Patents by Inventor Ming Liu

Ming Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250061458
    Abstract: A fault-tolerant asset transferring method is provided to prevent financial losses caused by human errors, specifically unintentional mistakes made by the payer. The system introduces a new definition for blockchain transaction parameters, allowing for multi-input transactions. Each payment transaction includes the payee's signature for confirmation and the payer's signature. In addition, a system is designed to handle multi-input asset transfer transactions which incorporate the payer's confirmation. Upon reaching an agreement on the transaction content, each participant generates an independent off-chain signature on the transaction's content. In the event that participants generate a signature on the erroneous content of a transaction, the transaction will be accepted in the blockchain with very low probability due to transaction validation.
    Type: Application
    Filed: December 13, 2023
    Publication date: February 20, 2025
    Applicant: JINAN UNIVERSITY
    Inventors: Yongdong WU, Jiao LU, Shishi HUANG, Tong LI, Jian WENG, Zhiquan LIU, Ming LI
  • Publication number: 20250061446
    Abstract: A system for enabling escrow-free, secure, and convenient atomic asset swaps between blockchains are provided. In detail, when any group of users reach an agreement on the content of cross-chain asset swap transactions, each participant creates an individual signature on the content of each transaction, employs a reversible signature aggregate function to produce an aggregate signature from all his/her individual signatures, and optionally generates a proof to prove the relationship between the aggregated signature and the transaction contents. Sequentially, all the participants exchange these aggregated signatures and optional proofs. Once a participant publishes one of his/her individual signature, the other parties can use both signatures—one from the sender and the other from the recipient—to construct a complete transaction. Once a transaction is broadcast, its corresponding transactions are constructed, and broadcast.
    Type: Application
    Filed: December 13, 2023
    Publication date: February 20, 2025
    Applicant: JINAN UNIVERSITY
    Inventors: Yongdong WU, Tong LI, Shishi HUANG, Jiao LU, Jian WENG, Ming LI, Zhiquan LIU
  • Publication number: 20250060542
    Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.
    Type: Application
    Filed: November 3, 2024
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Che-Hsiang Hsu, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Chung-Ming Weng
  • Publication number: 20250060140
    Abstract: An ice making method for a refrigerator and a refrigerator. The ice making method for a refrigerator comprises: enabling the temperature in an ice making compartment to be higher than or equal to a first preset value; filling an ice making container in the ice making compartment with water; providing cold energy to the ice making compartment according to a first refrigeration capacity, enabling the temperature in the ice making compartment to sequentially drop to reach multiple first preset temperatures, and when the temperature in the ice making compartment drops to reach each first preset temperature, maintaining the temperature in the ice making compartment at the first preset temperature for a corresponding first preset duration, among two adjacent first preset temperatures, the first preset duration corresponding to the lower first preset temperature being shorter than the first preset duration corresponding to the higher first preset temperature.
    Type: Application
    Filed: April 28, 2022
    Publication date: February 20, 2025
    Inventors: Long LIU, Ming WANG, Bintang ZHAO
  • Patent number: 12231491
    Abstract: A method for forecasting server demand includes collecting a historical number of scoring requests from a network using a serverless architecture. A scoring request capacity per server is determined using the historical number of scoring requests. A prediction model predicts a first future value of scoring requests for a first future time span. A current number of servers in a pool of servers handling the scoring requests. Using the prediction model, a determination of whether the current number of servers is capable of handling the first future value of scoring requests for the first future time span is made. Upon determining that the current number of servers is incapable of handling the first future value of scoring requests, one or more additional servers are warmed up. The warmed-up additional servers are added to the pool of servers prior to an arrival of the first future time span.
    Type: Grant
    Filed: November 14, 2023
    Date of Patent: February 18, 2025
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bo Song, Jun Wang, Dong Hai Yu, Yao Dong Liu, Xiao Ming Ma, Jiang Bo Kang
  • Patent number: 12228705
    Abstract: An optical imaging system sequentially includes a first lens, a second lens, a third lens, a fourth lens and a fifth lens from an object side to an image side along an optical axis. The first lens has positive refractive power, with an object-side surface being convex at the optical axis; the second lens has refractive power, with an image-side surface being convex at the optical axis; the third lens has refractive power; the fourth lens has positive refractive power, with an image-side surface being convex at the optical axis; the fifth lens has negative refractive power, with an object-side surface being convex at the optical axis and an image-side surface being concave at the optical axis; a diaphragm is arranged between the object side of the optical imaging system and the fifth lens.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: February 18, 2025
    Assignee: JIANGXI JINGCHAO OPTICAL CO., LTD.
    Inventors: Han Xie, Binbin Liu, Ming Li
  • Patent number: 12228139
    Abstract: The present disclosure provides a two-stage cavitation generator for organic wastewater treatment, including a shrouded impeller, a stator, and a rotor. The shrouded impeller includes a front cover plate, blades, and a rear cover plate. Several blades are evenly distributed between the front cover plate and the rear cover plate. A working surface of the blade is an arc surface, and a back of the blade protrudes locally, so that a flow channel between the back of the blade and a working surface of its adjacent blade is narrowed locally, forming a throat structure. An outlet of the shrouded impeller is provided with the stator and the rotor, and the stator is located at an outer edge of the front cover plate and fixed on an inner wall of a volute. The rotor is mounted on the rear cover plate.
    Type: Grant
    Filed: June 19, 2023
    Date of Patent: February 18, 2025
    Assignee: Jiangsu University
    Inventors: Yong Wang, Ming Li, Zhiyao Ding, Qin Pi, Qiang Xu, Yu Hu, Yu Huang, Houlin Liu
  • Patent number: 12227666
    Abstract: Described herein is a 2K clearcoat composition including, Component I including a). at least one resin having carboxylic acid groups with acid value of 50 to 400 mg KOH/g; b). at least one resin having hydroxyl functional groups with a hydroxyl value of 10 to 800 mg KOH/g; c). at least one catalyst; and d). at least one solvent, and Component II including e). at least one epoxy-functional alkoxysilane and/or its oligomer and/or its polymer; and f). at least one crosslinker reactive to hydroxyl groups. Also described herein are a substrate coated with the dried and cured 2K clearcoat composition and an automotive including the substrate.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: February 18, 2025
    Assignee: BASF COATINGS GMBH
    Inventors: Yang Zhang, Ji Ming Wang, Lei He, Christian Gerhard Schaefer, Wen Mei Liu, Ranjit Salvi, Stefan Hirsemann
  • Patent number: 12227545
    Abstract: The present invention discloses a Acinetobacter baumannii immunogenic protein and its composition and application. This invention provides a protein, comprising 39 amino acids of the N-terminal ?-helix part of the Ata protein transport functional domain of Acinetobacter baumannii and an adjuvant protein; amino acid sequence of said 39 amino acids of the N-terminal ?-helix part of the Ata protein transport functional domain of Acinetobacter baumannii is shown as the 127th-165th amino acid residues of SEQ ID NO:2. In present invention the 39 amino acids of the N-terminal ?-helix part of surface protein Ata (Acinetobacter trimeric autotransporter) of Acinetobacter baumannii, was took to fuse with CTB, and express in BL21. The protein was purified by a nickel column, and used to intraperitoneally immunize mouses by 2.5 ?g/mouse. Its immunogenicity and immunoprotection was verified through the animal experiments, which proves it has a good effect of anti-infection of Acinetobacter baumannii.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: February 18, 2025
    Assignee: CHENGDU OLYMVAX BIOPHARMACEUTICALS INC.
    Inventors: Hengliang Wang, Li Zhu, Chao Pan, Zhicheng Liu, Xin Li, Jun Wu, Peng Sun, Ming Zeng, Bin Wang, Xiankai Liu, Dongshu Wang, Erling Feng
  • Patent number: 12228765
    Abstract: A curved optical plate includes a curved light exit surface including at least one curved edge and at least one uncurved edge, and at least one first side surface connected to the at least one uncurved edge of the light exit surface; a first side surface includes a first surface, and the first surface extends toward an interior of the curved optical plate.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: February 18, 2025
    Assignees: FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yuhang Lin, Zhiying Chen, Chengkun Liu, Han Zhang, Hongyu Zhao, Ming Chen, Zhijie Guo, Lian Fang, Long Hu, Ting Cui, Liangliang Ren, Kai Diao
  • Patent number: 12228817
    Abstract: A display device and a control method therefor are disclosed. The display device includes: a first backlight module; a second backlight module located at a light emergent side of the first backlight module; and a display panel located at a side of the second backlight module facing away from the first backlight module; where the first backlight module includes a first light board, and the first light board emits light to a side of the second backlight module; the second backlight module includes at least one second light board, second light boards of the at least one second light board are stacked, and the second light boards transmit the light emitted by the first backlight module and emit light to the display panel; the first light board includes a plurality of first light sources, each second light board of the second light boards includes a plurality of second light sources.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: February 18, 2025
    Assignees: Fuzhou BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Ming Chen, Nani Liu, Kai Diao, Han Zhang, Long Hu, Hongyu Zhao, Siyu Wu, Jingran Niu, Jiwei Sun, Yuhang Lin, Dingjie Zheng
  • Patent number: 12231363
    Abstract: This application relates to the field of wireless communication technologies, and in particular, to a method and an apparatus for transmitting a physical layer protocol data unit, and for example, is applied to a wireless local area network. The method includes: A first communications device generates a PPDU and may send the PPDU, where the PPDU includes an LTF sequence; and correspondingly, a second communications device receives the PPDU, and parses the PPDU to obtain the LTF sequence included in the PPDU. Embodiments of this application can be used to design an LTF sequence that has a relatively low PAPR on entire bandwidth, on a single resource unit, on a combined resource unit, and in a considered multi-stream scenario.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: February 18, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chenchen Liu, Dandan Liang, Ming Gan
  • Publication number: 20250054849
    Abstract: A chip package is provided. The chip package includes a device substrate, a first redistribution layer (RDL), a carrier base, and at least one conductive connection structure. The device substrate has at least one first through-via opening extending from the backside surface of the device substrate to the active surface of the device substrate. The first RDL is disposed on the backside surface of the device substrate and extends in the first through-via opening. The carrier base carries the device substrate, and has a first surface facing the backside surface of the device substrate and a second surface opposite the first surface. The conductive connection structure is disposed on the second surface of the carrier base and is electrically connected to the first RDL.
    Type: Application
    Filed: July 22, 2024
    Publication date: February 13, 2025
    Inventors: Wei-Luen SUEN, Po-Jung CHEN, Chia-Ming CHENG, Po-Shen LIN, Jiun-Yen LAI, Tsang-Yu LIU, Shu-Ming CHANG
  • Publication number: 20250056690
    Abstract: A lighting device with adaptive power adjustment function includes a constant-voltage isolation circuit, a DC/DC constant-current power circuit, a controller and a load. The constant-voltage isolation circuit is connected to an external power source. The DC/DC constant-current power circuit is connected to the constant-voltage isolation circuit. The controller is connected to the DC/DC constant-current power circuit. The load includes a plurality of load units. The load is connected to the controller and the DC/DC constant-current power circuit. The controller detects the operational status of each of the load units to generate a detection result, and controls the DC/DC constant-current power circuit according to the detection result so as to adjust a total output power.
    Type: Application
    Filed: July 15, 2024
    Publication date: February 13, 2025
    Applicant: Xiamen PVTECH Co., Ltd.
    Inventors: FUXING LU, CHUN MING LIU
  • Publication number: 20250053039
    Abstract: An E-paper display panel including an E-paper display layer, a first substrate, a pixel array layer, a common electrode layer, and a driving circuit is provided. The first substrate is disposed at a first side of the E-paper display layer. The pixel array substrate is disposed between the first substrate and the E-paper display layer and includes touch electrodes and driving pixels arranged in an array. Each driving pixel includes a first pixel electrode and a second pixel electrode. The touch electrodes, the first pixel electrode, and the second pixel electrode are overlapped with each other. The common electrode layer is disposed at a second side of the E-paper display layer. The first side is opposite to the second side. The driving circuit is in signal communication with the common electrode layer and the pixel array layer. The touch electrodes are individually in signal communication with the driving circuit.
    Type: Application
    Filed: July 11, 2024
    Publication date: February 13, 2025
    Applicant: E Ink Holdings Inc.
    Inventors: Chia-Ming Hsieh, Chi-Mao Hung, Sung-Hui Huang, Chuen-Jen Liu, Liang-Yu Yan, Pei Ju Wu, Po-Chun Chuang, Che-Sheng Chang, Wen-Chung Yang
  • Publication number: 20250056841
    Abstract: An integrated circuit device includes a semiconductor layer, an oxide semiconductor layer, and a gate structure. The semiconductor layer is free of oxygen. The oxide semiconductor layer is over and spaced apart from the semiconductor layer. The gate structure wraps around a channel region of the semiconductor layer and a channel region of the oxide semiconductor layer.
    Type: Application
    Filed: August 10, 2023
    Publication date: February 13, 2025
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Jih-Chao CHIU, Chien-Te TU, Yuan-Ming LIU, Eknath SARKAR, Chee-Wee LIU
  • Publication number: 20250056851
    Abstract: A semiconductor device includes a first channel region, a second channel region, and a first insulating fin, the first insulating fin being interposed between the first channel region and the second channel region. The first insulating fin includes a lower portion and an upper portion. The lower portion includes a fill material. The upper portion includes a first dielectric layer on the lower portion, the first dielectric layer being a first dielectric material, a first capping layer on the first dielectric layer, the first capping layer being a second dielectric material, the second dielectric material being different than the first dielectric material, and a second dielectric layer on the first capping layer, the second dielectric layer being the first dielectric material.
    Type: Application
    Filed: October 28, 2024
    Publication date: February 13, 2025
    Inventors: Jen-Hong Chang, Yi-Hsiu Liu, You-Ting Lin, Chih-Chung Chang, Kuo-Yi Chao, Jiun-Ming Kuo, Yuan-Ching Peng, Sung-En Lin, Chia-Cheng Chao, Chung-Ting Ko
  • Patent number: 12222545
    Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.
    Type: Grant
    Filed: April 18, 2023
    Date of Patent: February 11, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 12221139
    Abstract: A box underframe end structure of a railway vehicle includes an underframe boundary beam, an end beam, a front draft sill, and a coupler mounting seat, and further includes a rear end cross beam located on one side in a rear of the front draft sill, an end floor fixed between the end beam and the rear end cross beam, and a coupler cross beam fixed with the coupler mounting seat into a whole. A draft sill includes the front draft sill and a rear draft sill respectively arranged on a front side and a rear side of the coupler mounting seat. The coupler cross beam, the rear end cross beam, and the end floor are welded and fixed with the underframe boundary beam. The front draft sill, the rear draft sill, and the coupler cross beam are welded and fixed on a lower surface of the end floor.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: February 11, 2025
    Assignee: CRRC Nanjing Puzhen Co., Ltd.
    Inventors: Ming Li, Rui Deng, Yonghai Gao, Fei Xiao, Shixi Ou, Yingbo Liu, Shuai Li
  • Patent number: 12224179
    Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: February 11, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu, Chia-Wei Ho, Yang-Chun Cheng, William Weilun Hong, Liang-Guang Chen, Kei-Wei Chen