Abstract: A projection exposure apparatus comprising:an illumination, optical system for irradiating a mask with illumination light;a projection optical system for projecting an image of a pattern formed on the mask onto a substrate;an optical member for defining a light quantity distribution of the illumination light on a Fourier transform plane to the pattern on the mask in the illumination optical system or on a plane in the vicinity thereof such that the illumination light is intensified in a first region inside a substantial circle of radius r.sub.1 with the center on the optical axis of the illumination optical system and in a second region formed as a substantially annular zone bordered by a substantial circle of radius r.sub.2 and a substantial circle of radius r.sub.3 (where r.sub.1 .ltoreq.r.sub.2 <r.sub.

Abstract: In a method of manufacturing a lithographic mask by generating a plurality of light-shielding or transparent pattern elements with respect to a predetermined energy beam on a predetermined original plate on the basis of design data defining shapes and layout of the respective pattern elements, it is determined whether an outer edge of a specific pattern element of a predetermined width or less in the plurality of pattern elements is spaced apart from other pattern elements adjacent thereto by a predetermined distance or more. The design data is corrected so as to complementarily expand the outer edge portion of the specific pattern element outward from other outer edge portions by a small amount when the outer edge portion of the specific pattern element is spaced apart from the other pattern elements by the predetermined distance or more. The plurality of pattern elements are generated on the original plate on the basis of the corrected design data.

Abstract: An exposure apparatus for reproducing a mask pattern onto a photo-sensitive surface of a substrate using holographic techniques.

Abstract: An exposure apparatus is used for reproducing a mask pattern of a semiconductor device or the like onto a photosensitive substrate using a holography. The holography is utilized also in a process for alignment between a mask pattern hologram and an exposure region of the substrate. The pattern hologram is recorded to a recording medium by interference between an object wave from the pattern and a reference wave, and a second hologram is formed to the medium by diffraction light from an alignment mark formed on the mask. Prior to reconstruction of the pattern image, reconstruction light from the second hologram, illuminated with a reconstruction wave, is irradiated onto the substrate arranged in place of the mask. A reproduction image of the alignment mark on the substrate surface illuminated with the reconstruction light is measured, and relative displacement between the medium and the substrate is detected from a result of the measurement.

Abstract: In an exposure method of illuminating a pattern formed on a mask with illumination light from an illumination optical system, and projecting/exposing an image of the pattern on a photosensitive substrate through a projection optical system, the pattern includes a transmission portion having a transmittance of about 1 with respect to the illumination light and a phase shift transmission portion which provides a phase difference of about (2n+1).pi. (n is an integer) with respect to the light transmitted through the transmission portion, and has a pattern width not more than a resolving limit of the projection optical system.

Abstract: In a projection exposure apparatus wherein a stage is moved in the direction of optic axis when a mask formed with a predetermined pattern is projected by a shutter onto a photosensitive substrate placed on the stage through a projection optical system, the operations of control means for the shutter and control means for the stage are interlocked with each other on the basis of the operational characteristic of the shutter and the operational characteristics (particularly the speed characteristic) of the stage so that the distribution of the existence probability with respect to movement of the photosensitive substrate from the opening operation starting point of time till the closing operation completing point of time of the shutter, with respect to the direction of the optic axis, may assume substantially equal maximum values at at least two locations in the direction of the optic axis.

Abstract: On the pupil plane of the projection optical system, a light shield member, having apertures separated from the optical axis, is provided. Light beams from the apertures illuminate a photomask from oblique directions, and are projected on a photosensitive substrate through a projection optical system. When the photomask bears a periodic pattern and a non-periodic pattern, the oblique illumination provides a larger depth of focus in the projected image of the periodic pattern than in the projected image of the non-periodic pattern. A partial area, in which the non-periodic pattern is projected, of the photosensitive substrate is matched with the best focal plane of the projection optical system, whereby satisfactory image transfer is realized over the entire area of the photomask.

Abstract: In order to effect projection exposure at a great depth of focus without spoiling transfer fidelity even for a plurality of isolated patterns relatively close to one another, provision is made of a coherence reducing member CCM for reducing the coherency between imaging light in a central circular transmitting portion FA on or near the pupil plane (Fourier transform plane) of a projection optical system and imaging light in a marginal zonal transmitting portion FB, and a double focalizing member DFM for making the in-focus position of light passing through the circular transmitting portion FA and the in-focus position of light passing through the zonal transmitting portion FB differ in the direction of the optical axis of the projection optical system.

Abstract: A projection exposure apparatus having an illuminating system for irradiating a mask having a pattern with illuminating light and a projection optical system for taking in light emanating from the pattern of the mask and for projecting an image of the pattern on a photosensitive substrate. The projection exposure apparatus further includes a phase plate disposed on or near a Fourier transform plane in an image-forming optical path between the mask and the photosensitive substrate so that the amplitude of light passing through a circular region of radius r.sub.

Abstract: A projection exposure apparatus provided with an illumination optical system for shaping the illuminating light from a light source into a substantially uniform intensity distribution and irradiating a mask bearing a periodical pattern with the uniform illuminating light, and a projection optical system for forming an image of the mask pattern onto a photosensitive substrate, comprise an optical member for forming plural secondary light source images respectively in discrete positions, eccentric from the optical axis of the illumination optical system or the projection optical system, on a plane in the vicinity of a Fourier transformation plane of the mask pattern or a plane conjugate therewith, in the optical path of the illumination optical system; a light amount varying device for individually regulating the light amounts of the illuminating light emerging from the plural secondary light source images; and a control device for controlling the light amount varying device, according to the direction of local

Abstract: An apparatus includes an illumination system for illuminating a pattern formed on a mask with exposure light, a projection optical system for focusing and projecting an image of the mask pattern on a photosensitive substrate, and a stop member located on or near a plane having a Fourier transform relationship with a pattern surface of the mask. The illumination system has a variable optical member for setting variable the size of the exposure light passing through the plane having the Fourier transform relationship with the pattern surface of the mask. The stop member shields or reduces a portion near the central portion of the exposure light.

Abstract: A projection type light exposure apparatus comprises, a mask having a fine pattern and at least one auxiliary pattern spaced from the fine pattern by a predetermined distance along an edge of the fine pattern, a projection optical system for projecting the fine pattern on the mask onto a photosensitive substrate, an illumination optical system for supplying an illumination light to the mask, and the illumination light being irradiated from at least one local area centered at a position eccentric from an optical axis of the illumination optical system in or a vicinity of a Fourier transform plane of the mask in the illumination optical system.

Abstract: In a projection exposure apparatus wherein a stage is moved in the direction of optic axis when a mask formed with a predetermined pattern is projected by a shutter onto a photosensitive substrate placed on the stage through a projection optical system, the operations of control means for the shutter and control means for the stage are interlocked with each other on the basis of the operational characteristic of the shutter and the operational characteristics (particularly the speed characteristic) of the stage so that the distribution of the existence probability with respect to movement of the photosensitive substrate from the opening operation starting point of time till the closing operation completing point of time of the shutter, with respect to the direction of the optic axis, may assume substantially equal maximum values at at least two locations in the direction of the optic axis.

Abstract: A projection type exposure apparatus comprises:a light source for radiating illumination light for exposure;an illumination optical system for irradiating with the illumination light a mask having a first pattern and a second pattern extending perpendicular to each other;the illumination optical system having a fly eye type integrator for forming a plurality of images of the light source on or near a Fourier transform plane to a pattern surface of the mask;a projection optical system for projecting an image of the patterns of the mask on a photosensitive substrate; anda stop member for restricting passage of the illumination light through the Fourier transform plane to an annular zone with center on an optical axis of the illumination optical system and for partially shielding or reducing the plurality of images of the light source such that a number of images of the light source contributing to a resolution of the first pattern is substantially identical with that of images of the light source contributing t

Abstract: An exposing method utilizing an exposure apparatus provided with an illuminating optical system and a projection optical system, wherein the illuminating optical system is adapted to illuminate a mask from an inclined direction with a predetermined incident angle, and the mask is provided with a periodic pattern composed of opaque portions and transparent portions narrower than the opaque portions, and wherein the projection optical system is adapted to form an image of the pattern on an object of exposure, coated with a photosensitive material subjected to a surface insolubilizing treatment, the exposing method comprising:a first step of illuminating the periodic pattern by a light beam passing through an area eccentric from and not including the optical axis of the illuminating optical system on a Fourier transformation plane of the periodic pattern or a conjugate plate thereof in the illuminating optical system; anda second step for causing a relative displacement or a relative vibration between the image

Abstract: A projection exposure apparatus having an irradiation optical system for irradiating a pattern formed on a mask with first irradiation light, a projection optical system for imaging and projecting the image of the pattern of the mask onto a photosensitive substrate, and a mark detection device for irradiating a predetermined mark formed on the photosensitive substrate with second irradiation light in a wavelength region which is different from that of the first irradiation light by the projection optical system and detecting light generated from the mark, the projection exposure apparatus including: a deflection member disposed on a pupil surface of the projection optical system or in a periphery in an adjacent plane of the same, shielding a beam, which is a portion of the first irradiation light generated from the mask and incident on the projection optical system, and which passes through the peripheral portion of the pupil surface of the projection optical system, deflecting the second irradiation light by

Abstract: A device for positioning a circular substrate having a cut portion, comprising: a first rotational stage which is finely rotated around the origin of a rectangular coordinate system; an X-Y stage on the first rotational stage which is two-dimensionally moved in the coordinate system; a second rotational stage on the X-Y stage which is rotated while holding the substrate; a first detecting device for detecting information about the displacement change of the periphery of the substrate from the rotational center during the rotation of the second rotational stage; a first positioning controlling device for controlling the rotation of the second rotational stage in accordance with information detected by the first detecting device so that the cut portion is placed in a predetermined direction on the coordinate system; a second detecting device having three or more detecting points in the coordinate system so as to detect the three or more positions of the periphery, the second detecting device generating informat

Abstract: An exposure apparatus for exposing on a substrate a pattern formed on a mask, comprises a projection optical system for forming the pattern on a predetermined focusing plane and projecting an image of the pattern on the substrate located to be substantially aligned with the focusing plane, driving means for three-dimensionally moving the mask or at least one of a plurality of optical system, or for inclining the mask or said at least one of the plurality of optical members with respect to a plane substantially perpendicular to an optical axis of the projection optical system and correcting means for driving the driving means to anisotropically change optical characteristics of the projection optical system so that the projected image of the pattern is matched with a pattern already formed on the substrate.