Abstract: A post-CMP wafer clean process. A post-CMP wafer is provided. A portion of particles and slurry are removed from the wafer by double side scrubber. The residual particles and slurry are then removed from the wafer in a solvent tank by magasonic and a solvent in the solvent tank includes an amine-based compound.

Abstract: A method for forming dual damascene is provided. First, a first inter-metal dielectric layer and a stop layer is formed on a substrate, and then a first photoresist pattern including a via hole and a dummy metal line is patterned and the stop layer is etched for forming via hole. Next, a second inter-metal dielectric layer is deposited and then a second photoresist pattern is patterned for forming metal line trench by etching. Afterwards, a glue layer and a metal layer are blanketed and the dual damascene structure is formed by chemical mechanical polishing.

Abstract: A liner for a cargo container includes an expansible liner body shaped to fit a cargo space of the cargo container. The liner body includes top and bottom panels, left and right panels interconnecting the top and bottom panels, and front and rear panels. The top, bottom, left, right, front and rear panels together define an accommodation space thereamong for receiving bulk cargo. The rear panel has an outlet opening communicated with the accommodation space. Two first and second reinforcing members are secured respectively to and along the front edges of the left and right panels. Two first and second connecting members are secured respectively to and along the left and right edges of the bottom panel near the rear panel.