Abstract: A chip's interface is selected by using a fuse option coupled between integrated circuitry on the chip and logic circuitry. Fuse options correspond to antifuses or fuses. In one embodiment, a plurality of fuse options are manufactured in an integrated circuit such that a fuse option is coupled between integrated circuitry on the chip and separate and complete logic circuitry for different logic types used to interface a chip. In another embodiment, only one type of logic circuitry is manufactured on a chip, such that the logic circuitry has both a pull-up and pull-down transistor. A fuse is coupled with a pull-up control circuit of the logic circuitry. When the fuse is blown, the output circuit corresponds to GTL-terminated logic circuitry, using only the pull-down transistor. In a further embodiment, an antifuse is coupled with the pull-up control circuit.

Abstract: A memory module, such as a SIMM or DIMM, is provided which incorporates error correction circuitry. The error correction circuitry identifies and corrects errors in communications between the memory module and an external processor. A reliable data processing system is also provided, incorporating the memory module comprising the error correction circuitry with a processor. The yield of manufactured chips is increased by presorting the memory chips which make up the memory module, such that a chip with one or more defective cells may be included in a memory module so long as no other chip has defective cells at the same location.

Abstract: A ferroelectric memory is described which has a memory array arranged in rows and columns. The memory array includes a plate line which is segmented into sub-plate lines which correspond to a row of the memory. The plate line segments have multiple driver circuits coupled thereto for providing a plate line voltage signal. The memory array can include a global plate line coupled to the segments of the segmented plate line via an access switch, or transistor. A global plate line voltage is controlled by multiple plate line driver circuits.

Abstract: A ferroelectric random access memory (RAM) is described which uses ferroelectric memory cells to store data. The ferroelectric memory is a static memory in which data stored in the ferroelectric memory cells can be destroyed during read operations. The memory includes circuitry which latches a current memory address during an access operation and prohibits the memory from moving to a new memory address until the destroyed data has been replaced. The memory also includes circuitry which can detect a transition in address data provided on address inputs.

Abstract: A random access memory circuit is described which uses single ferroelectric memory cells to store data. The ferroelectric memory cells can be selectively read using reference cells to generate a reference voltage which is compared to a voltage representative of data stored on the memory cell using a multiplexed sense amplifier. In using two ferroelectric reference cells in which one contains a logical 0 polarization, and the other contains a logical 1 polarization, a single-ended reference voltage can be generated on a reference bit line. A ferroelectric memory cell can then be read by comparing the voltage on its corresponding bit line to the reference bit line using the sense amplifier. The content of the memory cell being read and the content of the reference cells can be rewritten on the same clock cycles to save on access time.

Abstract: An integrated circuit dynamic memory device is described which stores data in memory cells as a charge on a capacitor. The memory cells have a common cell plate and can be selectively connected to a digit line. Sensing circuitry, including both p-sense and n-sense amplifiers, is connected to the digit line and the cell plate. Equalization circuitry is described to equalize the cell plate and digit line for sensing data stored on a memory cell. Isolation circuitry is described for selectively isolating the sensing circuitry from the memory cells.

Abstract: A low voltage high density memory device is described. The memory device uses isolation transistors to adjust the voltage stored on memory cells. The memory device is designed to reduce the differential voltage between memory cells storing different data states. A method is described for reducing leakage current of the memory cells to decrease the need for excessive refresh operations. The memory device is described as operating on a one volt supply and producing a 250 mv digit line swing.

Abstract: A random access memory circuit uses single ferroelectric memory cells to store data. The ferroelectric memory cells can be selectively read using a reference voltage which is compared to a voltage representative of data stored on the memory cell using a multiplexed sense amplifier. The reference voltage is generated using a non-remnant capacitor circuit coupled to a bit line. In using a non-remnant capacitor circuit, a single-ended reference voltage can be generated on the bit line. The capacitance of the bit line is substantially greater than the capacitance of the non-remnant capacitor, therefore, the resultant reference voltage on the bit line remains relatively constant with fluctuations in supply voltage. A ferroelectric memory cell can then be read by comparing the voltage on its corresponding bit line to the reference voltage using the sense amplifier.

Abstract: A memory circuit is described which increases the density of memory cells by including a reference circuit. The memory circuit has an open digit line architecture where sense amplifiers use two digit lines to sense data stored in the memory cells. One of the digit lines is used as a reference while the other digit line is active. A reference circuit is described which can be used to replace one of the digit lines connected to the sense amplifier circuit. The reference circuit models the electrical characteristics of a digit line by including a capacitor and a transistor, each sized to match the characteristics of a digit line.

Abstract: A synchronous memory device is described which uses unique column select circuitry. The memory device pipelines address decode and column select operation to increase clock frequency. The column select circuitry includes latches and coupling circuits. The latches are used to latch a column select circuit. The coupling circuit isolates a column select signal from the memory cell columns until an enable signal is provided. The address decode can be combined with an enable signal to reduce the total number of latch circuits needed for a bank of memory cells.

Abstract: A memory device includes address, data, and command busses, a bank of memory cells arranged in rows, an address decoder coupled to the address bus and memory bank, a read/write circuit coupled to the address decoder and memory bank, a data input/output circuit coupled to the data bus and read/write circuit, and a control circuit coupled to the command bus, address decoder, read/write circuit, and data input/output circuit. The control circuit implements a self refresh of the memory bank when it receives on the command bus a clock signal having clock edges, a refresh command at a first clock edge, and a column command at a second clock edge that occurs a predetermined number of clock edges after the first clock edge. The predetermined number is small enough so that previous versions of the memory device do not interpret the column command as a separate instruction.

Abstract: An integrated circuit laser antifuse is described which has two physical states. In the first physical state the laser antifuse has to conductive plates electrically separated by a layer of dielectric material. In the second physical state the two conductive plates are electrically connected through the dielectric in response to an external radiation source, such as a laser.

Abstract: A dynamic memory is described which uses a multiplexed latch architecture and global bit lines. The multiplexed architecture allows the memory to operate as a synchronous pipelined cache memory in a computer processing system. The global bit lines are fabricated parallel to memory array bit lines and data input/output connections are distributed around the memory to increase speed. Multiplexed latch circuitry is provided which incorporates separate data paths for both data read and write operations.

Abstract: A random access memory circuit is described which uses single ferroelectric memory cells to store data. The ferroelectric memory cells can be selectively read using reference cells to generate a reference voltage which is compared to a voltage representative of data stored on the memory cell using a multiplexed sense amplifier. In using two ferroelectric reference cells in which one contains a logical 0 polarization, and the other contains a logical 1 polarization, a single-ended reference voltage can be generated on a reference bit line. A ferroelectric memory cell can then be read by comparing the voltage on its corresponding bit line to the reference bit line using the sense amplifier. The content of the memory cell being read and the content of the reference cells can be rewritten on the same clock cycles to save on access time.

Abstract: A memory circuit is described which increases the density of memory cells by including a reference circuit. The memory circuit has an open digit line architecture where sense amplifiers use two digit lines to sense data stored in the memory cells. One of the digit lines is used as a reference while the other digit line is active. A reference circuit is described which can be used to replace one of the digit lines connected to the sense amplifier circuit. The reference circuit models the electrical characteristics of a digit line by including a capacitor and a transistor, each sized to match the characteristics of a digit line.

Abstract: An integrated circuit dynamic memory device is described which stores data in memory cells as a charge on a capacitor. The memory cells have a common cell plate and can be selectively connected to a digit line. Sensing circuitry, including both p-sense and n-sense amplifiers, is connected to the digit line and the cell plate. Equalization circuitry is described to equalize the cell plate and digit line for sensing data stored on a memory cell. Isolation circuitry is described for selectively isolating the sensing circuitry from the memory cells.

Abstract: An integrated circuit dynamic memory device is described which stores data in memory cells as a charge on a capacitor. The memory cells can be selectively connected to a digit line. Sensing circuitry, including both p-sense and n-sense amplifiers, is connected to the digit line for sensing data stored in the memory cells. Equalization circuitry is described to equalize the sense amplifiers by connecting both nodes of the sense amplifiers to the digit line prior to sensing data stored on the memory cell.

Abstract: A ferroelectric random access memory (RAM) is described which uses ferroelectric memory cells to store data. The ferroelectric memory is a static memory in which data stored in the ferroelectric memory cells can be destroyed during read operations. The memory includes circuitry which latches a current memory address during an access operation and prohibits the memory from moving to a new memory address until the destroyed data has been replaced. The memory also includes circuitry which can detect a transition in address data provided on address inputs.

Abstract: A static ferroelectric memory circuit is described which has an array of ferroelectric memory cells fabricated as single capacitors using a ferroelectric dielectric and arranged as a static random access memory (SRAM). Data can be stored in a non-volatile manner on the memory cells by controlling the voltage placed upon the plates of the cell. A method is described for operating the ferroelectric memory as a dynamic random access memory (DRAM). Test methods are described for testing the memory cells and identifying whether a defect is result of a ferroelectric material defect or a physical defect, such as a short, open or high leakage.

Abstract: A random access memory circuit is described which uses single ferroelectric memory cells to store data. The ferroelectric memory cells can be selectively read using a reference voltage which is compared to a voltage representative of data stored on the memory cell using a multiplexed sense amplifier. The reference voltage is generated using a non-remnant capacitor circuit coupled to a bit line. In using a non-remnant capacitor circuit, a single-ended reference voltage can be generated on the bit line. The capacitance of the bit line is substantially greater than the capacitance of the non-remnant capacitor, therefore, the resultant reference voltage on the bit line remains relatively constant with fluctuations in supply voltage. A ferroelectric memory cell can then be read by comparing the voltage on its corresponding bit line to the reference voltage using the sense amplifier.