Abstract: The present disclosure discloses an energy storage device and electrical appliance. The energy storage device includes a housing, an electrode assembly, a top cover, a lower plastic member, a connecting plate and an insulating adhesive sheet, wherein the housing is provided with an opening; the electrode assembly is accommodated in the housing; the top cover covers the opening and is provided with a liquid injection hole; the lower plastic member is arranged on a side of the top cover close to the electrode assembly, and has an liquid injection hole, and the through hole is in communication with the liquid injection hole; the connecting plate is arranged on a side of the lower plastic member towards the electrode assembly; the insulating adhesive sheet is attached to a side of the connecting plate towards the electrode assembly and covers the connecting plate and the through hole.

Abstract: An apparatus for CMP includes a wafer carrier retaining a semiconductor wafer during a polishing operation, a slurry dispenser dispensing an abrasive slurry, and a slurry temperature control device coupled to the shiny dispenser and configured to control a temperature of the abrasive slurry. The slurry temperature control device includes a heat transferring portion surrounding a portion of the slurry dispenser, and a thermos-electric (TE) chip coupled to the heat transferring portion and configured to control the temperature of the abrasive slurry.

Abstract: The present disclosure is directed to organotin cluster compounds having formula (I) and their use as photoresists in extreme ultraviolet lithography processes.

Abstract: A feeding device includes a material rack configured to support a carrier board, a ratchet mechanism disposed outside the material rack, a locking mechanism disposed outside the material rack, and a triggering mechanism. The locking mechanism can engage with the ratchet mechanism. The triggering mechanism an drive the ratchet mechanism to move back and forth in a first direction, thereby controlling the locking mechanism to move back and forth in a second direction different from the first direction, so that the material rack alternates between a locked state and an unlocked state.

Abstract: A two-phase immersion-type heat dissipation structure having fins with different thermal conductivities is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the plurality of fins. At least one of the plurality of fins is a functional fin that is made of a single metal material and has two or more thermal conductivities. A thermal conductivity of a lower portion of the functional fin that is connected with the heat dissipation substrate is lower than thermal conductivities of other portions of the functional fin.

Abstract: A UE may receive information associated with an MCG. The UE may train, based on at least one of the information associated with the MCG or historical information of the UE for an SCG, an ML model that indicates whether a location of the UE is within a coverage area of the SCG. The UE may communicate with a base station based on an indication of the ML model. The indication of the ML model may be indicative of whether the UE is within the coverage area of the SCG.

Abstract: A manufacturing method of a package structure is provided, which includes the following steps. A carrier having a surface is provided. A copper foil layer is laminated on the surface of the carrier. A subtractive process is performed on the copper foil layer to form a copper foil circuit layer on the carrier. The copper foil circuit layer exposes a part of the surface of the carrier. A build-up structure layer is formed on the copper foil circuit layer and the surface of the carrier. A first surface of the copper foil circuit layer is aligned with a second surface of the build-up structure layer. At least one electronic component is disposed on the build-up structure layer. A package colloid is formed to cover the electronic component and the build-up structure layer. The carrier is removed to expose the first surface of the copper foil circuit layer.

Abstract: A chip packaging structure includes a chip, a redistribution layer, a solder ball, an encapsulant, and a stress buffer layer. The chip has an active surface and a back surface opposite to each other, and a peripheral surface connected to the active surface and the back surface. The redistribution layer is disposed on the active surface of the chip. The solder ball is disposed on the redistribution layer, and the chip is electrically connected to the solder ball through the redistribution layer. The encapsulant encapsulates the active surface and the back surface of the chip, the redistribution layer, and part of the solder ball. The stress buffer layer at least covers the peripheral surface of the chip. An outer surface of the stress buffer layer is aligned with a side surface of the encapsulant.

Abstract: A semiconductor device includes a substrate; a first thermoelectric conduction leg, disposed on the substrate, and doped with a first type of dopant; a second thermoelectric conduction leg, disposed on the substrate, and doped with a second type of dopant, wherein the first and second thermoelectric conduction legs are spatially spaced from each other but disposed along a common row on the substrate; and a first intermediate thermoelectric conduction structure, disposed on a first end of the second thermoelectric conduction leg, and doped with the first type of dopant.

Abstract: A wind power prediction method and system based on a deep deterministic policy gradient (DDPG) algorithm is provided and relates to the technical field of wind power prediction. The method uses multiple different prediction methods to build a combined prediction sub-model, and then uses a DDPG algorithm to maximize discount benefit by using an agent in the algorithm to interact with an external prediction environment for constant trial-and-error attempts. Finally, the agent has a capability of perceiving the external prediction environment, and a capability of reasonably and dynamically assigning weights to various prediction sub-models in a combined model, so as to achieve an accurate prediction.

Abstract: A liquid-cooling heat-dissipation structure is provided, which includes a first structure having a plurality of skived fins and a second structure having a plurality of guide fins. The first structure and the second structure are combined to each other, so that a chamber is formed between the first structure and the second structure for receiving a working fluid, and the skived fins and the guide fins are disposed in the chamber.

Abstract: In a hand-held power tool, in particular a screwdriver, having a work field lighting and an elongated housing, in which a drive unit is arranged, comprising at least one drive motor for driving a toolholder, wherein the toolholder is configured so as to accommodate an application tool, and with a battery for network-independent power supply, wherein, in a charging operation for a charging, the battery is electrically conductively connectable to an external charging apparatus, a control electronics is associated with the work field lighting and is configured so as to visualize a charging of the battery in the charging operation by a repeated illumination and dimming of the work field lighting.

Abstract: A display panel is provided, including an array substrate; a light-emitting layer located at a side of the array substrate and including a plurality of light-emitting units; a touch dielectric layer located at a side of the light-emitting layer facing away from the array substrate and including a plurality of first apertures; a black matrix located within each of the plurality of first apertures; and a color filter layer located at a side of the touch dielectric layer facing away from the array substrate and including a plurality of color filter units. An orthographic projection of each of the plurality of first apertures on the light-emitting layer is located between two adjacent light-emitting units of the plurality of light-emitting units. The plurality of color filter units is in one-to-one correspondence to the plurality of light-emitting units.

Abstract: A method for calibrating linear vibration and angular vibration based on monocular vision. A motion sequence image of a feature mark is acquired by an industrial camera, and an output signal of a linear and angular accelerometer is acquired by a data acquisition card, where the feature mark and the linear and angular accelerometer are fixed on a work table. An exciting acceleration of the linear and angular accelerometer is measured by a monocular vision method integrating a camera calibration method and a sub-pixel edge extraction method based on line segment detection. The exciting acceleration and the output signal are fitted by a sine approximation method, respectively, and corresponding fitted peaks are obtained. A sensitivity of the linear and angular accelerometer is obtained according to the fitted peaks.

Abstract: The present application relates to the field of refrigeration, and provides door assembly and refrigeration equipment. The door assembly includes: a door leaf, including a first door body and a second door body, where the first door body is configured to be rotatably connected to an installation part, and the second door body is configured to move toward an opening side or a hinged side of the first door body with respect to the first door body to switch between a sealing position and an avoidance position; the door leaf is configured to switch between a closing state in which the second door body is in the sealing position and an opening state; the second door body is in the avoidance position when the door leaf is switched between the closing state and the opening state. When the door leaf is in a closing state, the second door body is in the sealing position to ensure the sealing effect of the door leaf.

Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.

Abstract: Provided are a method for driving a display panel, the method comprises a plurality of picture update periods, wherein at least one of the plurality of picture update periods comprises a first data write stage, a second data write stage, and a data retention stage; at least one of the first data write stage precedes at least one of the second data write stage; at the first data write stage, a gate scanning signal is provided for and a first data voltage is written to a pixel unit; at the second data write stage, the gate scanning signal is provided for and a second data voltage is written to the pixel unit, wherein the first data voltage is less than the second data voltage.

Abstract: A pellicle for an extreme ultraviolet (EUV) reflective mask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes network of boron nitride nanotubes without containing a carbon nanotube.

Abstract: The embodiments of the present application provide a display substrate, a light field display apparatus, and a method for driving the same. The display substrate includes: a base substrate; a light emitting block on the base substrate, wherein the light emitting block includes a plurality of first light emitting units, and each of the first light emitting units includes a plurality of first light emitting points which are located at a plurality of predetermined positions in the first light emitting unit respectively; and first driving leads each electrically connected to first light emitting points located at the same predetermined positions in the respective first light emitting units and configured to receive a first driving signal from a driving circuit.

Abstract: An organometallic precursor for extreme ultraviolet (EUV) lithography is provided. An organometallic precursor includes an aromatic di-dentate ligand, a transition metal coordinated to the aromatic di-dentate ligand, and an extreme ultraviolet (EUV) cleavable ligand coordinated to the transition metal. The aromatic di-dentate ligand includes a plurality of pyrazine molecules.