Abstract: A method of forming a semiconductor arrangement includes forming a first capacitor in a first voltage domain and forming a second capacitor in the first voltage domain. The first capacitor is connected in parallel with the second capacitor. A third capacitor and a fourth capacitor are formed in a second voltage domain. The third capacitor is connected in series with the fourth capacitor. The first capacitor and the second capacitor are connected in parallel with a supply terminal of the first voltage domain and a reference terminal of the first voltage domain. The fourth capacitor is connected to a supply terminal of the second voltage domain. The third capacitor is connected to a reference terminal of the second voltage domain.

Abstract: A method for object grasping, including: determining features of a scene; determining candidate grasp locations; determining a set of candidate grasp proposals for the candidate grasp locations; optionally modifying a candidate grasp proposal of the set; determining grasp scores associated with the candidate grasp proposals; selecting a set of final grasp proposals based on the grasp scores; and executing a grasp proposal from the set of final grasp proposals.

Abstract: Various layouts for conductive interconnects in the conductor layers in an integrated circuit are disclosed. Some or all of the conductive interconnects are included in a power delivery system. In general, the conductive interconnects in a first conductor layer are arranged according to an orthogonal layout and the conductive interconnects in a second conductor layer are arranged according to a non-orthogonal layout. Conductive stripes in a transition conductor layer positioned between the first and the second conductor layers electrically connect the conductive interconnects in the first conductor layer to the conductive interconnects in the second conductor layer.

Abstract: An antenna includes a radiator arrangement and a feed mechanism operably coupled with the radiator arrangement for affecting operation of the radiator arrangement. The feed mechanism is configured to selectively operate in at least three different states. When the feed mechanism operates in a first state, the antenna operates in a first mode to provide a broadside radiation pattern. When the feed mechanism operates in a second state, the antenna operates in a second mode to provide an omnidirectional radiation pattern. When the feed mechanism operates in a third state, the antenna operates in a third mode to provide a unilateral radiation pattern.

Abstract: Provided are a data retransmission method and device, a storage medium, and an electronic device. The method includes: transmitting a first data packet, wherein the first data packet comprises data block identification information.

Abstract: An electronic device includes two speakers, a single functional chip, a parameter extraction circuit, an audio processing module, a gain adjusting circuit and a current detecting unit. The current detecting unit is disposed in the functional chip for detecting the driving current of the two speakers. The functional chip provides the driving voltage of the two speakers based on an output signal and converts the analogue current/voltages of the two speakers into digital current/voltages. The parameter extraction circuit acquires the parameter of each speaker based on the digital current/voltages. The audio processing module acquires the gains of various physical quantities based on the parameter of each speaker and determines the final gain of each physical quantity. The gain adjusting circuit provides the output signal by adjusting the gain of an input signal based on the final gain of each physical quantity.

Abstract: The invention discloses an active material ball composite layer. The active material ball composite layer includes a plurality of active material balls and an outer binder. The active material ball include a plurality of active material particles and a first conductive material. An inner binder is used to adhere the active material particles and the first conductive material to form the active material balls. Then, the outer binder is used to adhere the active material balls to form the composite layer. The elasticity of the inner binder is smaller than the elasticity of the outer binder. Therefore, the scale of expansion of the active material particles is efficiently controlled during charging and discharging. The unrecoverable voids would be reduced or avoided.

Abstract: A flame torch includes a body and a nozzle assembly. The body is provided with an igniter inside, and the igniter is connected to an electric arc wire. The nozzle assembly includes a barrel and a head seat. The barrel has a first end connected to the body, a second end opposite to the first end, and a gas conduit extending therethrough. The head seat is connected to the second end and has a spray hole and a side hole. The spray hole communicates with the gas conduit, allowing the gas passing through the gas conduit and spraying outside through the spray hole. The side hole extends radially along the spray hole and communicates with the spray hole. One end of the electric arc wire is connected to the igniter, and the other end of the electric arc wire passes through the head seat and is inserted into the side hole.

Abstract: In some aspects, a radar device may receive a received signal comprising a reflected frequency modulated continuous wave (FMCW) radar signal and interference. The radar device may identify the reflected FMCW radar signal based at least in part on performing a phase based search procedure to facilitate removing the interference from the received signal. The radar device may perform an action based at least in part on a characteristic of the identified reflected FMCW radar signal. Numerous other aspects are described.

Abstract: A micro-power wind-solar hybrid energy harvesting and power generating device including a solar power generation module, a wind power generation module, a control module, an energy storage module, and an accessory structure are provided. The solar power generation module is mainly composed of a solar thin film cell and a corresponding interface control circuit, and the wind power generation module includes a wind-induced vibration structure, a cantilever beam structure, a piezoelectric element, and a corresponding interface control circuit. The solar thin film cell is mounted at a top of the wind-induced vibration structure, and interface control circuits, the energy storage module, etc. are all arranged inside the wind-induced vibration structure. The control module is configured to handle an energy harvesting and power generating algorithm of the wind-solar hybrid power generating device to maximize the power generation quality and the power generation efficiency of the device.

Abstract: A CMOS image sensor includes a unit pixel array including a photodiode array, a color filter array, a micro-lens array, and a grid isolation structure laterally separating adjacent color filters. The grid isolation structure includes a first low-n grid, a second low-n grid underlying the first low-n grid, and a metal grid within the second low-n grid, the first low-n grid being narrower than the second low-n grid. The color filter array includes color filter matrixes, all color filter matrixes have the same arrangement pattern. Sizes of color filters in each color filter matrix vary depending on locations of the color filters in the color filter matrix. In an edge portion, a distance between a center of a color filter matrix and a center of a corresponding unit pixel matrix in plan view varies depending on a location of the unit pixel matrix in the CMOS image sensor.

Abstract: An integrated circuit includes a first power rail on a back-side of a wafer and being configured to supply a first voltage, a header circuit coupled to the first power rail and being configured to supply the first voltage to the first power rail, a second and third power rail on the back-side of the wafer, a fourth power rail on a front-side of the wafer, and a fifth power rail on the back-side of the wafer. The second and third power rail being configured to supply a second voltage. The fourth power rail includes a first set of conductors configured to supply a third voltage to the header circuit. The fifth power rail is configured to supply the third voltage and is separated from the first power rail in a first and second direction, and is separated from the second and third power rail in the first direction.

Abstract: The invention discloses an active material ball electrode layer structure, which mainly includes the active material balls made of the active material particles, a first mixed electrolyte located inside the active material balls, and a second mixed electrolyte located outside the active material balls. The first mixed electrolyte is mainly made of the deformable electrolyte. The second mixed electrolyte is mainly made of the electrolyte with relatively lesser deformation than the deformable electrolyte of the first mixed electrolyte. The invention utilizes the first mixed electrolyte to effectively active material ball reduce the derived problems of the volume change of the active materials. Moreover, the different configuration of the first mixed electrolyte and the second mixed electrolyte inside and outside the active material balls is utilized to reduce the charge transfer resistance. Also, the expansion resistance is provided for the active material balls.

Abstract: A wireless terminal receives a network identifier in a message received on a broadcast channel. The wireless terminal determines that a mobile network code in the network identifier corresponds to a non-terrestrial network. The wireless terminal updates a tracking area list of the wireless terminal by adding or deleting a tracking area identifier corresponding to the non-terrestrial network to the tracking area list.

Abstract: A wireless terminal receives a network identifier in a message received on a broadcast channel. The wireless terminal determines that a mobile network code in the network identifier corresponds to a non-terrestrial network. The wireless terminal updates a tracking area list of the wireless terminal by adding or deleting a tracking area identifier corresponding to the non-terrestrial network to the tracking area list.

Abstract: Methods and systems for mobility management in non-terrestrial networks are disclosed. In one embodiment, a method performed by a first communication node, includes: during a first time period, communicating with a non-terrestrial communication node utilizing a first communication link, wherein the non-terrestrial communication node provides at least one geographic cell in which a user equipment device (UE) is present during the first time period; during a second time period, communicating with a second communication node utilizing a second communication link, wherein a third communication link is established between the non-terrestrial communication node and the second communication node and the first communication link is no longer utilized during the second time period; and determining to maintain the first communication node as an anchor node for communications between a core network and the UE during both the first and second time periods.

Abstract: A method of manufacturing a semiconductor device includes forming a set of cells; forming a PG layer, including forming a first metallization layer including forming first conductor portions and second conductor portions, corresponding ones of the first conductor portions being arranged in first pairs; corresponding ones of the second conductor portions being arranged in second pairs; the cells being arranged to overlap at least one of the first and second conductor portions of the first metallization layer relative to the first direction; and forming a second metallization layer over the first metallization layer, the second metallization layer including forming third conductor portions and fourth conductor portions, the cells being arranged in a repeating relationship that each cell overlaps, an intersection of a corresponding one of the first or second pairs with at least a corresponding one of the third conductor portions or a corresponding one of the fourth conductor portions.

Abstract: An IC device includes first and second circuits adjacent each other and over a substrate. The first circuit includes a first IO pattern along a first track among a plurality of tracks in a first metal layer, the plurality of tracks elongated along a first axis and spaced from each other along a second axis. The second circuit includes a plurality of conductive patterns along corresponding different tracks among the plurality of tracks in the first metal layer, each of the plurality of conductive patterns being an IO pattern of the second circuit or a floating conductive pattern. The first metal layer further includes a first connecting pattern along the first track and connecting the first IO pattern and a second IO pattern of the second circuit. The second IO pattern is one of the plurality of conductive patterns of the second circuit and is along the first track.

Abstract: A position-adjustable probing device comprises a stationary probe comprising a first coaxial structure having a first needle core, a first dielectric layer, and a first exterior conductive layer, and a first and a second movable probes. The first movable probe arranged at a first side of the stationary probe comprises a ground needle core, and a first extending structure comprising a first planar structure electrically contacted with the stationary probe through a first movement, a first top surface and a first bottom surface. The second movable probe arranged at a second side of the stationary needle comprises a second coaxial structure comprising a second needle core, a second dielectric layer, and a second exterior conductive layer, and a second extending structure comprising a second planar structure electrically contacted with the stationary probe through a second movement, a second top surface, and a second bottom surface.

Abstract: A method (of generating a revised layout diagram of a conductive line structure for an IC) including: for a first set of pillar patterns that represents portions of an M(i) layer of metallization and where i is a non-negative number, the first set including first and second pillar patterns which extend in a first direction, are non-overlapping of each other with respect to the first direction, are aligned with each other and have a first distance of separation, determining a first distance of separation as between corresponding immediately adjacent members of the first set; recognizing that the first distance is less than a transverse routing (TVR) separation threshold for an M(i+j) layer of metallization, where j is an integer and j?2; and increasing the first distance so as to become a second distance which is greater than the TVR separation threshold of the M(i+j) layer.