Abstract: Disclosed herein are a semiconductor package board and a method for manufacturing the same. The semiconductor package board according to a preferred embodiment of the present invention includes an insulating layer; a first circuit layer formed on one surface of the insulating layer and including a bump pad; a post bump formed on the bump pad and formed integrally with the bump pad; and a first solder resist layer formed on the insulating layer and the first circuit layer and having a first opening part exposing the post bump and bump pad formed thereon.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract: A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer

Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.

Abstract: Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer.

Abstract: Disclosed herein is a multi-layer type coreless substrate, including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated on one surface or both surfaces of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting a pillar disposed on an outermost insulating layer of the plurality of insulating layers.

Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

Abstract: Disclosed herein is a method of manufacturing a multilayer type coreless substrate, the method including: (A) preparing a carrier substrate including at least one copper foil formed on one surface or both surfaces of an insulating surface; (B) forming a coreless printed circuit precursor on one surface or both surfaces of the carrier substrate; (C) separating the carrier substrate; (D) performing a polishing cutting process on the coreless printed circuit precursor; and (E) laminating a plurality of other insulating layers on a flat outer surface of the coreless printed circuit precursor, the plurality of other insulating layers sequentially including other circuit layers and other pillars.

Abstract: A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.

Abstract: A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package.

Abstract: Disclosed herein is a coreless substrate according to a preferred embodiment of the present invention, the coreless substrate including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a direction of one surface or both surfaces of the first insulating layer, including at least one circuit layer and at least one another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers.

Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.

Abstract: Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.

Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.

Abstract: Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.

Abstract: A method of manufacturing a printed circuit board having embedded electronic components, the method including: mounting a first electronic component on one side of a core sheet and mounting a second electric component on the other side of the core sheet such that the second electronic component overlaps the first electronic component; stacking a first insulation layer on one side of the core sheet such that the first insulation layer covers the first electronic component and stacking a second insulation layer on the other side of the core sheet such that the second insulation layer covers the second electronic component; and forming a circuit pattern on a surface of the first insulation layer or the second insulation layer.

Abstract: A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability.

Abstract: A single-layer board on chip package substrate and a method of manufacturing the same are disclosed. The single-layer board on chip package substrate in accordance with an embodiment of the present invention includes an insulator, which has a window perforated therethrough, a wiring pattern, a wire bonding pad and a solder ball pad, which are embedded in one surface of the insulator, and a solder resist layer, which is formed on the one surface of the insulator such that the solder resist layer covers the wiring pattern but at least portions of the wire bonding pad and the solder ball pad are exposed.