Abstract: A monolithic gas-sensing chip assembly for sensing a gas analyte includes a sensing material to detect the gas analyte, a sensing system including a resistor-capacitor electrical circuit, and a heating element. A sensing circuit measures an electrical response of the sensing system to an alternating electrical current applied to the sensing system at (a) one or more different frequencies, or (b) one or more different resistor-capacitor configurations of the system. One or more processors control a low detection range of the system to the gas, a high detection range of the system to the gas, a linearity of a response of the system to the gas, a dynamic range of measurements of the gas by the system, a rejection of interfering gas analytes by the system, a correction for aging or poisoning of the system, or a rejection of ambient interferences that may affect the electrical response of the system.

Abstract: A monolithic gas-sensing chip assembly for sensing a gas analyte includes a sensing material to detect the gas analyte, a sensing system including a resistor-capacitor electrical circuit, and a heating element. A sensing circuit measures an electrical response of the sensing system to an alternating electrical current applied to the sensing system at (a) one or more different frequencies, or (b) one or more different resistor-capacitor configurations of the system. One or more processors control a low detection range of the system to the gas, a high detection range of the system to the gas, a linearity of a response of the system to the gas, a dynamic range of measurements of the gas by the system, a rejection of interfering gas analytes by the system, a correction for aging or poisoning of the system, or a rejection of ambient interferences that may affect the electrical response of the system.

Abstract: A monolithic gas-sensing chip assembly for sensing a gas analyte includes a sensing material to detect the gas analyte, a sensing system including a resistor-capacitor electrical circuit, and a heating element. A sensing circuit measures an electrical response of the sensing system to an alternating electrical current applied to the sensing system at (a) one or more different frequencies, or (b) one or more different resistor-capacitor configurations of the system. One or more processors control a low detection range of the system to the gas, a high detection range of the system to the gas, a linearity of a response of the system to the gas, a dynamic range of measurements of the gas by the system, a rejection of interfering gas analytes by the system, a correction for aging or poisoning of the system, or a rejection of ambient interferences that may affect the electrical response of the system.

Abstract: A monolithic gas-sensing chip assembly for sensing a gas analyte includes a sensing material to detect the gas analyte, a sensing system including a resistor-capacitor electrical circuit, and a heating element. A sensing circuit measures an electrical response of the sensing system to an alternating electrical current applied to the sensing system at (a) one or more different frequencies, or (b) one or more different resistor-capacitor configurations of the system. One or more processors control a low detection range of the system to the gas, a high detection range of the system to the gas, a linearity of a response of the system to the gas, a dynamic range of measurements of the gas by the system, a rejection of interfering gas analytes by the system, a correction for aging or poisoning of the system, or a rejection of ambient interferences that may affect the electrical response of the system.

Abstract: A transducer assembly is provided. The transducer assembly includes an aperture comprising a plurality of transducer elements. The transducer assembly also includes a plurality of first-level summers, wherein each transducer element is configured to be switchably coupled to at least four of the plurality of first-level summers. The transducer assembly further includes a plurality of second-level summers, wherein an output of each of the plurality of first-level summers is configured to be switchably coupled to an input of one of the plurality of second-level summers.

Abstract: A transducer assembly is provided. The transducer assembly includes a routing layer. The transducer assembly further includes a plurality of transducer elements arranged on a first side of the interposer. The transducer assembly also includes a first application specific integrated circuit (ASIC) arranged vertically below the plurality of transducer elements and on a second side of the interposer, wherein the first ASIC comprises a plurality of signal conditioning circuits.

Abstract: A system including a low noise amplifier is provided. The system further includes a coarse attenuation circuit coupled to an input of the low noise amplifier and configurable to attenuate an input signal by a coarse attenuation interval. The system also includes a fine attenuation circuit coupled in feedback with the low noise amplifier and configurable to attenuate the input signal by a fine attenuation interval, wherein the fine attenuation interval is less than the coarse attenuation interval.

Abstract: An analog-to-digital converter (ADC) is provided includes a first sigma-delta modulator (SDM) electrically coupled to a first signal input. The first SDM includes a first summing junction configured to receive a plurality of inputs to the first SDM. The ADC further includes a second sigma-delta modulator (SDM) electrically coupled to a second signal input. The second SDM includes a second summing junction configured to receive a plurality of inputs to the second SDM. The first SDM also includes a cross-coupled feedback loop from an output of the first SDM to a negative input of the first summing junction and to a positive input of the second summing junction. The second SDM also includes a cross-coupled feedback loop from an output of the second SDM to a negative input of the first summing junction and to a negative input of the second summing junction.

Abstract: Improved imaging systems are disclosed. More particularly, the present disclosure provides for an improved image sensor assembly for an imaging system, the image sensor assembly having an integrated photodetector array and its associated data acquisition electronics fabricated on the same substrate. By integrating the electronics on the same substrate as the photodetector array, this thereby reduces fabrications costs, and reduces interconnect complexity. Since both the photodiode contacts and the associated electronics are on the same substrate/plane, this thereby substantially eliminates certain expensive/time-consuming processing techniques. Moreover, the co-location of the electronics next to or proximal to the photodetector array provides for a much finer resolution detector assembly since the interconnect bottleneck between the electronics and the photodetector array is substantially eliminated/reduced.

Abstract: An impedance analyzer is provided. The analyzer includes a signal excitation generator comprising a digital to analog converter, where a transfer function of the digital to analog converter from digital to analog is programmable. The impedance analyzer further includes a receiver comprising a low noise amplifier (LNA) and an analog to digital converter (ADC), where the LNA is a current to voltage converter; where the programmable digital to analog transfer function is implemented by a direct digital synthesizer (DDS) and a voltage mode digital to analog converter, or a digital phase locked loop (PLL), or both. Further, a multivariable sensor node having an impedance analyzer is provided. Furthermore, a multivariable sensor network having a plurality of multivariable sensor nodes is provided.

Abstract: An analog-to-digital converter (ADC) is provided includes a first sigma-delta modulator (SDM) electrically coupled to a first signal input. The first SDM includes a first summing junction configured to receive a plurality of inputs to the first SDM. The ADC further includes a second sigma-delta modulator (SDM) electrically coupled to a second signal input. The second SDM includes a second summing junction configured to receive a plurality of inputs to the second SDM. The first SDM also includes a cross-coupled feedback loop from an output of the first SDM to a negative input of the first summing junction and to a positive input of the second summing junction. The second SDM also includes a cross-coupled feedback loop from an output of the second SDM to a negative input of the first summing junction and to a negative input of the second summing junction.

Abstract: An ultrasound probe analog to digital converter includes an input successive approximation register (SAR) first stage; and an output SAR second stage in communication with the input SAR first stage. The input SAR first stage includes a programmable preamplifier integrated therein for residue amplification. The preamplifier is programmed to alternate between a linear amplifier operating mode and a comparator operating mode.

Abstract: A method for multivariable measurements using a single-chip impedance analyzer includes providing a sensor, exposing the sensor to an environmental parameter, determining a complex impedance of the sensor over a measured spectral frequency range of the sensor, and monitoring at least three spectral parameters of the sensor.

Abstract: A system is provided that includes a controller that is configured to enable communication between one or more sensors and a processor. The controller includes a plurality of input-output (IO) ports each configured to couple to the one or more sensors. Moreover, each of the IO ports is configured to couple to a plurality of sensor types such that each IO port is configured to couple more than one sensor type. The controller also includes an interface configured to receive a selection of a selected mode from a plurality of modes each corresponding to a sensor type. Furthermore, the controller includes a switch block having a plurality of switches each configured to toggle a connection in the switch block according to the selected mode.

Abstract: Improved imaging systems are disclosed. More particularly, the present disclosure provides for an improved image sensor assembly for an imaging system, the image sensor assembly having an integrated photodetector array and its associated data acquisition electronics fabricated on the same substrate. By integrating the electronics on the same substrate as the photodetector array, this thereby reduces fabrications costs, and reduces interconnect complexity. Since both the photodiode contacts and the associated electronics are on the same substrate/plane, this thereby substantially eliminates certain expensive/time-consuming processing techniques. Moreover, the co-location of the electronics next to or proximal to the photodetector array provides for a much finer resolution detector assembly since the interconnect bottleneck between the electronics and the photodetector array is substantially eliminated/reduced.

Abstract: A system is provided that includes a controller that is configured to enable communication between one or more sensors and a processor. The controller includes a plurality of input-output (IO) ports each configured to couple to the one or more sensors. Moreover, each of the IO ports is configured to couple to a plurality of sensor types such that each IO port is configured to couple more than one sensor type. The controller also includes an interface configured to receive a selection of a selected mode from a plurality of modes each corresponding to a sensor type. Furthermore, the controller includes a switch block having a plurality of switches each configured to toggle a connection in the switch block according to the selected mode.

Abstract: A method for regulating the acquisition of an analog input signal from a digital X-ray panel is provided. The method includes opening a switch disposed between an integrator and the digital X-ray panel prior to an integrator event or upon detection of a fault in the digital X-ray panel to decouple the integrator from the digital X-ray panel, wherein the integrator is configured to integrate the analog input signal from the digital X-ray panel. Also, a system for data acquisition is provided. Further, a method for fault protection of the digital X-ray panel is provided.

Abstract: Detector modules and methods of manufacturing are provided. One detector module includes a detector having a silicon wafer structure formed from a first layer having a first resistivity and a second layer having a second resistivity, wherein the first resistivity is greater than the second resistivity. The detector further includes a photosensor device provided with the first layer on a first side of the silicon wafer and one or more readout electronics provided with the second layer on a second side of the silicon wafer, with the first side being a different side than the second side.

Abstract: An impedance analyzer is provided. The analyzer includes a signal excitation generator comprising a digital to analog converter, where a transfer function of the digital to analog converter from digital to analog is programmable. The impedance analyzer further includes a receiver comprising a low noise amplifier (LNA) and an analog to digital converter (ADC), where the LNA is a current to voltage converter; where the programmable digital to analog transfer function is implemented by a direct digital synthesizer (DDS) and a voltage mode digital to analog converter, or a digital phase locked loop (PLL), or both. Further, a multivariable sensor node having an impedance analyzer is provided. Furthermore, a multivariable sensor network having a plurality of multivariable sensor nodes is provided.

Abstract: A method for multivariable measurements using a single-chip impedance analyzer includes providing a sensor, exposing the sensor to an environmental parameter, determining a complex impedance of the sensor over a measured spectral frequency range of the sensor, and monitoring at least three spectral parameters of the sensor.