Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes a metal core; a through via penetrating through the metal core; and an insulating film formed between the metal core and the through via.

Abstract: There are provided a package board, a method of manufacturing the same, and a stack type package using the same. The package board according to an exemplary embodiment of the present invention includes a first insulating layer formed with a cavity and an external connection terminal formed to penetrate through the first insulating layer and have one end protruding to an outside of one surface of the first insulating layer.

Abstract: The present invention relates to a chip embedded substrate, which includes a substrate formed by alternately stacking an insulation layer and a circuit layer and an embedded chip equipped with a connection terminal and mounted inside the substrate, wherein the connection terminal is protruded from the insulation layer placed on the outermost layer of the substrate, and a connection surface to be connected to an electronic component is exposed to the outside.

Abstract: A package structure and a method of manufacturing the package structure are disclosed. The package structure in accordance with an aspect of the present invention includes: a stiffener substrate; a dielectric layer and a circuit pattern layer laminated on the stiffener substrate; a protective layer laminated on the dielectric layer so as to protect the circuit pattern layer; a first electrode post protruded by penetrating the protective layer from the circuit pattern layer; and a chip receiving portion formed on a surface of the protective layer that is in a protruded direction of the first electrode post.

Abstract: There are provided a package board and a package using the same. The package board according to an exemplary embodiment of the present disclosure includes: an insulating layer; a circuit pattern formed in the insulating layer; a capacitor formed on a whole surface of a horizontal plane in the insulating layer; and a first via penetrating through the capacitor and electrically connecting the circuit patterns each formed on upper and lower portions of the capacitor to each other.

Abstract: A seed layer and a resist layer are formed on a solder resist layer, and the resist layer is patterned to form connection pads and pad plating layers. Then, the resist layer is removed, and the seed layer exposed to the outside is removed. A device may be mounted on this circuit board, and a connection terminal of the device and the connection pad of the circuit board may be connected to each other by a wire, or the like.

Abstract: There are provided a package board and a package using the same. The package board according to an exemplary embodiment of the present disclosure includes: an insulating layer; a dielectric layer formed on the insulating layer; a lower electrode formed on a whole surface of an upper surface of the insulating layer; and an upper electrode formed on a whole surface of an upper surface of the dielectric layer.

Abstract: There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, the package board includes: a first insulating layer formed with a penetrating cavity; a capacitor disposed in the cavity and including a first electrode, a second electrode formed on the first electrode, and a dielectric layer formed between the first electrode and the second electrode; a second insulating layer formed on the first insulating layer and in the cavity to embed the capacitor; circuit layers formed on the first insulating layer and the second insulating layer; and a via penetrating through the second insulating layer to electrically connect the circuit layer to the capacitor.

Abstract: A package substrate, a package, a package on package, and a manufacturing method of a package substrate. A package substrate according to one exemplary embodiment includes: an insulating layer; a circuit layer formed on the insulating layer; and a capacitor including a lower electrode, an upper electrode, and a dielectric layer formed between the lower electrode and the upper electrode, the lower electrode and the dielectric layer being buried in the insulating layer and the upper electrode being formed on an upper portion of the insulating layer.

Abstract: There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, a package board includes: a first insulating layer; a second insulating layer formed beneath the first insulating layer; a capacitor embedded in the first insulating layer and including a first electrode, a second electrode, and a dielectric layer formed between the first electrode and the second electrode; circuit layers formed on the first insulating layer and the second insulating layer; and a via formed between the capacitor and the circuit layers or between the circuit layers formed on the first insulating layer and the second insulating layer to electrically connect thererbetween, wherein an upper surface of the first electrode is formed to be exposed from the first insulating layer.

Abstract: Disclosed herein is a circuit board in which a metal plate is provided on a surface coupled to a device, and a connection pad is exposed through an opening part of the metal plate to be electrically connected to the device. The circuit board may have the device mounted thereon and a connection terminal of the device and a connection pad of the circuit board may be connected to each other by a wire, or the like.

Abstract: A printed circuit board connected to one surface of a substrate and a first electronic component is mounted on the one surface. The printed circuit board includes at least one insulating layer and the insulating layer has a cavity accommodating at least a portion of the first electronic component formed therein, and the cavity has an internal surface made of an insulating material.

Abstract: Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc.

Abstract: There are provided a package board, a method of manufacturing the same, and a semiconductor package using the same. According to an exemplary embodiment of the present disclosure, the package substrate may include: an insulating layer; a circuit layer formed on and beneath the insulating layer; a capacitor formed in the insulating layer and including an upper electrode, a lower electrode, and a dielectric layer formed between the upper electrode and the lower electrode; and a via connecting the circuit layer to the upper electrode and the lower electrode.

Abstract: A package substrate and a method for manufacturing the same are disclosed. The method for manufacturing a package substrate in accordance with an aspect of the present invention includes: forming a first open hole corresponding to a shape of a bonding pad in a first photo resist; laminating a second photo resist on the first photo resist and forming a second open hole corresponding to shapes of a soldering pad, a circuit pattern layer and the bonding pad in the second photo resist; and forming a pattern plating layer up to a predetermined height in the first open hole and the second open hole.

Abstract: Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package includes: a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal.

Abstract: Disclosed herein are a printed circuit board and a manufacturing method thereof capable of improving poor inter-layer conduction by increasing inter-layer insulating property and rigidity. The manufacturing method of a printed circuit board includes: laminating a copper foil layer on upper and lower surfaces of an insulating layer; coating an insulating material on a surface of the copper foil layer; forming a circuit layer by etching the copper foil layer; laminating an insulator on the copper foil layer so as to enclose the insulating material and the circuit layer; forming a via in the insulator so as to be communicated with the circuit layer; and forming a circuit pattern on the insulator.

Abstract: A method of manufacturing a printed circuit board having a buried solder bump, including: preparing a carrier on which a circuit layer, a solder bump, and a circuit pattern formed on the solder bump are formed; pressing the carrier into an insulating layer so that the circuit layer, the solder bump and the circuit pattern are buried in the insulating layer; and removing the carrier.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulation layer; pattern parts formed on both surfaces of the insulation layer; a connection pad disposed between the pattern parts and having a step part; a first plated layer formed on the pattern part; an oxide film formed on a region excluding a region on which the first plated layer is formed; a second plated layer formed on the connection pad; and a solder ball covering the connection pad.

Abstract: A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package.