Abstract: Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

Abstract: Thioctamer, a nanoconjugate of glatiramer acetate (GA) and thioctic acid (TA), e.g. in the form of nanospheres, is provided as are compositions comprising thioctamer and methods of using the same for wound healing. Application of thioctamer to a wound accelerates wound healing, compared to control wounds that are not treated with the copolymer.

Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.

Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.

Abstract: Described is an apparatus for supporting Over-The-Air Hardware Updates comprising a first circuitry, a second circuitry, and a third circuitry. The first circuitry may be operable to be fastened and electrically coupled in one or more regions to one or more respectively corresponding semiconductor dies. The second circuitry may be operable to configure the one or more regions of the first circuitry. The third circuitry may be operable to provide a set of wirelessly-received configuration instructions to the second circuitry.

Abstract: A knowledge graph embedding method, system, and computer program product using a computing device to embed a knowledge graph using a graph convolutional network, the method including learning, by the computing device, an embedding of the knowledge graph that includes entities, relations, and edges, weighing, by the computing device, initial feature vectors of nodes and a convolutional layer output to compute a weight and modifying the embedding based on the weight, and using, by the computing device, the modified embedding to perform a task related to the knowledge graph.

Abstract: A graph neural network (GNN) training method, system, and computer program product in a graph, include generating, by the computing device, one or more one or more hypothetical edges between two or more nodes of a plurality of nodes of a graph neural network, testing, by the computing device, to determine whether the one or more generated hypothetical edges should be connected by using negative sampling, and permanently connecting, by the computing device, the one or more tested hypothetical edges if the negative sampling indicates the connectivity.

Abstract: Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

Abstract: Described is an apparatus for supporting Over-The-Air Hardware Updates comprising a first circuitry, a second circuitry, and a third circuitry. The first circuitry may be operable to be fastened and electrically coupled in one or more regions to one or more respectively corresponding semiconductor dies. The second circuitry may be operable to configure the one or more regions of the first circuitry. The third circuitry may be operable to provide a set of wirelessly-received configuration instructions to the second circuitry.

Abstract: Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

Abstract: A method, a computer program product, and a system for non-obvious relationship detection. The method includes receiving a knowledge and inputting a first node and a second node from the knowledge graph into a twin neural network. The method also includes embedding the first node and the second node, aggregating neighborhood information and position information into the node embeddings. The method further includes concatenating the neighborhood information and the position information of the first node and the second node to produce a first output vector and a second output vector. The method also includes generating a final score by comparing the first output vector with the second output vector. The final score indicates a probability of a non-obvious relationship between the first node and the second node.

Abstract: Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.

Abstract: This disclosure provides a stress-responsive polypeptide sequence for fusion with a polypeptide to specifically induce stability of the fusion polypeptide under stress conditions, such as drought, high salt and high temperature, in plants. Also disclosed includes an expression vector for expressing a fusion polypeptide comprising the stress-responsive peptide in plants transformed therewith, and a method for generating a transgenic plant with enhanced tolerance to environmental stresses, comprising introducing into the transgenic plant a polynucleotide encoding a fusion polypeptide which comprises the stress-responsive peptide as disclosed and a plant anti-stress gene, such as the plant senescence-associated gene SSPP. A plant expressing the expression vector that have an enhanced stress tolerance, including Arabidopsis and soybean, is also provided.

Abstract: Systems and a method for controlling power of a device with power management software are described. In one embodiment, a computer implemented method initiates power control having ON-OFF keying to control power consumption of a device for energy efficiency and energy conservation. An ON-OFF period of the ON-OFF keying for the device is computed. The method sets a target frequency, a target supply voltage, and a power gate control for the device based on the ON-OFF keying.

Abstract: Described is an apparatus for supporting Over-The-Air Hardware Updates comprising a first circuitry, a second circuitry, and a third circuitry. The first circuitry may be operable to be fastened and electrically coupled in one or more regions to one or more respectively corresponding semiconductor dies. The second circuitry may be operable to configure the one or more regions of the first circuitry. The third circuitry may be operable to provide a set of wirelessly-received configuration instructions to the second circuitry.

Abstract: A gravity driven Thermosiphon solar water heating system to harness solar insolation in low sunshine regions. This innovatory system uses CO2 as the working fluid to collect even mild sunlight to heat the water in sub-zero temperature areas. This solar water heater harnesses solar energy by fitting U-shaped copper heat removal pipes in evacuated glass tubes. This system works automatically by natural thermosiphon circulation force caused by density difference of supercritical CO2 at different temperatures. This innovatory solar water heater can perform in ice cold temperature areas where water based systems cease to function after freezing.

Abstract: In an embodiment, a processor includes a logic to cause at least one core to operate with a power control cycle including a plurality of on times and a plurality of off times according to an ON-OFF keying protocol, where the off times each correspond to a maximum off time for a platform including the processor. Other embodiments are described and claimed.

Abstract: A method performed by a multi-core processor is described. The method includes, while a core is executing program code, reading a dirty cache line from the core's last level cache and sending the dirty cache line from the core for storage external from the core, where, the dirty cache line has not been evicted from the cache nor requested by another core or processor.

Abstract: A system according to some examples herein includes a base chip which may include a plurality of attachment slots for attaching dies thereto. One or more of the attachment slots may be programmable attachment slots. The base chip may further include circuitry for interconnecting the dies attached to the base chip. For example, the base chip may include a plurality of cross bar switches, each of which is associated with respective ones of the plurality of attachment slots. The base chip may further include a configuration block, which is adapted to receive and transmit test signals for determining electrically connected signal lines of one or more attachment slots when one or more dies are attached to the base chip and which is further adapted to receive configuration data for programming signal (including power and ground) channels of the cross bar switches.