Patents by Inventor Motokazu Yamada

Motokazu Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8299486
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: October 30, 2012
    Assignee: Nichia Corporation
    Inventors: Isamu Niki, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Publication number: 20120193665
    Abstract: A light emitting device which includes: a base body; a conductive member disposed on the base body; a light emitting element placed on the conductive member; and a translucent member disposed above the light emitting element. A surface of the translucent member is formed in a lens shape, and when a portion formed in the lens shape of the translucent member on a surface of the conductive member is perspectively seen from above, an area other than a portion where the light emitting element is placed is coated with an insulating filler to form a light reflection layer.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 2, 2012
    Applicant: NICHIA CORPORATION
    Inventor: Motokazu YAMADA
  • Patent number: 8227280
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: July 24, 2012
    Assignee: Nichia Corporation
    Inventors: Isamu Niki, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Patent number: 8148744
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: April 3, 2012
    Assignee: Nichia Corporation
    Inventors: Isamu Niki, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Publication number: 20120007112
    Abstract: A light emitting device includes a substrate, a light emitting element, an additional light emitting element, a light reflecting resin member, an electrically conductive wire, an additional electrically conductive wire, and a sealing member. The substrate is provided with a conductor wiring. The light emitting element is mounted on the substrate. The electrically conductive wire electrically connects the conductor wiring and the light emitting element with at least a part of the electrically conductive wire being embedded in the light reflecting resin member. The additional electrically conductive wire electrically connects the light emitting element and the additional light emitting element, with the additional electrically conductive wire not being in contact with the light reflecting resin member. The sealing member is disposed in a region surrounded by the light reflecting resin member to cover the light emitting element.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 12, 2012
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Mototaka INOBE, Kunihiro IZUNO
  • Patent number: 8058793
    Abstract: To provide a phosphor containing a comparatively much red component and having high light emitting efficiency, high brightness and further high durability, the nitride phosphor is represented by the general formula LXMYN((2/3)X+(4/3)Y):R or LXMYOZN((2/3)X+(4/3)Y?(2/3)Z):R (wherein L is at least one or more selected from the Group II Elements consisting of Mg, Ca, Sr, Ba and Zn, M is at least one or more selected from the Group IV Elements in which Si is essential among C, Si and Ge, and R is at least one or more selected from the rare earth elements in which Eu is essential among Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er and Lu.); contains the another elements.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: November 15, 2011
    Assignee: Nichia Corporation
    Inventors: Hiroto Tamaki, Masatoshi Kameshima, Motokazu Yamada, Takahiro Naitou, Kazuhiko Sakai
  • Patent number: 8049237
    Abstract: A light emitting device includes a substrate provided with a conductor wiring, a light emitting element mounted on the substrate and a light reflecting resin member configured and arranged to reflect light emitted from the light emitting element. The light emitting device also includes at least one of an electrically conductive wire electrically connecting the conductor wiring and the light emitting element, an exposed region of the substrate on which the conductor wiring is not disposed, and a protective element mounted on the conductor wiring. At least a part of the electrically conductive wire, the exposed region or the protective element is buried in the light reflecting resin member.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: November 1, 2011
    Assignee: Nichia Corporation
    Inventors: Motokazu Yamada, Mototaka Inobe
  • Patent number: 7964113
    Abstract: To provide a phosphor containing a comparatively much red component and having high light emitting efficiency, high brightness and further high durability, the nitride phosphor is represented by the general formula LXMYN((2/3)X+(4/3)Y):R or LXMYOZN((2/3)X+(4/3)Y?(2/3)Z):R (wherein L is at least one or more selected from the Group II Elements consisting of Mg, Ca, Sr, Ba and Zn, M is at least one or more selected from the Group IV Elements in which Si is essential among C, Si and Ge, and R is at least one or more selected from the rare earth elements in which Eu is essential among Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er and Lu.); contains the another elements.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: June 21, 2011
    Assignee: Nichia Corporation
    Inventors: Hiroto Tamaki, Masatoshi Kameshima, Suguru Takashima, Motokazu Yamada, Takahiro Naitou, Kazuhiko Sakai, Yoshinori Murazaki
  • Publication number: 20100264447
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Application
    Filed: June 30, 2010
    Publication date: October 21, 2010
    Applicant: Nichia Corporation
    Inventors: Isamu NIKI, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Publication number: 20100266815
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Application
    Filed: June 30, 2010
    Publication date: October 21, 2010
    Applicant: Nichia Corporation
    Inventors: Isamu NIKI, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Publication number: 20100264446
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Application
    Filed: June 30, 2010
    Publication date: October 21, 2010
    Applicant: Nichia Corporation
    Inventors: Isamu NIKI, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Publication number: 20100267181
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Application
    Filed: June 30, 2010
    Publication date: October 21, 2010
    Applicant: Nichia Corporation
    Inventors: Isamu NIKI, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Publication number: 20100264445
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Application
    Filed: June 30, 2010
    Publication date: October 21, 2010
    Applicant: Nichia Corporation
    Inventors: Isamu NIKI, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Publication number: 20100255621
    Abstract: A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10. The first main surface of the substrate 10 has substrate protrusion portion 11, the bottom surface 14 of each protrusion is wider than the top surface 13 thereof in a cross-section, or the top surface 13 is included in the bottom surface 14 in a top view of the substrate. The bottom surface 14 has an approximately polygonal shape, and the top surface 13 has an approximately circular or polygonal shape with more sides than that of the bottom surface 14.
    Type: Application
    Filed: June 15, 2010
    Publication date: October 7, 2010
    Inventors: Shunsuke MINATO, Junya Narita, Yohei Wakai, Yukio Narukawa, Motokazu Yamada
  • Patent number: 7804101
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: September 28, 2010
    Assignee: Nichia Corporation
    Inventors: Isamu Niki, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Patent number: 7781790
    Abstract: A semiconductor light emitting element having a semiconductor light emitting structure on a first main surface of a substrate, wherein the first main surface of the substrate has a substrate protrusion portion thereon, wherein a bottom surface of a protrusion is wider than a top surface thereof in a cross section of the substrate and the top surface is included in the bottom surface in a top view of the substrate, the bottom surface has an approximately polygonal shape which has a convex portion on each constituent side of the bottom surface, and the top surface has an approximately circular shape.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: August 24, 2010
    Assignee: Nichia Corporation
    Inventors: Shunsuke Minato, Junya Narita, Yohei Wakai, Yukio Narukawa, Motokazu Yamada
  • Publication number: 20100193822
    Abstract: The light emitting device has a substrate, metallization including silver established on the surface of the substrate, a light emitting element mounted on the substrate, conducting wire that electrically connects the metallization and the light emitting element, light reflective resin provided on the substrate to reflect light from the light emitting element, and insulating material that covers at least part of the metallization surfaces. The insulating material is established to come in contact with the side of the light emitting element. This arrangement can suppress the leakage of light emitting element light from the substrate, and can achieve a light emitting device with high light extraction efficiency.
    Type: Application
    Filed: January 28, 2010
    Publication date: August 5, 2010
    Applicant: NICHIA CORPORATION
    Inventors: Mototaka INOBE, Motokazu Yamada, Kazuhiro Kamada
  • Patent number: D622683
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: August 31, 2010
    Assignee: Nichia Corporation
    Inventor: Motokazu Yamada
  • Patent number: D628169
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: November 30, 2010
    Assignee: Nichia Corporation
    Inventor: Motokazu Yamada
  • Patent number: D636356
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: April 19, 2011
    Assignee: Nichia Corporation
    Inventor: Motokazu Yamada