Abstract: A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.

Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

Abstract: A proximity-fuzed ammunition unit (1) that can approach a target and where during approach the proximity fuze function effects or gives rise to a voltage pulse pattern that is dependent on objects located along the flight path of the ammunition unit on its approach to the target. The voltage pulse pattern forms the basis for the actution of at least one triggering device (18) incorporated in the ammunition unit. The electrical circuit or circuits incorporated in or interacting with each triggering device is/are arranged to sense a voltage or amplitude value in the trailing edge of a pulse incorporated in or forming the pattern. If the pattern comprises a number of pulses an indication is given when a predetermined number of pulses has appeared to appears. Each electrical circuit causes or effects the opeation of the triggering device for its actuation depending on the said sensing and/or indication.

Abstract: Methods and products, including computer program products, for endpoint determination. An image of a portion of a substrate is captured in-situ, where the image includes optical information that depends on a thickness of a substrate layer. The image is examined to find a location on the substrate, and a process endpoint is determined using a portion of the optical information that corresponds to the location.

Abstract: A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.

Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

Abstract: A warhead charge device (18, 18?, 18?, 18??) arranged to carry liquid explosive (11), and which device is for use in an ammunition cargo unit such as a missile. The device incorporates at least two confined spaces (2, 6, 9) equipped with or, while the function of the device is in operation, capable of receiving liquid explosive (11) or components thereof via a device such as a pump device arranged to transfer completely or partially the explosive or components thereof from at least the first confined space to the other confined space, or vice versa.

Abstract: A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.

Abstract: An ammunition unit (1) designed to he adaptable to different types of targets (2,2?) or situations. The said ammunition unit comprises cylindrical warhead charges (4, 5) that confine or form explosive compositions (23), on or around the outside of which there are effect layers or casing containing effect elements (25, 27). These effect elements together with the explosive compositions (24) constitute the combatant function. Two or more cylindrical warhead charges (4, 5) are arranged essentially parallel alongside each other or inside each other. Each of the cylindrical warhead charges comprises effect layers around their cylindrical outer surface that provide different effects in target. The cylindrical warhead charges are rotatably arranged to assume different rotational setting modes, and in each such mode the same type or co-ordinated types of effect layers are directed outwards.

Abstract: A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.

Abstract: A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a second function that associates measurements from the series with positions on the substrate. For each measurement in a series from the in-situ monitoring system, the second function can be used to determine a position on the substrate where the measurement was taken. In addition, a measurement of the position of the carrier head, a time when the measurement of the substrate property is made, and a phase correction representing lag resulting from a processing delay in generating the measurement of the position of the carrier head can be used in determining a position on the substrate where a measurement of a substrate property was taken.

Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

Abstract: A warhead device comprising explosive charges and effect elements or effect agents for incorporation in a missile. The warhead device consists of a number of modules or modular charges (1a–1f) arranged to be actuatable between two or more pivotal positions in the cross-section of the warhead device. Each module comprises outer walls (9–14) that one by one are directed outwards depending on the position or pivotal position assumed by the module. Each outer wall of each module comprises warhead effect elements and/or effect agents that differ from the other warhead effect elements or agents. The outer walls that are directed outwards simultaneously form or are part of the common outer wall of the warhead device, and project a selectable warhead effect from the warhead device.

Abstract: An ammunition unit, for combating targets (10) with or without using shaped charge effect, that incorporates an openable or removable and replaceable hull or outer casing (2). The explosive charge in the ammunition unit comprises a charge section (3) with shaped charge function arranged to be able to assume either of two freely selectable positions in the ammunition unit, the first of which enables the charge to exert its shaped charge function and the second of which disables the shaped charge function and enables a different effect to be triggered.

Abstract: Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.

Abstract: A chemical mechanical polishing apparatus has a polishing pad, a carrier to hold a substrate against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween. An eddy current monitoring system is positioned to generate an alternating magnetic field in proximity to the substrate, an optical monitoring system generates a light beam and detects reflections of the light beam from the substrate, and a controller receives signals from the eddy current monitoring system and the optical monitoring system.

Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

Abstract: Conductive elements of a chemical mechanical polishing system may generate undesired eddy currents under the influence of a time-dependent magnetic field used in an eddy current monitoring system. To improve the accuracy of an eddy current monitoring system, elements that may contribute an undesired signal to the sensed eddy current signal may be fabricated from a non-conductive material such as plastic or ceramic. In some implementations, elements may be fabricated from non-magnetic materials.

Abstract: Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.

Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.