hand-sealed adhesive application. In an embodiment of the method, one or more layers of a shingle material can be oriented in a machine direction with the self-sealing adhesive applied adjacent side edges of the shingle material to form the cap shingles having self-seal strips and configured to bend in the machine direction for installation of the cap shingles along a ridge of a roof.Type: GrantFiled: March 17, 2023Date of Patent: June 4, 2024Assignee: BMIC LLCInventors: Luis Duque, Ming-Liang Shiao
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Patent number: 11987983Abstract: Roofing shingles are disclosed that are capable of self-adhering to a roof deck or underlayment and/or other roofing shingles and that require few or no mechanical fasteners to remain attached to the roof. By appropriate positioning of sealant lines on the shingle, direct adhesion between the shingle and the roof deck or underlayment and/or other roofing shingles can be achieved. If the shingle is laminated, the layers may be mechanically attached with indentations in the common bond area. The nail zone of the shingle may be visually indicated with fines and/or one or more paint lines. A roofing system comprising a plurality of courses of the shingles is also disclosed.Type: GrantFiled: December 13, 2022Date of Patent: May 21, 2024Assignee: BMIC LLCInventors: Daniel E. Boss, Ming-Liang Shiao, James Svec, Chris Searcy, Nicholas Thurston
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Patent number: 11977302Abstract: A cholesteric liquid crystal display device and a driving method for improving non-uniform image quality of the cholesteric liquid crystal display device. The cholesteric liquid crystal display device includes a cholesteric liquid crystal display panel and a liquid crystal drive unit. The cholesteric liquid crystal display panel is composed of multiple row circuit structures and multiple column circuit structures. The liquid crystal driving unit sequentially outputs column driving voltages to a plurality of column circuit structures in a scanning manner. After scanning the multiple column circuit structures, the liquid crystal driving unit applies an unselected voltage to the multiple column circuit structures together with more than 18 times the scanning unit time course, so as to make the brightness of the overall picture more uniform.Type: GrantFiled: December 8, 2022Date of Patent: May 7, 2024Assignee: IRIS OPTRONICS CO., LTD.Inventors: Ming-Liang Tsai, Wu-Chang Yang, Chi-Chang Liao
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Patent number: D1026260Type: GrantFiled: October 20, 2022Date of Patent: May 7, 2024Assignee: BMIC LLCInventors: Eric Anderson, Olan Thomas Leitch, Ming-Liang Shiao