Abstract: A method of programming a flash memory includes programming memory cells connected to a selected word line by applying a first voltage to the selected word line and a second voltage to non-selected word lines, the second voltage being lower than the first voltage, lowering the first voltage of the selected word line to a third voltage after programming the memory cells connected to the selected word line, the third voltage being lower than the first voltage, and recovering a fourth voltage of the selected word line and the non-selected word lines, the fourth voltage being lower than the second and third voltages.

Abstract: A flash memory device which includes a memory cell array which stores data and trim information, and control logic which controls programming, erasing, and reading modes of the memory cell array. The control logic is operative to receive the trim information from the memory cell array in a power-up mode, and to optimize operational time periods of the programming, erasing, and reading modes in accordance with the trim information.

Abstract: The present invention relates to a method for forming a metal silicon nitride film according to a cyclic film deposition under plasma atmosphere with a metal amide, a silicon precursor, and a nitrogen source gas as precursors. The deposition method for forming a metal silicon nitride film on a substrate comprises steps of: pulsing a metal amide precursor; purging away the unreacted metal amide; introducing nitrogen source gas into reaction chamber under plasma atmosphere; purging away the unreacted nitrogen source gas; pulsing a silicon precursor; purging away the unreacted silicon precursor; introducing nitrogen source gas into reaction chamber under plasma atmosphere; and purging away the unreacted nitrogen source gas.

Abstract: A NAND flash memory device and a programming method thereof capable of improving a program speed during a multi-level cell programming operation are provided. The device performs a programming operation using an ISPP method. Additionally, the device includes a memory cell storing multi-bit data; a program voltage generating circuit generating a program voltage to be supplied to the memory cell; and a program voltage controller controlling a start level of the program voltage. The device supplies an LSB start voltage to a selected word line during an LSB program, and an MSB start voltage higher than the LSB start voltage to the selected word line during an MSB program.

Abstract: Non-volatile memory devices and operating methods thereof are provided. In an operating method, a first operation is performed by applying a first voltage to at least one word line. The first operation includes one of a programming or erasing operation. The first operation is verified by applying a verify voltage to each of the at least one word lines. The voltage level of each verify voltage is determined according to position information of a corresponding one of the at least one word lines.

Abstract: A flash memory device which comprises a memory cell array having memory cells arranged in rows and columns; a word line voltage generator circuit configured to generate a program voltage, a dielectric breakdown prevention voltage, and a pass voltage at a program operation; and a row selector circuit that receives the program voltage, the dielectric breakdown prevention voltage, and the pass voltage and selecting one of the rows in response to a row address. The dielectric breakdown prevention voltage is lower than the program voltage and higher than the pass voltage; and the row selector circuit drives the selected row with the program voltage, drives at least one row just adjacent to, or neighboring, the selected row with the dielectric breakdown prevention voltage and drives remaining rows with the pass voltage.

Abstract: A NAND flash memory device and a programming method thereof capable of improving a program speed during a multi-level cell programming operation are provided. The device performs a programming operation using an ISPP method. Additionally, the device includes a memory cell storing multi-bit data; a program voltage generating circuit generating a program voltage to be supplied to the memory cell; and a program voltage controller controlling a start level of the program voltage. The device supplies an LSB start voltage to a selected word line during an LSB program, and an MSB start voltage higher than the LSB start voltage to the selected word line during an MSB program.

Abstract: Disclosed herein is a method for high-yield production of Schizophyllum commune-derived beta-glucan having a homogeneous composition, comprising subjecting mycelia of Schizophyllum commune to liquid culture with an addition of a synthetic adsorbent, and a composition for external application comprising the beta-glucan produced therefrom, which is capable of relieving dry skin conditions, atopic diseases and itching.

Abstract: In one aspect, a non-volatile memory device includes a non-volatile memory cell array and a page buffer. The page buffer includes a sense node selectively connected to a bit line of the memory cell array, a main latch circuit including first and second main latch nodes, where the first main latch node is selectively connected to the sense node, and a latch input node selectively connected to the first and second main latch nodes. The page buffer further includes a cache latch circuit including first and second cache latch nodes, a switching circuit which selectively connects the second cache latch node to the latch input node, and a shared sense circuit connected between to the latch input node and a reference potential. The shared sense circuit selectively connects the latch input node to the reference potential in response to a voltage of the sense node and a voltage of the first cache latch node.

Abstract: A flash memory device which comprises a memory cell array having memory cell arranged in rows and columns; a word line voltage generator circuit configured to generate a program voltage, a dielectric breakdown prevention voltage, and a pass voltage at a program operation; and a row selector circuit that receives the program voltage, the dielectric breakdown prevention voltage, and the pass voltage and selecting one of the rows in response to a row address. The dielectric breakdown prevention voltage is lower that the program voltage and higher than the pass voltage; and the row selector circuit drives the selected row with the program voltage, drives at least one row just adjacent to, or neighboring, the selected row with the dielectric breakdown prevention voltage and drives remaining rows with the pass voltage.

Abstract: A wordline voltage generation circuit generates an incremental step pulse voltage and includes a first circuit unit connected to a program voltage, a second circuit unit connected between the first circuit unit and a divided voltage and controlled by a program step code, and a third circuit unit connected between the divided voltage and a ground voltage. An increment of the program voltage is set according to a resistance of the third circuit unit without a change in the program step code. The first circuit unit is symmetrical in structure to the third circuit unit, and an increment of the program voltage is set by controlling a relationship between a resistance of the first circuit unit and a resistance of the third circuit unit, while maintaining a start program voltage or a target program voltage at a fixed value without a change in the program step code.

Abstract: In some embodiments, a string of nonvolatile memory cells may be erased by driving their control gates with erase voltages that may have different levels for different cells. The cells may be divided into two or more groups, and the cells in each group may be driven by the same erase voltage. In another embodiment, a nonvolatile memory device may include a cell array having two groups of memory cells, and the memory cells in different groups may be simultaneously driven with erase voltages having different levels during an erase operation.

Abstract: A NAND flash memory device and a programming method thereof capable of improving a program speed during a multi-level cell programming operation are provided. The device performs a programming operation using an ISPP method. Additionally, the device includes a memory cell storing multi-bit data; a program voltage generating circuit generating a program voltage to be supplied to the memory cell; and a program voltage controller controlling a start level of the program voltage. The device supplies an LSB start voltage to a selected word line during an LSB program, and an MSB start voltage higher than the LSB start voltage to the selected word line during an MSB program.

Abstract: In some embodiments, a string of nonvolatile memory cells may be erased by driving their control gates with erase voltages that may have different levels for different cells. The cells may be divided into two or more groups, and the cells in each group may be driven by the same erase voltage. In another embodiment, a nonvolatile memory device may include a cell array having two groups of memory cells, and the memory cells in different groups may be simultaneously driven with erase voltages having different levels during an erase operation.

Abstract: A flash memory device is disclosed that comprises memory cells, a sense node connected to a selected bit line, a sense circuit configured to selectively provide a first voltage to a common node in accordance with a voltage level of the sense node, a first register connected to the sense node and the common node and configured to store data in accordance with a voltage level of the common node,a second register configured to store data in accordance with the voltage level of the sense node, a switch configured to provide a second voltage to the second register, and a discharge circuit configured to selectively discharge the sense node in accordance with the data stored in the second register.

Abstract: In one aspect, a non-volatile memory device includes a non-volatile memory cell array and a page buffer. The page buffer includes a sense node selectively connected to a bit line of the memory cell array, a main latch circuit including first and second main latch nodes, where the first main latch node is selectively connected to the sense node, and a latch input node selectively connected to the first and second main latch nodes. The page buffer further includes a cache latch circuit including first and second cache latch nodes, a switching circuit which selectively connects the second cache latch node to the latch input node, and a shared sense circuit connected between to the latch input node and a reference potential. The shared sense circuit selectively connects the latch input node to the reference potential in response to a voltage of the sense node and a voltage of the first cache latch node.

Abstract: A wordline voltage generation circuit generates an incremental step pulse voltage and includes a first circuit unit connected to a program voltage, a second circuit unit connected between the first circuit unit and a divided voltage and controlled by a program step code, and a third circuit unit connected between the divided voltage and a ground voltage. An increment of the program voltage is set according to a resistance of the third circuit unit without a change in the program step code. The first circuit unit is symmetrical in structure to the third circuit unit, and an increment of the program voltage is set by controlling a relationship between a resistance of the first circuit unit and a resistance of the third circuit unit, while maintaining a start program voltage or a target program voltage at a fixed value without a change in the program step code.

Abstract: A flash memory device which comprises a memory cell array having memory cells arranged in rows and columns; a word line voltage generator circuit configured to generate a program voltage, a dielectric breakdown prevention voltage, and a pass voltage at a program operation; and a row selector circuit that receives the program voltage, the dielectric breakdown prevention voltage, and the pass voltage and selecting one of the rows in response to a row address. The dielectric breakdown prevention voltage is lower than the program voltage and higher than the pass voltage; and the row selector circuit drives the selected row with the program voltage, drives at least one row just adjacent to, or neighboring, the selected row with the dielectric breakdown prevention voltage and drives remaining rows with the pass voltage.

Abstract: A CMOS semiconductor device and a method of manufacturing the same in which the gate induced drain leakage (GIDL) effect is reduced. In the semiconductor device of this invention, high concentration source/drain regions of a PMOS transistor are formed away from the gate pattern sidewall spacers. This is accomplished by using as an implant mask a dielectric film formed on an entire surface of a semiconductor substrate, where the semiconductor substrate includes a PMOS transistor region in an n-well, a low concentration source/drain regions of a PMOS transistor formed by using a gate pattern as an implant mask, the PMOS transistor gate pattern sidewall spacers, and an NMOS transistor region in a p-well with the NMOS transistor having both a low concentration and a high concentration source/drain regions.

Abstract: A method for fabricating a plasma display panel includes preparing from front substrates an assembly for forming a display part for displaying an image, and preparing from rear substrates a rear substrate assembly. Only the outer edge of the front and rear substrate assemblies are coated with a first frit. An upper glass for mounting on the top of the front substrate assembly, and a lower glass for mounting on the bottom of the rear substrate assembly. Only the edges of the upper and lower glasses are coated with a second frit glass. An outer edge of the front and rear substrate assemblies are coated with a third frit glass and the upper and lower glasses are sealed to the front and rear substrate assemblies and the front and rear assemblies are sealed together and evacuated. A discharge gas is injected between the front and rear assemblies.