Abstract: A method of manufacturing a rectangular tube having a stepped portion includes: forming V-shaped grooves on a rectangular tube at surfaces of an end thereof in a direction parallel to a longitudinal direction thereof; and pressing each of the surfaces having the V-shaped grooves formed thereon with a rotating roll from outside to inside, whereby the end of the rectangular tube is radially reduced.

Abstract: According to one embodiment, an electronic device includes an underlying region, a variable capacitor including fixed electrodes and movable electrodes alternately arranged in a direction not perpendicular to a main surface of the underlying region, and a protective film which covers the variable capacitor and includes a conductive portion electrically connected to the fixed electrodes and having a hole.

Abstract: According to one embodiment, a method of manufacturing a device is provided. A amorphous metal layer is formed. A metal layer containing metal and having a crystal plane oriented to a predetermined plane is formed on the amorphous metal layer. A first layer containing semiconductor including silicon, and metal identical to the metal contained in the metal layer is formed on the metal layer. The first layer is changed to a second layer containing a compound of the semiconductor and the metal, the compound having a crystal plane oriented to the predetermined plane. A third layer containing polycrystalline silicon-germanium and having a crystal plane oriented to the predetermined plane is formed on the second layer.

Abstract: According to one embodiment, an analysis package including a board including an electrical terminal, an analysis chip provided at the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid for particle detection to the detector, and a liquid receiver for introducing the sample liquid into the flow channel, a mold provided to cover the board on which the analysis chip is provided, the mold comprising an opening above the liquid receiver, a first shield layer provided on a back surface of the board, and a second shield layer provided to be attachable and detachable on an opposite side to the analysis chip of the mold, the second shield layer being electrically connected to a part of the electrical terminal.

Abstract: According to one embodiment, an electronic device includes a base region, an element portion located on the base region, the element portion including a movable portion, and a protective film overlying the element portion and forming a cavity on an inner side of the protective film. The protective film includes a first protective layer and a second protective layer located on the first protective layer. A hole extends in a direction parallel to a main surface of the base region, and the second protective layer covers the hole.

Abstract: A method of manufacturing a rectangular tube having a stepped portion includes: forming V-shaped grooves on a rectangular tube at surfaces of an end thereof in a direction parallel to a longitudinal direction thereof; and pressing each of the surfaces having the V-shaped grooves formed thereon from outside to inside, whereby the end of the rectangular tube is radially reduced.

Abstract: An ironing mold according to the present invention is provided with a punch, and a die which forms a pushing hole with respect to the punch. When the skewness Rsk of a surface treated metal plate is less than ?0.6 and no less than ?1.3, then the curvature radius of a shoulder portion of the die and a clearance between a radius end and the punch are determined such that Y, which is expressed by {(tre?cre)/tre}×100, and X, which is expressed by r/tre, satisfy 0<Y?18.7X?6.1, X satisfies X?0.6 and r satisfies r?0.5 h.

Abstract: A formed material is manufactured by performing forming including at least one drawing-out process and at least one drawing process performed after the drawing-out process. A punch 31 used in the drawing-out process is formed to be wider on a rear end side than on a tip end side. By pushing a raw material metal plate into a pushing hole 30a together with the punch 31, ironing is performed on a region of the raw material metal plate corresponding to a flange portion.

Abstract: The invention provides a formed material manufacturing method by which unnecessary thickening of a flange can be avoided. The formed material manufacturing method allows a formed material to be manufactured by forming processes that include at least one drawing-out process, at least one drawing process performed after the drawing-out process, and at least one coining process performed after the drawing process. The width of the rear end side of a punch used in the drawing-out process is set to be wider than the width of the tip end side thereof. An ironing process is performed on a region corresponding to the flange of the base metal sheet by pushing the base metal sheet together with the punch into a pushing hole.

Abstract: According to one embodiment, a semiconductor micro-analysis chip includes a first flow channel provided with a substrate surface, the flow channel engraved on the substrate into which a sample liquid can flow, micropore provided with a part of the flow channel, a reservoir provided with at least one end of the flow channel, the reservoir engraved on the substrate for inlet, and outlet of the sample liquid, and a first electrode provided with a part of the flow channel or of the reservoir. The electrode is disposed from the bottom surface of the flow channel or of the reservoir to the substrate surface, and a side surface which connects the bottom surface and the substrate surface is tapered for reducing a bend in a height direction of the electrode.

Abstract: According to one embodiment, a particle inspection system includes a voltage driving circuit which applies a driving voltage for a particle inspection to a particle inspection chip, a current-voltage conversion circuit which converts, into a voltage signal, a current signal output from the particle inspection chip when the driving voltage is applied to the particle inspection chip, a detection circuit which detects, based on the voltage signal, whether the sample liquid is introduced into a detection region of the particle inspection chip, and an analysis circuit which analyzes the fine particle, in the sample liquid based on the voltage signal. The voltage driving circuit varies the driving voltage based on the detection result of the detection circuit.

Abstract: According to one embodiment, a semiconductor analysis chip for detecting a particle in a sample liquid includes a semiconductor substrate, a first flow channel provided in a surface portion of the semiconductor substrate, a second flow channel provided in a surface portion of the semiconductor substrate, part of the second flow channel contacting or intersecting the first flow channel, a micropore provided in a contact portion or an intersection of the first and second flow channels, and configured to permit the particle to pass therethrough, a first electrode provided in the first flow channels, a second electrode provided in the second passage, and a third electrode provided in the first flow channel downstream of the first electrode.

Abstract: An ironing mold according to the present invention includes a punch that is inserted into a formed portion, and a die having a pushing hole into which the formed portion is pushed together with the punch. An inner peripheral surface extends non-parallel to an outer peripheral surface of the punch, and the inner peripheral surface is provided with a clearance that corresponds to an uneven plate thickness distribution, in the pushing direction, of the formed portion prior to the ironing relative to the outer peripheral surface to ensure that an amount of ironing applied to the formed portion remains constant in the pushing direction.

Abstract: An ironing mold according to the present invention is provided with a punch, and a die which forms a pushing hole with respect to the punch. When the skewness Rsk of a surface treated metal plate is less than ?0.6 and no less than ?1.3, then the curvature radius of a shoulder portion of the die and a clearance between a radius end and the punch are determined such that Y, which is expressed by {(tre?cre)/tre}×100, and X, which is expressed by r/tre, satisfy 0<Y?18.7X?6.1, X satisfies X?0.6 and r satisfies r?0.5 h.

Abstract: According to one embodiment, a particle inspection system includes an inspection module and a determination module. The inspection module includes a particle inspection chip includes electrodes for detecting existence of particles in a sample liquid by a change in an electrical signal, and a memory element which is provided separately from the electrodes and configured to store whether the inspection chip is a used chip or not. The determination module includes a determination circuit configured to determine the existence of the particles based on a detection signal of the inspection chip, and a control circuit configured to control an operation of the determination circuit from information in the memory element.

Abstract: A formed material manufacturing method according to present invention includes the steps of forming a convex formed portion by performing at least one forming process on a surface treated metal plate, and performing ironing on the formed portion using an ironing mold after forming the formed portion. The ironing mold includes a punch that is inserted into the formed portion, and a die having a pushing hole into which the formed portion is pushed together with the punch. An inner peripheral surface of the pushing hole extends non-parallel to an outer peripheral surface of the punch, and the inner peripheral surface is provided with a clearance that corresponds to an uneven plate thickness distribution, in the pushing direction, of the formed portion prior to the ironing relative to the outer peripheral surface to ensure that an amount of ironing applied to the formed portion remains constant in the pushing direction.

Abstract: According to one embodiment, an electronic device includes an underlying region, a variable capacitor including fixed electrodes and movable electrodes alternately arranged in a direction not perpendicular to a main surface of the underlying region, and a protective film which covers the variable capacitor and includes a conductive portion electrically connected to the fixed electrodes and having a hole.

Abstract: According to one embodiment, a method of manufacturing a device is provided. A amorphous metal layer is formed. A metal layer containing metal and having a crystal plane oriented to a predetermined plane is formed on the amorphous metal layer. A first layer containing semiconductor including silicon, and metal identical to the metal contained in the metal layer is formed on the metal layer. The first layer is changed to a second layer containing a compound of the semiconductor and the metal, the compound having a crystal plane oriented to the predetermined plane. A third layer containing polycrystalline silicon-germanium and having a crystal plane oriented to the predetermined plane is formed on the second layer.

Abstract: According to one embodiment, a sensor includes a substrate, a first MEMO element provided on the substrate, a cap layer providing a cavity for accommodating the first MEMS element, and a second MEMS element for monitoring a pressure in the cavity, the second MEMS element being provided on the substrate in the cavity.

Abstract: According to one embodiment, an analysis package, including a board, an analysis chip provided on the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid, and a liquid receiver of the sample liquid, a first mold layer provided on the analysis chip, the first mold layer including an opening above the liquid receiver, and a second mold layer provided on the board and the first mold layer, the second mold layer including an opening above the opening of the first mold layer, wherein the respective openings of the first and second mold layers are connected above the liquid receiver to allow the sample liquid to be introduced into the liquid receiver from outside.