Patents by Inventor Naoyuki Tamura
Naoyuki Tamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20030168173Abstract: The vacuum processing device comprises vacuum processing chambers 30a and 30b for performing predetermined treatments to a wafer being transferred to a predetermined position within the chamber, an atmospheric transfer equipment 7 for transferring a wafer in atmospheric air to a vacuum transfer equipment 10, a vacuum transfer equipment 10 disposed within a vacuum transfer chamber 2 connecting the atmospheric air and said vacuum processing chambers for transferring the wafer received from said atmospheric transfer equipment to said predetermined position within said vacuum processing chamber, and wafer position sensors 11a, 11b, 11c and 11d disposed near the ingress path leading into said processing chambers for detecting the displacement of said wafers being transferred.Type: ApplicationFiled: August 15, 2002Publication date: September 11, 2003Inventor: Naoyuki Tamura
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Publication number: 20030160568Abstract: There is provided a plasmar processing apparatus capable of positively controlling the temperature distribution of a semiconductor wafer during etching processing in a clear state, wherein an electrode block is provided with independent slits as coolant flow paths on the inner and outer peripheries and, at the same time, between these slits is formed a slit for suppressing heat transfer between the inner and outer peripheries, and owing to this slit for suppressing heat transfer, a uniform temperature in the electrode block is suppressed and thus it is possible to obtain an arbitrary independent temperature in the plane of the electrode block and positive and clear control of temperature distribution patterns can be performed.Type: ApplicationFiled: February 27, 2002Publication date: August 28, 2003Inventors: Masatsugu Arai, Ryujiro Udo, Naoyuki Tamura, Masanori Kadotani, Motohiko Yoshigai
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Patent number: 6610171Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: GrantFiled: March 28, 2002Date of Patent: August 26, 2003Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6610170Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: GrantFiled: March 28, 2002Date of Patent: August 26, 2003Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6544379Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: GrantFiled: February 8, 2001Date of Patent: April 8, 2003Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6524428Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: GrantFiled: May 7, 2001Date of Patent: February 25, 2003Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Publication number: 20020108574Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: ApplicationFiled: March 28, 2002Publication date: August 15, 2002Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Publication number: 20020104618Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: ApplicationFiled: March 28, 2002Publication date: August 8, 2002Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Publication number: 20020096116Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: ApplicationFiled: March 28, 2002Publication date: July 25, 2002Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Publication number: 20020046706Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: ApplicationFiled: December 21, 2001Publication date: April 25, 2002Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6336991Abstract: In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased, and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.Type: GrantFiled: July 2, 1998Date of Patent: January 8, 2002Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Publication number: 20010044816Abstract: Upon execution of four sets of m/2 bit×n/2 bit multiplication, four multiplicand selectors select m/2-bit multiplicands respectively and four multiplicator selectors select corresponding n/2-bit multiplicators respectively, then the selected m/2-bit multiplicands and n/2-bit multiplicators are input into four multipliers, and then four sets of m/2 bit×n/2 bit multiplication are executed in parallel.Type: ApplicationFiled: July 17, 2001Publication date: November 22, 2001Inventors: Naoka Yano, Naoyuki Tamura
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Patent number: 6311199Abstract: A sign extension unit has first and second sign extenders to extend a sign bit, i.e., the most significant bit of input data to the higher side of the input data. The input data is divided into n-bit blocks. The first sign extender carries out sign extension based on highest bits of the blocks, and the second sign extender carries out sign extension in each of the blocks based on the highest bits of the respective blocks.Type: GrantFiled: November 25, 1998Date of Patent: October 30, 2001Assignee: Kabushiki Kaisha ToshibaInventors: Naoyuki Tamura, Takeshi Yoshida
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Publication number: 20010025608Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: ApplicationFiled: May 7, 2001Publication date: October 4, 2001Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6286024Abstract: Upon execution of four sets of m/2 bit×n/2 bit multiplication, four multiplicand selectors select m/2-bit multiplicands respectively and four multiplicator selectors select corresponding n/2-bit multiplicators respectively, then the selected m/2-bit multiplicands and n/2-bit multiplicators are input into four multipliers, and then four sets of m/2 bit×n/2 bit multiplication are executed in parallel.Type: GrantFiled: September 18, 1998Date of Patent: September 4, 2001Assignee: Kabushiki Kaisha ToshibaInventors: Naoka Yano, Naoyuki Tamura
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Publication number: 20010009178Abstract: Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface.Type: ApplicationFiled: February 8, 2001Publication date: July 26, 2001Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6221201Abstract: Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface.Type: GrantFiled: July 2, 1998Date of Patent: April 24, 2001Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6217705Abstract: A substrate holding system is provided for holding a substrate in a substrate etching apparatus by using electrostatic force. An electrical insulating member is also provided having a top surface approximately at the same level as the treated surface of the substrate and having an inner side surface in adjacent relationship with a surface of the substrate forming the periphery of the substrate. The inner side surface of the electrical insulating member faces the periphery of the substrate in substantially parallel relationship with a direction normal to the treated surface of the substrate. A dielectric film is formed on one surface of a metallic member having a flow passage for circulating a coolant to control the temperature of the substrate. An electrically insulating material member is placed on and in contact with a surface of the metallic member.Type: GrantFiled: January 7, 2000Date of Patent: April 17, 2001Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshitumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6161867Abstract: A skid bar is mountable on existing front tow hooks of a vehicle, for protecting an engine, transmission and/or engine accessories from severe road conditions. The skid bar includes an elongated lateral member and a pair of end plates fixed to opposing ends of the lateral member. The end plates correspond to and are engageable with the existing tow hooks of the vehicle. The underguard skid bar extends in front of and below an engine/transmission assembly for protecting the same when the vehicle is travelling on a road having severe obstacles such as road bumps or road gutters. Each end plate has a plurality of bolt holes corresponding to tow openings in the existing tow hooks, such that each end plate is securable to the existing tow hooks, by being bolted thereto, through the tow openings in the existing tow hooks. Furthermore, each of the end plates presents a tow opening in a forward portion thereof.Type: GrantFiled: October 3, 1997Date of Patent: December 19, 2000Assignee: Honda Giken Kogyo Kabushiki KaishaInventor: Naoyuki Tamura
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Patent number: 6048434Abstract: A substrate holding system is provided for holding a substrate in a substrate etching apparatus by using electrostatic force. An electrical insulating member is also provided having a top surface approximately at the same level as the treated surface of the substrate and having an inner side surface in adjacent relationship with a surface of the substrate forming the periphery of the substrate. The inner side surface of the electrical insulating member faces the periphery of the substrate in substantially parallel relationship with a direction normal to the treated surface of the substrate. A dielectric film is formed on one surface of a metallic member having a flow passage for circulating a coolant to control the temperature of the substrate. An electrically insulating material member is placed on and in contact with a surface of the metallic member.Type: GrantFiled: June 20, 1996Date of Patent: April 11, 2000Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone