Patents by Inventor Motokazu Yamada

Motokazu Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160260873
    Abstract: A light emitting device having a light-emitting element, a covering resin covering the light-emitting element, a wavelength converting material contained in the covering resin, and a light diffusing agent contained in the covering resin is provided. The light diffusing agent contains glass particles. A first refractive index n1 of the covering resin at a peak wavelength of a light emitted by the light-emitting element and at 25° C. is in a range of 1.48 to 1.60, a second refractive index n2 of the covering resin at the peak wavelength and at 100° C. is at least 0.0075 lower than the first refractive index n1, and a third refractive index n3 of the light diffusing agent at the peak wavelength and at 25° C. is higher than the first refractive index n1.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 8, 2016
    Inventors: Motokazu YAMADA, Tomonori OZAKI
  • Publication number: 20160252218
    Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.
    Type: Application
    Filed: February 26, 2016
    Publication date: September 1, 2016
    Applicant: NICHIA CORPORATION
    Inventors: Yasuo FUJIKAWA, Takuya WASA, Tomohiro IKEDA, Yohei INAYOSHI, Motokazu YAMADA
  • Patent number: 9412918
    Abstract: A light emitting device includes a support member, a light emitting element, and an underfill material. The support member includes an insulating member and positive and negative electrically conductive wirings arranged on the insulating member. The electrically conductive wirings are insulated and separated from each other by an insulating region arranged between the positive and negative electrically conductive wirings. The insulating separation region includes a first region disposed on an outer side with respect to the light emitting element and a second region disposed directly under the light emitting element. The first region includes an underfill arranging portion in which an interval between the electrically conductive wirings is wider than in the second region. The underfill material is arranged to extend from the underfill arranging portion to the second region in a space formed between the support member and the light emitting element.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: August 9, 2016
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Patent number: 9388951
    Abstract: A stacked assembly of light emitting devices includes a first light emitting device, a second light emitting device and a sealing member. The first light emitting device includes a first substrate member extending in a longitudinal direction and defining a plurality of through-holes, and a plurality of first light emitting elements arranged on the first substrate member. The second light emitting device is arranged to overlap with the first light emitting device. The second light emitting device includes a second substrate member extending in the longitudinal direction, and a plurality of second light emitting elements arranged on the second substrate and exposed respectively through the through-holes. The sealing member seals the first light emitting elements and the second light emitting elements.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: July 12, 2016
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Publication number: 20160197250
    Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin and an adhesion layer. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. At least one light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the light emitting element. The adhesion layer is arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate. The adhesion layer has a non-adhesive region corresponding at least to a region on the first surface where the at least one light emitting element is arranged. The non-adhesive region is covered with a non-adhesive layer.
    Type: Application
    Filed: March 11, 2016
    Publication date: July 7, 2016
    Inventor: Motokazu YAMADA
  • Publication number: 20160190405
    Abstract: A light emitting device includes a base, at least one light emitting element, and a light transmissive sealing member. The base has a conductor wiring. The at least one light emitting element is mounted on the base. The at least one light emitting element is electrically connected to the conductor wiring. The light transmissive sealing member includes a light diffusion material. The light transmissive sealing member covers the at least one light emitting element. The light transmissive sealing member has a projection shape. The projection shape has a substantially circular bottom surface facing the base and a height in a light axis direction of the at least one light emitting element. The height is greater than a diameter of the substantially circular bottom surface.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 30, 2016
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Yuichi YAMADA
  • Patent number: 9368681
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: June 14, 2016
    Assignee: Nichia Corporation
    Inventors: Isamu Niki, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Patent number: 9318665
    Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin and an adhesion layer. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. The light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the light emitting element. The adhesion layer is arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate. The adhesion layer has a small thickness portion corresponding at least to a region on the first surface where the at least one light emitting element is arranged. The small thickness portion of the adhesion layer has a thickness smaller than a thickness of regions of the adhesion layer other than the portion.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: April 19, 2016
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Publication number: 20160087169
    Abstract: A light emitting device includes a substrate, a light emitting device and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions, a groove portion and a pair of terminal portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the flexible base. The groove portion is formed between the plurality of wiring portions spaced apart from each other. The pair of terminal portions is arranged along the first direction at the both sides of the plurality of wiring portions. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The light emitting element is mounted on the substrate in a flip-chip manner.
    Type: Application
    Filed: December 2, 2015
    Publication date: March 24, 2016
    Inventors: Motokazu YAMADA, Tadaaki MIYATA, Naoki MORI
  • Publication number: 20160035952
    Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).
    Type: Application
    Filed: October 15, 2015
    Publication date: February 4, 2016
    Applicant: Nichia Corporation
    Inventors: Motokazu YAMADA, Ryota Seno, Kazuhiro Kamada
  • Patent number: 9231177
    Abstract: Provided is a light emitting device in which deterioration of the substrate member can be reduced. The light emitting device includes a base member mainly made of a resin, a plurality of wiring portions and arranged on the base member via an adhesive agent, a groove portion defined between adjacent wiring portions, and at least one light emitting element which is disposed straddling at least a part of the groove portion. The adhesive agent is applied covering the base member from the groove portion, and contains a light-shielding member. The light-shielding member shields the base member from light, for example at a specific wavelength, emitted from the at least one light emitting element.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: January 5, 2016
    Assignee: NICHIA CORPORATION
    Inventors: Hiroki Oguro, Motokazu Yamada, Yasuo Fujikawa
  • Patent number: 9209364
    Abstract: A light emitting device includes a light emitting element and a substrate including a flexible base, a plurality of wiring portions, a groove portion, and a reflective layer. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate. The wiring portions are arranged on the flexible base. The groove portion is formed between the wiring portions spaced apart from each other. The groove portion includes a first groove portion extending in a second direction intersecting the first direction. The reflective layer is arranged on the plurality of wiring portions. The light emitting element is disposed near the reflective layer and electrically connected to the plurality of wiring portions. The light emitting element is spaced apart from the first groove portion.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: December 8, 2015
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Tadaaki Miyata, Naoki Mori
  • Patent number: 9196805
    Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: November 24, 2015
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Ryota Seno, Kazuhiro Kamada
  • Patent number: 9123867
    Abstract: A light emitting device which includes: a base body; a conductive member disposed on the base body; a light emitting element placed on the conductive member; and a translucent member disposed above the light emitting element. A surface of the translucent member is formed in a lens shape, and when a portion formed in the lens shape of the translucent member on a surface of the conductive member is perspectively seen from above, an area other than a portion where the light emitting element is placed is coated with an insulating filler to form a light reflection layer.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: September 1, 2015
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Patent number: 9119331
    Abstract: A light emitting device which can prevent bending of the substrate member. The light emitting device includes a flexible substrate member, a plurality of light emitting elements, two first sealing members, and a second sealing member. The two first sealing members are disposed in-line on the substrate member and arranged in the longitudinal direction. The second sealing member is arranged extending in the longitudinal direction on the substrate member, and is offset in a lateral direction from the two first sealing members. The second sealing member is further arranged to extend across a first gap formed between the two first sealing members when viewed from a lateral direction, and overlap at least a portion of each of the two first sealing members. The second sealing member comprises a resin having transparency to light.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: August 25, 2015
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Publication number: 20150179891
    Abstract: A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.
    Type: Application
    Filed: January 30, 2015
    Publication date: June 25, 2015
    Inventors: Motokazu YAMADA, Mototaka INOBE, Kunihiro IZUNO
  • Patent number: 9054271
    Abstract: A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10. The first main surface of the substrate 10 has substrate protrusion portion 11, the bottom surface 14 of each protrusion is wider than the top surface 13 thereof in a cross-section, or the top surface 13 is included in the bottom surface 14 in a top view of the substrate. The bottom surface 14 has an approximately polygonal shape, and the top surface 13 has an approximately circular or polygonal shape with more sides than that of the bottom surface 14.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: June 9, 2015
    Assignee: NICHIA CORPORATION
    Inventors: Shunsuke Minato, Junya Narita, Yohei Wakai, Yukio Narukawa, Motokazu Yamada
  • Patent number: 9024343
    Abstract: A light emitting device includes a substrate, a light emitting element, an additional light emitting element, a light reflecting resin member, an electrically conductive wire, an additional electrically conductive wire, and a sealing member. The substrate is provided with a conductor wiring. The light emitting element is mounted on the substrate. The electrically conductive wire electrically connects the conductor wiring and the light emitting element with at least a part of the electrically conductive wire being embedded in the light reflecting resin member. The additional electrically conductive wire electrically connects the light emitting element and the additional light emitting element, with the additional electrically conductive wire not being in contact with the light reflecting resin member. The sealing member is disposed in a region surrounded by the light reflecting resin member to cover the light emitting element.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 5, 2015
    Assignee: Nichia Corporation
    Inventors: Motokazu Yamada, Mototaka Inobe
  • Publication number: 20150084073
    Abstract: A light emitting device includes a light emitting element and a substrate including a flexible base, a plurality of wiring portions, a groove portion, and a reflective layer. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate. The wiring portions are arranged on the flexible base. The groove portion is formed between the wiring portions spaced apart from each other. The groove portion includes a first groove portion extending in a second direction intersecting the first direction. The reflective layer is arranged on the plurality of wiring portions. The light emitting element is disposed near the reflective layer and electrically connected to the plurality of wiring portions. The light emitting element is spaced apart from the first groove portion.
    Type: Application
    Filed: December 9, 2014
    Publication date: March 26, 2015
    Inventors: Motokazu YAMADA, Tadaaki MIYATA, Naoki MORI
  • Publication number: 20150069453
    Abstract: A flexible substrate member which can prevent breakage due to bending, regardless of a shape of a metal pattern, and a light emitting device which employs the flexible substrate. The flexible substrate member includes a plurality of metal wirings disposed on an insulating substrate which are spaced apart from each other via a groove portion. The groove portion includes an intersection region where a first groove portion and a second groove portion are intersected. The metal wirings includes a first metal wiring and a second metal wiring which are demarcated via the first groove portion in the intersection region, and a third metal wiring which is demarcated via the second groove portion with respect to the first metal wiring and the second metal wiring. The third metal wiring includes a projection which projects on an extension line of the first groove portion.
    Type: Application
    Filed: September 11, 2014
    Publication date: March 12, 2015
    Inventor: Motokazu YAMADA