Abstract: Described herein is a 2K clearcoat composition including, Component I including a). at least one resin having carboxylic acid groups with acid value of 50 to 400 mg KOH/g; b). at least one resin having hydroxyl functional groups with a hydroxyl value of 10 to 800 mg KOH/g; c). at least one catalyst; and d). at least one solvent, and Component II including e). at least one epoxy-functional alkoxysilane and/or its oligomer and/or its polymer; and f). at least one crosslinker reactive to hydroxyl groups. Also described herein are a substrate coated with the dried and cured 2K clearcoat composition and an automotive including the substrate.

Abstract: A method for forecasting server demand includes collecting a historical number of scoring requests from a network using a serverless architecture. A scoring request capacity per server is determined using the historical number of scoring requests. A prediction model predicts a first future value of scoring requests for a first future time span. A current number of servers in a pool of servers handling the scoring requests. Using the prediction model, a determination of whether the current number of servers is capable of handling the first future value of scoring requests for the first future time span is made. Upon determining that the current number of servers is incapable of handling the first future value of scoring requests, one or more additional servers are warmed up. The warmed-up additional servers are added to the pool of servers prior to an arrival of the first future time span.

Abstract: A curved optical plate includes a curved light exit surface including at least one curved edge and at least one uncurved edge, and at least one first side surface connected to the at least one uncurved edge of the light exit surface; a first side surface includes a first surface, and the first surface extends toward an interior of the curved optical plate.

Abstract: A chip package is provided. The chip package includes a device substrate, a first redistribution layer (RDL), a carrier base, and at least one conductive connection structure. The device substrate has at least one first through-via opening extending from the backside surface of the device substrate to the active surface of the device substrate. The first RDL is disposed on the backside surface of the device substrate and extends in the first through-via opening. The carrier base carries the device substrate, and has a first surface facing the backside surface of the device substrate and a second surface opposite the first surface. The conductive connection structure is disposed on the second surface of the carrier base and is electrically connected to the first RDL.

Abstract: An integrated circuit device includes a semiconductor layer, an oxide semiconductor layer, and a gate structure. The semiconductor layer is free of oxygen. The oxide semiconductor layer is over and spaced apart from the semiconductor layer. The gate structure wraps around a channel region of the semiconductor layer and a channel region of the oxide semiconductor layer.

Abstract: A lighting device with adaptive power adjustment function includes a constant-voltage isolation circuit, a DC/DC constant-current power circuit, a controller and a load. The constant-voltage isolation circuit is connected to an external power source. The DC/DC constant-current power circuit is connected to the constant-voltage isolation circuit. The controller is connected to the DC/DC constant-current power circuit. The load includes a plurality of load units. The load is connected to the controller and the DC/DC constant-current power circuit. The controller detects the operational status of each of the load units to generate a detection result, and controls the DC/DC constant-current power circuit according to the detection result so as to adjust a total output power.

Abstract: An E-paper display panel including an E-paper display layer, a first substrate, a pixel array layer, a common electrode layer, and a driving circuit is provided. The first substrate is disposed at a first side of the E-paper display layer. The pixel array substrate is disposed between the first substrate and the E-paper display layer and includes touch electrodes and driving pixels arranged in an array. Each driving pixel includes a first pixel electrode and a second pixel electrode. The touch electrodes, the first pixel electrode, and the second pixel electrode are overlapped with each other. The common electrode layer is disposed at a second side of the E-paper display layer. The first side is opposite to the second side. The driving circuit is in signal communication with the common electrode layer and the pixel array layer. The touch electrodes are individually in signal communication with the driving circuit.

Abstract: A semiconductor device includes a first channel region, a second channel region, and a first insulating fin, the first insulating fin being interposed between the first channel region and the second channel region. The first insulating fin includes a lower portion and an upper portion. The lower portion includes a fill material. The upper portion includes a first dielectric layer on the lower portion, the first dielectric layer being a first dielectric material, a first capping layer on the first dielectric layer, the first capping layer being a second dielectric material, the second dielectric material being different than the first dielectric material, and a second dielectric layer on the first capping layer, the second dielectric layer being the first dielectric material.

Abstract: A box underframe end structure of a railway vehicle includes an underframe boundary beam, an end beam, a front draft sill, and a coupler mounting seat, and further includes a rear end cross beam located on one side in a rear of the front draft sill, an end floor fixed between the end beam and the rear end cross beam, and a coupler cross beam fixed with the coupler mounting seat into a whole. A draft sill includes the front draft sill and a rear draft sill respectively arranged on a front side and a rear side of the coupler mounting seat. The coupler cross beam, the rear end cross beam, and the end floor are welded and fixed with the underframe boundary beam. The front draft sill, the rear draft sill, and the coupler cross beam are welded and fixed on a lower surface of the end floor.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.

Abstract: A data transmission method includes: obtaining a target data packet to be stored, the target data packet including an address of the target data packet; determining, from predetermined N parallel-to-serial units based on the address of the target data packet, a target parallel-to-serial unit corresponding to the target data packet, the N parallel-to-serial units being connected to N storage control units in one-to-one correspondence; and transmitting, by the target parallel-to-serial unit, the target data packet to a target storage control unit, and storing, by the target storage control unit, the target data packet in a corresponding storage unit. The target storage control unit is a storage control unit, connected to the target parallel-to-serial unit, of the N storage control units. The target parallel-to-serial unit is configured to divide the target data packet into a plurality of data sub-packets.

Abstract: Provided are an array substrate, a fabrication method thereof, and a display panel. The array substrate includes a substrate; a reflective electrode layer on the substrate; a pixel defining layer on a side of the reflective electrode layer away from the substrate; an anti-reflection layer between the reflective electrode layer and the pixel defining layer, and configured to absorb light from outside, an orthographic projection of the anti-reflection layer on the substrate being within an overlapping portion between the orthographic projection of the reflective electrode layer on the substrate and the orthographic projection of the pixel defining layer on the substrate; and a black matrix on a side of the pixel defining layer away from the substrate, an orthographic projection of at least a portion of the anti-reflection layer on the substrate not overlapping with an orthographic projection of the black matrix on the substrate.

Abstract: A point cloud coding method, including: partitioning a point cloud, and determining a current coding block; determining a quantization parameter optimization enable identifier, a hierarchical level index, and a quantization parameter offset parameter of the current coding block; determining, according to the hierarchical level index and the quantization parameter offset parameter, a quantization step Qstep corresponding to a level of detail; and upon detecting that the quantization parameter optimization enable identifier is a first value, performing operations for one or more points included in the current coding block.

Abstract: A thermostatic radiator valve supports a display that is configurable to display TRV information for a desired viewing direction to facilitate reading by a user, where the TRV comprises a configurable electronic display, a configuration circuit, and a processing device. The configuration circuit is capable of detecting when the TRV has been installed, determining a desired display orientation from a plurality of orientations with respect to a designated surface via a sensor in response to the detecting, and generating a display indicator indicative of the desired display orientation. The processing device is capable of receiving the display indicator and configuring the configurable electronic display to display the TRV information in the desired display orientation.

Abstract: The present invention relates to methods of preferentially sorbing, from a target mixture, one or more target substance(s) over one or more non-target substance(s). In particular, porous organic cages (POCs) may be deployed in the quantum sieving of mixtures of hydrogen isotopes to selectively sorb heavy hydrogen isotopes (e.g. diatomic deuterium) over lighter isotopes (diatomic protium).

Abstract: A measurement device includes a base, a platform, a temperature sensor, and a weighing component. The platform is movably disposed on the base. The temperature sensor is disposed on the base or the platform. The weighing component is accommodated in the base. The platform has a weight-measuring area and a temperature-measuring area which is located within the weight-measuring area and corresponding to the temperature sensor.

Abstract: Provided are a point cloud encoding method and decoding method, and an encoder and a decoder. The encoding method comprises: processing attribute information of a target point in a point cloud, so as to obtain a predicted residual of the attribute information of the target point; quantizing the predicted residual on the basis of a quantized weight of the target point and a quantized stride of the target point, so as to obtain a quantized residual of the attribute information of the target point, wherein the quantized weight of the target point is the weight used when weighting the quantized stride of the target point; and encoding the quantized residual, so as to obtain a code stream.

Abstract: A wiring board includes a mother board and a daughter board that are stacked, a bonding layer disposed between the mother board and the daughter board, and at least one side wiring. The mother board includes a first substrate, and a first wiring layer disposed on the first substrate and including at least one first connection pad. The daughter board is disposed on a side of the first substrate away from the first wiring layer. The daughter board includes a second substrate, and a second wiring layer disposed on the second substrate and including at least one second connection pad. The at least one side wiring is connected, via a respective end thereof, to the at least one first connection pad in one-to-one correspondence, and the at least one side wiring is connected, via respective another end thereof, to the at least one second connection pad in one-to-one correspondence.