Abstract: Various implementations described herein are directed to a device having neural network circuitry with an array of synapse cells arranged in columns and rows. The device may have input circuitry that provides voltage to the synapse cells by way of row input lines for the rows in the array. The device may have output circuitry that receives current from the synapse cells by way of column output lines for the columns in the array. Also, conductance for the synapse cells in the array may be determined based on the voltage provided by the input circuitry and the current received by the output circuitry.

Abstract: Various implementations described herein refer to a device having a memory structure with a substrate. The device may have a signal wire buried or partially buried within at least one of the substrate and a dielectric for transmitting electrical signals. The device may be manufactured as a memory device having a memory cell structure with the signal wire buried or partially buried in the substrate.

Abstract: Various implementations described herein are related to a device having bitline drivers coupled to passgates of bitcells via bitlines and buried metal lines formed within a substrate including a buried enable signal line and a buried ground line coupled to ground connections of the bitline drivers. The buried enable signal line transfers a negative bias to a selected bitline of the bitlines via the buried ground line that is coupled to the ground connections of the bitline drivers so as to increase gate-source bias of the passgates of the selected bitcell to thereby enhance write capability of the selected bitcell.

Abstract: A compute-in-memory (CIM) array module and a method for performing dynamic saturation detection for a CIM array are provided. The CIM array module includes a CIM array, saturation detection units (SDUs) and a controller. The CIM array includes selectable row signal lines, column signal lines and cells. Each cell is located at an intersection of a selectable row signal line and a column signal line, and each cell has a programmable conductance. The SDUs are selectively coupled to at least one column signal line, and each SDU is configured to, for each column signal line, generate an analog signal, and identify the column signal line as a saturated column signal line when a voltage of the analog signal is greater than a saturation threshold voltage, or a current of the analog signal is greater than a saturation threshold current.

Abstract: Various implementations described herein are related to a device having bitline drivers coupled to passgates of bitcells via bitlines and buried metal lines formed within a substrate including a buried enable signal line and a buried ground line coupled to ground connections of the bitline drivers. The buried enable signal line transfers a negative bias to a selected bitline of the bitlines via the buried ground line that is coupled to the ground connections of the bitline drivers so as to increase gate-source bias of the passgates of the selected bitcell to thereby enhance write capability of the selected bitcell.

Abstract: Building on the models-on-silicon (model-on-chip or model-on-die) architecture and design, multiple models-on-silicon chips/dies can be arranged in a stacked formation to form a single cube, referred to herein as AI cube. Each of these chips or dies can embed one or more transformer blocks, such as one or more consecutive transformer blocks of a transformer-based neural network. This stacked configuration enables processing of data in a feedforward manner, effectively performing processing for an inference task of a transformer-based neural network, e.g., an entire large language model, within one compact semiconductor integrated circuit package. For example, a 70 billion parameter LLM can be arranged and implemented onto an AI cube, where different groups of transformer blocks are distributed to different chips in the AI cube in a feedforward manner.

Abstract: Disclosed are devices and techniques for facilitating transmission of light signals between optical waveguides formed on integrated circuit (IC) devices. In an implementation, one or more first waveguides may be formed in a structure such that at least a portion of the one or more first waveguides are exposed for optical connectivity. The structure may comprise first features to enable the structure to be interlocked with an IC device comprising second features complementary with the first features, so as to align at least a portion of the one or more first waveguides exposed to optically couple with one or more second waveguides formed in the first integrated circuit device.

Abstract: Three-dimensional (3D) memory architectures with hybrid bonding and methods for making same. Methods and apparatus employ ultra-high density (defined herein as sub 1 micron pitch) hybrid bond interface (HBI) stacking die/chiplets at the memory bank level. Various configurations for distributing the memory bank and the peripheral logic between a bottom die and a top die are described, with application to further die stacking. Provided apparatus may also implement dedicated vias for power delivery from a principle bottom die to the top die.

Abstract: A memory device may include one or more semiconductor structures having a frontside and a backside, one or more gate electrodes, and metal layers at both the frontside and backside. A frontside metal layer may include metal lines that are used as bit lines of the memory device. A backside metal layer may include metal lines that are used as write bit lines of the memory device. A write bit line at the backside may be parallel to a bit line at the frontside. Another backside metal layer may include metal lines that are used as word lines of the memory device. A word line at the backside may be parallel to a gate electrode. A switch may be between a bit line and a write bit line. The bit line is electrically coupled to the write bit line when the switch is closed.

Abstract: According to one implementation of the present disclosure, a method includes performing a spatial alignment of at least one of first or second data tiers of a circuit; and performing a computation based on the spatial alignment of the at least one of the first and second data tiers. According to another implementation of the present disclosure, a circuit includes: a compute circuitry; and at least first and second data tiers of two or more data tiers positioned at least partially overlapping one another. In an example, each of the at least first and second data tiers is coupled to the compute circuitry. In certain implementations, the positioning of the first and second data tiers at least partially overlapping one another corresponds to a spatial alignment.

Abstract: Various implementations described herein are related to a method. The method may apply a write control voltage to a bitcell. The method may gradually ramp the write control voltage to the bitcell. The method may terminate application of the write control voltage to the bitcell when a write operation is sensed in the bitcell.

Abstract: A memory for an artificial neural network (ANN) accelerator is provided. The memory includes a first bank, a second bank and a bank selector. Each bank includes at least two word lines and a plurality of write word selectors. Each word line stores a plurality of words, and each word has a plurality of bytes. Each write word selector has an input port and a plurality of output ports, is coupled to a corresponding word in each word line, and is configured to select a byte of the corresponding word of a selected word line based on a byte select signal. The bank selector is coupled to the write word selectors of the first bank and the second bank, and configured to select a combination of write word selectors from at least one of the first bank and the second bank based on a bank select signal.

Abstract: According to one implementation of the present disclosure, a circuit comprises: a memory array comprising one or more groupings of bitcells, one or more bitlines, and one or more wordlines; and one or more canary circuits coupled to the memory array, wherein each of the canary circuits is configured to predict at least partial breakdown of a corresponding grouping of bitcells in the memory array. According to one implementation of the present disclosure, a method includes: providing an excitation stress on one or more canary circuits corresponding to a grouping of bitcells in a memory array; detecting at least a partial breakdown of the one or more canary circuits; and generating a flag.

Abstract: Briefly, embodiments, such as methods and/or systems for operations and/or procedures to test magnetic memory devices. In a particular implementation, a bit error rate of a magnetic memory device may be estimated based, at least in part, on an observed bit error rate in the presence of an externally applied magnetic field.

Abstract: Various implementations described herein are related to a device having bitline drivers coupled to passgates of bitcells via bitlines and buried metal lines formed within a substrate including a buried enable signal line and a buried ground line coupled to ground connections of the bitline drivers. The buried enable signal line transfers a negative bias to a selected bitline of the bitlines via the buried ground line that is coupled to the ground connections of the bitline drivers so as to increase gate-source bias of the passgates of the selected bitcell to thereby enhance write capability of the selected bitcell.

Abstract: Briefly, embodiments, such as methods and/or systems for operations and/or procedures to test magnetic memory devices. In a particular implementation, a bit error rate of a magnetic memory device may be estimated based, at least in part, on an observed bit error rate in the presence of an externally applied magnetic field.

Abstract: Disclosed are methods, systems and devices for operation of memory device. In one aspect, volatile memory bitcells and non-volatile memory bitcells may be integrated to facilitate transfer of stored values between the volatile and non-volatile memory bitcells.

Abstract: Various implementations described herein refer to a method for tracking abnormal incidents while monitoring activity of logic circuitry. The method may include detecting a tamper event related to the abnormal incidents and storing an attack signature related to the tamper event. The attack signature may be stored in non-volatile memory (NVM), such as, e.g., correlated electron random access memory (CeRAM).

Abstract: Various implementations described herein refer to a device having a memory structure with a substrate. The device may have a signal wire buried or partially buried within at least one of the substrate and a dielectric for transmitting electrical signals. The device may be manufactured as a memory device having a memory cell structure with the signal wire buried or partially buried in the substrate.

Abstract: According to one implementation of the present disclosure, a circuit comprises: a memory array comprising one or more groupings of bitcells, one or more bitlines, and one or more wordlines; and one or more canary circuits coupled to the memory array, wherein each of the canary circuits is configured to predict at least partial breakdown of a corresponding grouping of bitcells in the memory array. According to one implementation of the present disclosure, a method includes: providing an excitation stress on one or more canary circuits corresponding to a grouping of bitcells in a memory array; detecting at least a partial breakdown of the one or more canary circuits; and generating a flag.