Abstract: The present invention provides a substrate for an optical semiconductor apparatus for mounting optical semiconductor devices, the substrate includes first leads to be electrically connected to first electrodes of the optical semiconductor devices and second leads to be electrically connected to second electrodes of the optical semiconductor devices, wherein the first leads and the second leads are arranged each in parallel, a molded body of a thermosetting resin composition is molded in a penetrating gap between the first leads and the second leads, a reflector of the thermosetting resin composition is molded at a periphery of respective regions on which the optical semiconductor devices are to be mounted, and the resin molded body and the reflector are integrally molded with the first leads and the second leads by injection molding.

Abstract: The present invention provides a substrate for an optical semiconductor apparatus for mounting optical semiconductor devices, the substrate comprising first leads to be electrically connected to first electrodes of the optical semiconductor devices and second leads to be electrically connected to second electrodes of the optical semiconductor devices, wherein the first leads and the second leads are arranged each in parallel, a molded body of a thermosetting resin composition is molded by injection molding in a penetrating gap between the first leads and the second leads such that the substrate is formed in a plate shape, and an exposed front surface and an exposed back surface of the first leads, the second leads and the resin molded body each tie in a same plane. The substrate exhibits excellent heat dissipation properties and enables manufacture of a thin optical semiconductor apparatus with a low cost.

Abstract: An object of the present invention is to provide a thermosetting resin composition having superior toughness. The thermosetting resin composition of the present invention includes a thermosetting resin, and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler, wherein an adsorption coefficient that is greater than 0 and less than or equal to 0.8, defined by Formula 1 below, is satisfied. Adsorption coefficient=Amount(parts by mass)of the thermoplastic resin C adsorbed on 100 parts by mass of the filler/specific gravity of the thermoplastic resin C/DBP oil absorption(mL/100 g)of the filler.

Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1 to 20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150° C., per 100 parts by weight of an epoxy resin (A).

Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing: an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90° C.; thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90° C. and has a softening point of not less than 120° C.; and a curing agent (D).

Abstract: A method of reducing a surface glossiness of an organopolysiloxane-cured article is provided. The method comprises preparing the liquid organopolysiloxane composition for matting comprising: (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition having a specific gravity larger than the component (B), and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., and a particle size of up to 200 ?m, casting the liquid organopolysiloxane composition as a potting material or coating material; and curing the liquid organopolysiloxane composition at a temperature of 10 to 160 C for 30 to 180 minutes, whereby the hollow filler floats to the surface of the organopolysiloxane and forms surface irregularities on the surface of the cured article during curing to provide a surface glossiness of up to 40 in a cured article having a matted surface.

Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which is improved in toughness necessary for improving the strength of self-adhesion of a matrix resin for use in a prepreg for a face sheet of a honeycomb panel. The epoxy resin composition, which comprises: an epoxy resin (A); a thermoplastic resin (B); fine solid resin particles (C); and a curing agent (D), is characterized in that the epoxy resin composition after being cured has a morphology in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases, and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) in the co-continuous phases.

Abstract: A flare nut includes a nut main body having a outer surface and a circular cylinder portion provided so as to extend from the nut main body to one opening end of an insertion hole along the insertion hole in a circular cylindrical shape having a major diameter smaller than the nut main body.

Abstract: The intraoral camera of the present invention comprises a main body case (1), an intraoral insertion component (3) mounted on the front side of the main body case (1), an imaging window (3a) provided to the intraoral insertion component (3), and an imaging device (10) that is optically linked to the imaging window (3a) and is disposed inside the main body case (1) or inside the intraoral insertion component (3). Illumination elements (9) are disposed at portions of an outer peripheral wall face (17) that are substantially opposite each other in the horizontal direction. These illumination elements (9) are inclined toward the outside of the imaging window in the center of the imaging window (3a), and the outer peripheral wall face (17) that is substantially opposite these illumination elements (9) in the vertical direction is constituted as a light collecting face that is inclined toward the outside of the imaging window in the center of the imaging window (3a).

Abstract: A droplet applying apparatus includes a base 11 having a mounting surface 11a on which a substrate 10 is to be mounted, beam members 41, 42 which are fitted to the base 11 so as to be movable relative to the base 11 in the arrow A direction, a plurality of droplet ejecting sections 6 which are fitted to the beam members 41, 42 so as to be movable in the arrow B direction and which eject droplets to the substrate 10 mounted on the mounting surface 11a, reference members each of which is provided at a site of the beam members 41, 42 proximate to the ejecting surface of each droplet ejecting section 6 and whose distance to the mounting surface 11a is known, a distance measuring section 14 for measuring a distance to the ejecting surface of each droplet ejecting section 6 and a distance to each reference member, and a calculation section 15 for, based on a distance between the ejecting surface of the one droplet ejecting section 6 and the distance measuring section 14 as well as a distance between the one referen

Abstract: A method of reducing a surface glossiness of an organopolysiloxane-cured article is provided. The method comprises preparing the liquid organopolysiloxane composition for matting comprising: (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition having a specific gravity larger than the component (B), and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., and a particle size of up to 200 ?m, casting the liquid organopolysiloxane composition as a potting material or coating material; and curing the liquid organopolysiloxane composition at a temperature of 10 to 160 C for 30 to 180 minutes, whereby the hollow filler floats to the surface of the organopolysiloxane and forms surface irregularities on the surface of the cured article during curing to provide a surface glossiness of up to 40 in a cured article having a matted surface.

Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.

Abstract: A droplet applying apparatus includes a base 11 having a mounting surface 11a on which a substrate 10 is to be mounted, beam members 41, 42 which are fitted to the base 11 so as to be movable relative to the base 11 in the arrow A direction, a plurality of droplet ejecting sections 6 which are fitted to the beam members 41, 42 so as to be movable in the arrow B direction and which eject droplets to the substrate 10 mounted on the mounting surface 11a, reference members each of which is provided at a site of the beam members 41, 42 proximate to the ejecting surface of each droplet ejecting section 6 and whose distance to the mounting surface 11a is known, a distance measuring section 14 for measuring a distance to the ejecting surface of each droplet ejecting section 6 and a distance to each reference member, and a calculation section 15 for, based on a distance between the ejecting surface of the one droplet ejecting section 6 and the distance measuring section 14 as well as a distance between the one referen

Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1 to 20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150° C., per 100 parts by weight of an epoxy resin (A).

Abstract: A liquid silicone rubber coating composition comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl radicals, (B) an organohydrogenpolysiloxane containing at least two SiH radicals, (C) an addition reaction catalyst, optionally (D) finely divided silica, (E) triallyl isocyanurate, (F) an organosilicon compound containing an epoxy radical and a silicon-bonded alkoxy radical, and (G) a titanium or zirconium compound is coated on a surface of an airbag base fabric and cured to form a rubber coating layer thereon. The composition is suited for curtain airbags.

Abstract: The droplet applying apparatus includes a base 11 having a mounting surface 11a on which a substrate 10 is to be mounted, beam members 41, 42 which are fitted to the base 11 so as to be movable relative to the base 11 in an arrow A direction, a plurality of droplet ejecting sections 6 which are fitted to the beam members 41, 42 so as to be movable in an arrow B direction and which eject droplets to the substrate 10, and a control section 13 for controlling movement or stop of the plurality of droplet ejecting sections 6. The control section 13, during ejection operation of one of the droplet ejecting sections 6, performs such control as to effectuate gentle acceleration changes in speed changes of the other droplet moving ejecting section proximate to the one droplet ejecting section 6 while the movable other droplet ejecting section.

Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which is improved in toughness necessary for improving the strength of self-adhesion of a matrix resin for use in a prepreg for a face sheet of a honeycomb panel. The epoxy resin composition, which comprises: an epoxy resin (A); a thermoplastic resin (B); fine solid resin particles (C); and a curing agent (D), is characterized in that the epoxy resin composition after being cured has a morphology in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases, and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) in the co-continuous phases.

Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90° C.; thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90° C. and has a softening point of not less than 120° C.; and a curing agent (D).

Abstract: A silicone rubber composition for sealing a stitched air bag, wherein the composition exhibits excellent adhesion to cured silicone rubber. A silicone rubber composition for sealing a stitched air bag, in which the composition is used as a sealing material at those sections of a silicone rubber-treated base fabric that are superimposed with the treated surfaces facing each other and then stitched together to form a bag shape during formation of the air bag, and comprises: (A) an organopolysiloxane containing at least two alkenyl groups bonded to silicon atoms within each molecule, (B) a straight-chain organohydrogenpolysiloxane containing SiH groups only at the molecular chain terminals, (C) an organohydrogenpolysiloxane containing at least three SiH groups within each molecule, (D) a finely powdered silica, and (E) a platinum group metal-based catalyst, wherein the total quantity of all SiH groups within the components (B) and (C) is within a range from 0.

Abstract: A curable organopolysiloxane composition is provided, which is capable of generating a silicone rubber mother mold with improved mold release durability. The composition includes (A) 100 parts by mass of an organopolysiloxane containing at least two Si-bonded alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane containing at least two Si-bonded hydrogen atoms atoms within each molecule, in sufficient quantity to provide 0.4 to 5.0 mols of Si-bonded hydrogen atoms within the component (B) for each 1 mol of Si-bonded alkenyl groups within the composition, (C) 5 to 50 parts by mass of a finely powdered silica with a specific surface area measured by nitrogen gas absorption of at least 50 m2/g, (D) 0.1 to 50 parts by mass of heavy calcium carbonate with a specific surface area measured by air permeability of 0.5 to 2.5 m2/g, the surface of which has been treated with a paraffin-based compound, and (E) an effective quantity of a platinum group metal-based catalyst.