Abstract: Provided is an anti-glare film excellent in anti-glare properties and capable of suppressing reflected scattered light. The anti-glare film includes an anti-glare layer, the anti-glare film having an uneven surface, wherein for an amplitude spectrum of elevation of the uneven surface, when a sum of amplitudes corresponding to spatial frequencies of 0.005 ?m?1, 0.010 ?m?1, and 0.015 ?m?1 is defined as AM1 and an amplitude at a spatial frequency of 0.300 ?m?1 is defined as AM2, AM1 is 0.070 ?m or more and 0.400 ?m or less, AM2 is 0.0050 ?m or more, and AM2<AM1.

Abstract: A thermally-conductive two-part addition-curable silicone composition including a first liquid and a second liquid and a method of producing the same. The first liquid includes a heat-treated mixture including an organopolysiloxane having two or more alkenyl groups and aluminum oxide having Na+ ion content equal to or lower than 100 ppm, a platinum-group metal catalyst, and an ion-trapping agent of a cation-exchange type and/or a cation-and-anion-exchange type. The second liquid includes a heat-treated mixture including an organopolysiloxane having two or more alkenyl groups, an organohydrogenpolysiloxane having three or more SiH groups, aluminum oxide having Na+ ion content equal to or lower than 100 ppm, and an organohydrogenpolysiloxane having two SiH groups.

Abstract: A thermally conductive addition-curable silicone composition includes: a heat-treated mixture including (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a silicon atom in one molecule, and (C) aluminum oxide; (D) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (E) a platinum-based metal catalyst; and (F) a cation-exchange type and/or both-ions-exchange type ion trap agent. A thermally conductive addition-curable silicone composition can be applied on electric and electronic components and in a module including a circuit substrate mounting these components thereon and can exhibit excellent stress relaxation property and thermal conductivity after cured. In addition, a method for producing the same.

Abstract: The epoxy resin composition for a prepreg according to an embodiment of the present invention contains (A) an epoxy resin, (B) a curing agent or a curing accelerator, (C) silica microparticles, and (D) core-shell rubber particles, the epoxy resin composition containing from 1 to 5 parts by mass of (C) the silica microparticles and from 2 to 10 parts by mass of (D) the core-shell rubber particles per 100 parts by mass of (A) the epoxy resin, and a mass ratio of (C) the silica microparticles to (D) the core-shell rubber particles, in terms of (C)/(D), being from 1/1 to 1/5.

Abstract: A thermal conductive silicone composition includes: (A) an organopolysiloxane having kinematic viscosity at 25° C. of 10 to 100,000 mm2/s; (B) a hydrolysable organopolysiloxane containing an alkoxysilyl group; (C) a heat conductive filler with average particle size of 4 to 30 ?m containing a coarse particle with particle size of 45 ?m or more in an amount of 0.5 mass % or less in the entire component (C), and an irregular-shaped zinc oxide particle in an amount of 40 to 90 mass % in the entire composition; and (D) an irregular-shaped zinc oxide particle having average particle size of 0.01 to 2 ?m in an amount of 1 to 50 mass % in the entire composition, wherein the thermal conductivity of the silicone composition is 2.0 W/m·K or more and less than 7.0 W/m·K, and the viscosity at 25° C. is 5 to 800 Pa·s.

Abstract: This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.

Abstract: This highly thermally-conductive silicone composition is obtained by blending, as thermally-conductive fillers at a specific ratio and in specific amounts in (A) a silicone composition containing an organopolysiloxane as a main agent, (B) a spherical magnesium oxide powder having an average sphericity of 0.8 or more, an average particle size of 80-150 ?m, and a purity of 98 mass % or more, and (C) (C-I) a spherical aluminum oxide powder which has an average sphericity of 0.8 or more and an average particle size of 7-60 ?m, and in which the proportion of rough particles of 96-150 ?m is 0.1-30 mass % in the entire component (C-I) in a laser diffraction particle size distribution, and (C-II) a spherical or irregularly-shaped aluminum oxide powder having an average particle size of 0.1-4 ?m. The thermal conductivity of the composition is 7.0 W/m·K or more, and the viscosity of the composition at 25° C. is 30-800 Pa·s.

Abstract: In an epoxy resin composition, per 100 parts by mass of an epoxy resin component containing from 60 to 85 parts by mass of N,N,N?,N?-tetraglycidyldiaminodiphenylmethane resin (A) having a viscosity at 50° C. of 6000 mPa·s or less and from 15 to 40 parts by mass of a liquid bisphenol A epoxy resin (B) having a viscosity at 25° C. of 20000 mPa·s or less, from 8 to 15 parts by mass of a thermoplastic resin (C), from 2 to 10 parts by mass of elastomer microparticles (D) having an average particle diameter of 1000 nm or less, and from 0.5 to 2.5 parts by mass of silica microparticles (E) having an average particle diameter of 1000 nm or less are blended.

Abstract: A glass fiber fabric is impregnated with a colored resin having an opacifying property, a colored resin layer formed from the colored resin is provided on a first face of the glass fiber fabric, a transparent resin layer becoming transparent after being cured is provided on a second face of the glass fiber fabric, and thus a prepreg is formed.

Abstract: With respect to an addition-curable thermally conductive silicone composition in which a silver filler is blended, a catalyst having a specific structure and an organohydrogen polysiloxane having a specific structure are used for the purpose of extending the working life at room temperature, while maintaining the flexibility, so that a thermally conductive silicone composition which is able to have a good balance between flexibility after curing and storage stability in one pack, while having extremely low thermal resistance and excellent reliability is achieved.

Abstract: Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 ?m is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 ?m is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m·K or more and less than 5.

Abstract: With respect to an addition-curable thermally conductive silicone composition in which a silver filler is blended, a catalyst having a specific structure and an organohydrogen polysiloxane having a specific structure are used for the purpose of extending the working life at room temperature, while maintaining the flexibility, so that a thermally conductive silicone composition which is able to have a good balance between flexibility after curing and storage stability in one pack, while having extremely low thermal resistance and excellent reliability is achieved.

Abstract: A low heat resistance silicone composition, including: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) an ?-aluminum oxide powder, ?-aluminum oxide having a specific crystal structure and a particle shape with a D/H ratio in the predetermined range when a maximum particle diameter parallel to a hexagonal lattice face of the hexagonal close-packed lattice is taken as D and a particle diameter perpendicular to the hexagonal lattice face is taken as H, and the ?-aluminum oxide powder having a specific average particle diameter, a specific content of coarse particles, and a specific purity; and (D) a spherical and/or irregular-shaped zinc oxide powder having a specific average particle diameter, and a specific content of coarse particles, in which the low heat resistance silicone composition has a specific heat conductivity and a specific viscosity.

Abstract: In an epoxy resin composition, per 100 parts by mass of an epoxy resin component containing from 60 to 85 parts by mass of N,N,N?,N?-tetraglycidyldiaminodiphenylmethane resin (A) having a viscosity at 50° C. of 6000 mPa·s or less and from 15 to 40 parts by mass of a liquid bisphenol A epoxy resin (B) having a viscosity at 25° C. of 20000 mPa·s or less, from 8 to 15 parts by mass of a thermoplastic resin (C), from 2 to 10 parts by mass of elastomer microparticles (D) having an average particle diameter of 1000 nm or less, and from 0.5 to 2.5 parts by mass of silica microparticles (E) having an average particle diameter of 1000 nm or less are blended.

Abstract: Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 ?m is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 ?m is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m·K or more and less than 5.

Abstract: A cyanate ester resin composition contains: a cyanate ester resin; a curing agent or a curing accelerator; silica microparticles; and core-shell rubber particles; in which the resin composition includes from 1 to 5 parts by mass of the silica microparticles and from 2 to 10 parts by mass of the core-shell rubber particles based on 100 parts by mass of the cyanate ester resin, and a mass ratio of the silica microparticles to the core-shell rubber particles is from 1/1 to 1/5.

Abstract: A cyanate ester resin composition contains: a cyanate ester resin; a curing agent or a curing accelerator; silica microparticles; and core-shell rubber particles; in which the resin composition includes from 1 to 5 parts by mass of the silica microparticles and from 2 to 10 parts by mass of the core-shell rubber particles based on 100 parts by mass of the cyanate ester resin, and a mass ratio of the silica microparticles to the core-shell rubber particles is from 1/1 to 1/5.

Abstract: A low heat resistance silicone composition, including: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) an ?-aluminum oxide powder, ?-aluminum oxide having a specific crystal structure and a particle shape with a D/H ratio in the predetermined range when a maximum particle diameter parallel to a hexagonal lattice face of the hexagonal close-packed lattice is taken as D and a particle diameter perpendicular to the hexagonal lattice face is taken as H, and the ?-aluminum oxide powder having a specific average particle diameter, a specific content of coarse particles, and a specific purity; and (D) a spherical and/or irregular-shaped zinc oxide powder having a specific average particle diameter, and a specific content of coarse particles, in which the low heat resistance silicone composition has a specific heat conductivity and a specific viscosity.

Abstract: Provided is a one-liquid-type thermosetting heat-conductive silicone grease composition which initially has low viscosity but high shape retention, which becomes soft after heat-curing, which has good adhesion to a substrate, and which can be stored at room temperature. Also provided is a method for producing a cured product of said composition. This one-liquid-type thermosetting heat-conductive silicone grease composition comprises, as essential components, (A) an alkenyl-group-containing organopolysiloxane having a viscosity at 25° C. of 50-100,000 mPa·s, (B) a liquid organohydrogenpolysiloxane having a viscosity at 25° C. of 100 mPa·s or less, having 2-10 Si—H groups and an alkoxy group and/or an epoxy group, having a degree of polymerization of 15 or less, and having a polysiloxane backbone including a cyclic structure, (C) a specific photoactive platinum complex curing catalyst, and (D) a heat-conductive filler having a heat conductivity of 10 W/m·° C.

Abstract: The present technology provides an epoxy resin composition for a fiber-reinforced composite material, a method for producing an epoxy resin composition for a fiber-reinforced composite material, a prepreg, and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present technology contains: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin containing a phosphorus atom in the backbone thereof, and not less than 5 parts by mass and not greater than 20 parts by mass of an amino-terminated butadiene-acrylonitrile rubber; an epoxy resin other than the phosphorus-containing epoxy resin; a curing agent; and a curing accelerator.