Abstract: Addition one-part curing-type heat-conductive silicone grease composition containing: (A) an organopolysiloxane containing at least one alkenyl group per molecule and having a viscosity of 50-100,000 mPa·s at 25° C.; (B) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule, having no R2SiO unit, having no silicon-bonded hydrogen atom at any terminal end, having the silicon-bonded hydrogen atoms only in a side chain or chains, and being in a substantially straight chain form, in an amount such that the ratio of {the number of Si—H groups}/{the number of alkenyl groups in the composition} is 0.1-5.0; (C) a photoactive-type platinum complex curing catalyst; and (D) a heat-conductive filler, wherein the composition has a viscosity at 25° C. of 30-800 Pa·s as measured by a Malcom viscometer at a rotational speed of 10 rpm. The composition has high shape-retention properties, is low in hardness, and can be stored at normal temperature.

Abstract: Provided is a one-pack type ultraviolet-thickable thermally conductive silicone grease composition which, at the initial stage, has a low viscosity (is easy to apply) but has high shape retentivity and which, after curing, is pliable (has low hardness). The ultraviolet-thickable thermally conductive silicone grease composition comprises, as essential components, (A) an organopolysiloxane having a viscosity at 25° C. of 50-100,000 mPa·s and containing at least one alkenyl group in the molecule, (B) a liquid organohydrogenpolysiloxane which has a viscosity at 25° C.

Abstract: The present technology provides an epoxy resin composition for a fiber-reinforced composite material, a method for producing an epoxy resin composition for a fiber-reinforced composite material, a prepreg, and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present technology contains: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin containing a phosphorus atom in the backbone thereof, and not less than 5 parts by mass and not greater than 20 parts by mass of an amino-terminated butadiene-acrylonitrile rubber; an epoxy resin other than the phosphorus-containing epoxy resin; a curing agent; and a curing accelerator.

Abstract: A UV-thickening thermally conductive silicone grease composition: which has (A) an organopolysiloxane, the viscosity at 25° C. of which is 50-100,000 mPa·s and which contains at least one alkenyl group in a single molecule, (B) an organohydrogenpolysiloxane, a single molecule of which contains a hydrogen atom directly bonded to at least two silicon atoms, (C) a photoactive platinum complex curing catalyst, and (D) a thermally conductive filler with a thermal conductivity of at least 10 W/m·° C. as essential components; and the viscosity at 25° C. of which is 30-800 Pa·s when measured at a 10 rpm rotation rate using a Malcom viscometer. For this UV-thickening thermally conductive silicone grease composition, shape-retaining properties at low viscosity are high, deep curing properties can be adjusted using the UV irradiation dose, and the composition after being thickened by irradiating UV rays does not become hard but sets so as to be malleable.

Abstract: The present invention provides an addition-curable silicone composition comprising: (A) a linear organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups and CF3—(CF2)y—(CH2)z— groups; (B) an organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups and CF3—(CF2)y—(CH2)z— groups, and having a branched structure represented by SiO4/2 and RSiO3/2; (C) an organosilicon compound having silicon atom-bonded hydrogen atoms and represented by the following general formula (1); and (D) a platinum group metal-based catalyst. There can be provided an addition-curable silicone composition that provides a cured product having low refractive index, high transparency, excellent light extraction efficiency, good rubber properties and strength properties, and no tack after curing, and in particular, has good transmittance of light with a wavelength of 400 nm at 25° C.

Abstract: Disclosed herein is an addition one part curing type heat-conductive silicone grease composition contains, as indispensable components: (A) an organopolysiloxane containing at least one alkenyl group per molecule and having a viscosity of 50 mPa•s to 100,000 mPa•s at 25° C.; (B) an organohydrogenpolysiloxane which contains at least two silicon-bonded hydrogen atoms per molecule, which has no R2SiO unit, which has no silicon-bonded hydrogen atom at any terminal end, which has the silicon-bonded hydrogen atoms only in a side chain or chains, and which is in a substantially straight chain form, in an amount such that the ratio of {the number of Si-H groups}/{the number of alkenyl groups in the composition} is in the range from 0.1 to 5.0; (C) a photoactive type platinum complex curing catalyst; and (D) a heat-conductive filler, wherein the composition has a viscosity at 25° C. of 30 Pa•s to 800 Pa•s as measured by a Malcom viscometer at a rotational speed of 10 rpm.

Abstract: A silicone adhesive used for bonding semiconductor device, containing (A) addition reaction-curable silicone resin composition having viscosity at 25° C. of 100 Pa·s or less, (B) thermal conductive filler having average particle size of 0.1 ?m or more and less than 1 ?m, and (C) solvent having boiling point of 250° C. or higher and lower than 350° C., wherein component (B) is contained in an amount of 100 to 500 parts by mass based on 100 parts by mass of component (A), component (C) is contained in an amount of 5 to 20 parts by mass based on 100 parts by mass of component (A), and silicone adhesive uncured has viscosity at 25° C. of 5 to 100 Pa·s. Thus, silicone adhesive has good workability in transferring method to substrate, and is capable of providing cured product that can effectively dissipate heat generated from chip and exhibits high adhesiveness and durability.

Abstract: A thermally conductive silicone adhesive composition for a reactor, having good fluidity even when containing a large amount of thermally conductive filler to obtain a thermally conductive silicone adhesive composition, permitting potting of fine substrates, having good properties after curing, having little change in properties even with heat or moist-heat aging, and giving good adhesiveness to metals and organic resins, and a reactor potted by this composition, can be provided by making a thermally conductive silicone adhesive composition having a viscosity of 100 mPa·s at 25° C. and containing a liquid organohydrogenpolysiloxane having 2-10 hydrogen atoms bonded with silicon atoms in the molecule, containing no alkoxy groups, having at least one epoxy group bonded with a silicon atom via an alkylene group, having a polysiloxane degree of polymerization of 15 or lower, and containing a polysiloxane skeleton having a cyclic structure.

Abstract: The present technology is an epoxy resin composition for a fiber-reinforced composite material comprising a phosphorus-containing epoxy resin containing phosphorus in the skeleton thereof, a dicyandiamide, and a curing promoter containing at least one selected from 1,1?-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by the following formula (1), and methylene-diphenyl-bisdimethylurea represented by the following formula (2); wherein the phosphorus content of the phosphorus-containing epoxy resin is at least 1.0 mass % and at most 5.0 mass % in the epoxy resin composition.

Abstract: A thermally conductive silicone adhesive composition for a reactor, having good fluidity even when containing a large amount of thermally conductive filler to obtain a thermally conductive silicone adhesive composition, permitting potting of fine substrates, having good properties after curing, having little change in properties even with heat or moist-heat aging, and giving good adhesiveness to metals and organic resins, and a reactor potted by this composition, can be provided by making a thermally conductive silicone adhesive composition having a viscosity of 100 mPa·s at 25° C. and containing a liquid organohydrogenpolysiloxane having 2-10 hydrogen atoms bonded with silicon atoms in the molecule, containing no alkoxy groups, having at least one epoxy group bonded with a silicon atom via an alkylene group, having a polysiloxane degree of polymerization of 15 or lower, and containing a polysiloxane skeleton having a cyclic structure.

Abstract: The present invention provides an addition-curable silicone composition comprising: (A) a linear organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups and CF3—(CF2)y—(CH2)z— groups; (B) an organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups and CF3—(CF2)y—(CH2)z— groups, and having a branched structure represented by SiO4/2 and RSiO3/2; (C) an organosilicon compound having silicon atom-bonded hydrogen atoms and represented by the following general formula (1); and (D) a platinum group metal-based catalyst. There can be provided an addition-curable silicone composition that provides a cured product having low refractive index, high transparency, excellent light extraction efficiency, good rubber properties and strength properties, and no tack after curing, and in particular, has good transmittance of light with a wavelength of 400 nm at 25° C.

Abstract: The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises: (A) (A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1), (B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group, (C) a hydrosilylation catalyst containing a platinum group metal, and (D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 ?m based on 100 parts by mass of the total Components (A) and (B). Thereby, there can be provided a curable silicone resin composition having high light extraction efficiency and useful as, for example, an encapsulant, a cured product thereof and a photosemiconductor apparatus.

Abstract: An object of the present invention is to provide a thermosetting resin composition having superior toughness. The thermosetting resin composition of the present invention includes a thermosetting resin, and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler, wherein an adsorption coefficient that is greater than 0 and less than or equal to 0.8, defined by Formula 1 is satisfied. Formula 1: Adsorption coefficient={Amount (parts by mass) of the thermoplastic resin C adsorbed on 100 parts by mass of the filler/specific gravity of the thermoplastic resin C}/DBP oil absorption (mL/100 g) of the filler.

Abstract: The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises: (A) (A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1), (B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group, (C) a hydrosilylation catalyst containing a platinum group metal, and (D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 ?m based on 100 parts by mass of the total Components (A) and (B). Thereby, there can be provided a curable silicone resin composition having high light extraction efficiency and useful as, for example, an encapsulant, a cured product thereof and a photosemiconductor apparatus.

Abstract: An intraoral camera including a main body case, an intraoral insertion component mounted on the front side of the main body case, an imaging window provided to the intraoral insertion component, and an imaging device that is optically linked to the imaging window and is disposed inside the main body case or inside the intraoral insertion component. Illumination elements are disposed at portions of an outer peripheral wall face that are substantially opposite each other in the horizontal direction. These illumination elements are inclined toward the outside of the imaging window in the center of the imaging window, and the outer peripheral wall face that is substantially opposite these illumination elements in the vertical direction is constituted as a light collecting face that is inclined toward the outside of the imaging window in the center of the imaging window.

Abstract: An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: (A) a linear organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule; (B) an organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule and having a branch structure of a siloxane unit represented by an SiO4/2 and/or an RSiO3/2; (C) an organosilicon compound represented by the following general formula (1); and (D) a platinum group metal-based catalyst.

Abstract: The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises: (A) (A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1), (B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group, (C) a hydrosilylation catalyst containing a platinum group metal, and (D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 ?m based on 100 parts by mass of the total Components (A) and (B). Thereby, there can be provided a curable silicone resin composition having high light extraction efficiency and useful as, for example, an encapsulant, a cured product thereof and a photosemiconductor apparatus.

Abstract: An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: (A) a linear organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule; (B) an organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule and having a branch structure of a siloxane unit represented by an SiO4/2 and/or an RSiO3/2; (C) an organosilicon compound represented by the following general formula (1); and (D) a platinum group metal-based catalyst.

Abstract: The present technology is an epoxy resin composition for a fiber-reinforced composite material comprising a phosphorus-containing epoxy resin containing phosphorus in the skeleton thereof, a dicyandiamide, and a curing promoter containing at least one selected from 1,1?-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by the following formula (1), and methylene-diphenyl-bisdimethylurea represented by the following formula (2); wherein the phosphorus content of the phosphorus-containing epoxy resin is at least 1.0 mass % and at most 5.0 mass % in the epoxy resin composition.

Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.