Patents by Inventor Myung-sam Kang

Myung-sam Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20160249450
    Abstract: A circuit board and a related manufacturing method are disclosed. The circuit board includes a core part that includes a first core layer that is formed of graphite or graphene material and that has a through hole that penetrates from one surface through to the other surface of the first core layer, and a second core layer and a third core layer that are formed of a metallic material and disposed respectively on the one surface and the other surface of the first core layer. The through hole is filled with the metallic material that forms the second core layer and the third core layer.
    Type: Application
    Filed: January 19, 2016
    Publication date: August 25, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae-Hong MIN, Myung-Sam KANG, Jin-Hyuk JANG, Young-Gwan KO
  • CIRCUIT BOARD AND ASSEMBLY THEREOF
    Publication number: 20160249457
    Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.
    Type: Application
    Filed: February 17, 2016
    Publication date: August 25, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae-Hong MIN, Myung-Sam KANG, Young-Gwan KO, Min-Jae SEONG
  • COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    Publication number: 20160240296
    Abstract: A coil electronic component includes: a magnetic body comprising a magnetic material; a coil part embedded inside the magnetic body; and a magnetic layer disposed on a surface of the magnetic body.
    Type: Application
    Filed: November 24, 2015
    Publication date: August 18, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin-Soo KIM, Myung-Sam KANG, Kwang-Il PARK, Young-Gwan KO, Youn-Soo SEO, Woon-Chul CHOI, Hye-Yeon CHA
  • PRINTED CIRCUIT BOARD HAVING METAL BUMPS
    Publication number: 20160242284
    Abstract: A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer
    Type: Application
    Filed: March 26, 2014
    Publication date: August 18, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myung Sam KANG, Jeong Woo PARK, Ok Tae KIM, Kil Yong YUN
  • Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same
    Patent number: 9420709
    Abstract: Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package includes: a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: August 16, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Kwan Lee, Myung Sam Kang, Joo Hwan Jung, Ju Hee Park, Seung Yeop Kook
  • CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20160192471
    Abstract: A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part.
    Type: Application
    Filed: December 28, 2015
    Publication date: June 30, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae-Hong MIN, Myung-Sam KANG, Young-Gwan KO, Min-Jae SEONG
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160192490
    Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 30, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung-Sam KANG, Young-Gwan KO, Sang-Hoon KIM, Kang-Wook BONG, Hye-Won JUNG, Yong-Wan JI
  • CIRCUIT BOARD, MULTILAYERED SUBSTRATE HAVING THE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD
    Publication number: 20160192488
    Abstract: Disclosed is a circuit board that includes a core portion having a first via disposed therein in the general shape of an hourglass. The circuit board implements a finer via that penetrates a core and improves heat dissipation performance. The circuit board includes a core portion including a first core and a second core made of a metallic material, the first core and the second core being disposed adjacent to each other, and a first via penetrating the core portion.
    Type: Application
    Filed: December 8, 2015
    Publication date: June 30, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae-Hong MIN, Myung-Sam KANG, Jung-Han LEE, Young-Gwan KO
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160192491
    Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 30, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung-Sam KANG, Young-Gwan KO, Sang-Hoon KIM, Kang-Wook BONG, Hye-Won JUNG, Yong-Wan JI
  • CIRCUIT BOARD
    Publication number: 20160143129
    Abstract: A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.
    Type: Application
    Filed: November 12, 2015
    Publication date: May 19, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae-Hong MIN, Myung-Sam KANG, Young-Gwan KO
  • CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160143132
    Abstract: A circuit board includes: a core portion comprising a fluid path, the fluid path being open toward an outside of the circuit board to allow a fluid outside the circuit board to pass through the fluid path; and insulation layers disposed above and below the core portion.
    Type: Application
    Filed: November 10, 2015
    Publication date: May 19, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd
    Inventors: Tae-Hong MIN, Myung-Sam KANG, Jung-Han LEE, Young-Gwan KO
  • PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20160100485
    Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board, which includes: a first resist layer; a first circuit formed on the first resist layer; an insulation film formed on the first resist layer so as to cover an upper surface and a lateral surface of the first circuit; a ground formed on the insulation film so as to be connected with the first circuit electrically; and an insulation layer formed on the insulation film so as to cover the ground.
    Type: Application
    Filed: March 2, 2015
    Publication date: April 7, 2016
    Inventors: Hye-Won JUNG, Myung-Sam KANG, Yong-Wan JI, Yong-Jin PARK, Young-Gwan KO, Kang-Wook BONG
  • CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20160095202
    Abstract: A circuit board includes a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof; a plated part provided to a surface of the first via hole; an insulating film provided to a surface of the plated part; and a first via formed by providing a conductive material to at least a portion of a region surrounded by an outer surface of the insulating film. Since the circuit board may implement fineness of the first via while forming the first metal layer to be thicker than the related art, warpage may be decreased and heat dissipation performance may be improved.
    Type: Application
    Filed: September 30, 2015
    Publication date: March 31, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hong MIN, Young Gwan KO, Jung Han LEE, Myung Sam KANG
  • CIRCUIT BOARD INCLUDING HEAT DISSIPATION STRUCTURE
    Publication number: 20160095198
    Abstract: Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part.
    Type: Application
    Filed: September 30, 2015
    Publication date: March 31, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hong MIN, Myung Sam KANG, Young Gwan KO, Min Jae SEONG
  • CIRCUIT BOARD
    Publication number: 20160095203
    Abstract: Disclosed herein is a circuit board including a heat transfer structure formed of a highly thermal conductive material, wherein a part of the heat transfer structure excluding an air cooling unit exposed to outside of an insulation unit is inserted into an insulation unit, and the air cooling unit has a shape having a high non-surface area such as a wrinkled or uneven shape.
    Type: Application
    Filed: September 30, 2015
    Publication date: March 31, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hong MIN, Myung Sam KANG, Young Gwan KO, Min Jae SEONG, Jin Hyuk JANG
  • CIRCUIT BOARD COMPRISING HEAT TRANSFER STRUCTURE
    Publication number: 20160095201
    Abstract: A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.
    Type: Application
    Filed: September 10, 2015
    Publication date: March 31, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hong MIN, Myung Sam KANG, Jin Hyuk JANG, Young Gwan KO
  • PACKAGE BOARD, METHOD FOR MANUFACTURING THE SAME AND PACKAGE ON PACKAGE HAVING THE SAME
    Publication number: 20160081182
    Abstract: There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.
    Type: Application
    Filed: April 21, 2015
    Publication date: March 17, 2016
    Inventors: Myung Sam KANG, Young Gwan KO, Hye Jin KIM, Hye Won JUNG, Min Jae SEONG
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160050752
    Abstract: There are provided a printed circuit board including: an insulation layer; circuit patterns buried in the insulation layer; and a bump pad having a lower part buried in the insulation layer and an upper part protruding upwardly from the insulation layer, and a method of manufacturing the printed circuit board.
    Type: Application
    Filed: April 20, 2015
    Publication date: February 18, 2016
    Inventors: Myung Sam KANG, Seung Eun LEE, Young Kwan LEE, Seung Yeop KOOK, Ki Jung SUNG
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160050755
    Abstract: There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board.
    Type: Application
    Filed: August 12, 2015
    Publication date: February 18, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung Sam KANG, Young Kwan LEE, Seung Eun LEE, Seung Yeop KOOK
  • PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20160037620
    Abstract: There is provided a printed circuit board including: a core layer having a cavity formed therein; a heat radiation body included in the cavity; an insulating layer provided on an upper surface and a lower surface of the core layer; and a heat dissipating via penetrating through the insulating layer to be in contact with the heat radiation body and dissipating heat externally, wherein the heat radiation body includes an insulating plate, a first metal block formed on an upper surface of the insulating plate, and a second metal block formed on a lower surface of the insulating plate.
    Type: Application
    Filed: March 25, 2015
    Publication date: February 4, 2016
    Inventors: Myung Sam KANG, Young Gwan KO, Tae Hong MIN, Jung Han LEE