Abstract: An ammunition device (4) comprising one or more warhead effect jackets (17), each jacket containing warhead effect elements (18). The ammunition device also incorporates one or more explosive compositions arranged inside each warhead effect jacket that in or close to the target is/are triggerable by means of a triggering device. One or more separation charges is/are arranged adjacent to each warhead effect jacket that when actuated cause removel of one or more said warhead effect jacket(s). The actuation devices incorporate or interact with a programming device that operates with a first mode in which the actuation devices remain non-actuated, and a second mode in which the programming device actuates the actuation devices for initiating the separation charges, thereby causing ejection of each warhead effect jacket concerned.

Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

Abstract: A device arranged to enable the engagement of targets (5) by means of a shaped charge function. An ammunition unit is arranged to operate with at least two configuration modes where in the first mode the ammunition unit comprises solely a first modular charge (3). In the second mode the first modular charge is conjoined with a second modular charge (4). The modular charges each effect their own type of shaped charge function. Another feature is that the ammunition unit is arranged to enable changeover from the first configuration to the second before firing, launch or release of the ammunition unit.

Abstract: a warhead device comprising explosive charges and effect elements or effect agents for incorporation in a missile. The warhead device consists of a number of modules or modular charges (1a-1f) arranged to be actuatable between two or more pivotal positions in the cross-section of the warhead device. Each module comprises outer walls (9-14) that one by one are directed outwards depending on the position or pivotal position assumed by the module. Each outer wall of each module comprises warhead effect elements and/or effect agents that differ from the other warhead effect elements or agents. The outer walls that are directed outwards simultaneously form or are part of the common outer wall of the warhead device, and project a selectable warhead effect from the warhead device.

Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

Abstract: An ammunition unit (1) designed to he adaptable to different types of targets (2,2′) or situations. The said ammunition unit comprises cylindrical warhead charges (4, 5) that confine or form explosive compositions (23), on or around the outside of which there are effect layers or casing containing effect elements (25, 27). These effect elements together with the explosive compositions (24) constitute the combatant function. Two or more cylindrical warhead charges (4, 5) are arranged essentially parallel alongside each other or inside each other. Each of the cylindrical warhead charges comprises effect layers around their cylindrical outer surface that provide different effects in target. The cylindrical warhead charges are rotatably arranged to assume different rotational setting modes, and in each such mode the same type or co-ordinated types of effect layers are directed outwards.

Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

Abstract: A substrate processing system having a bi-directional interface and concomitant communication protocol to allow a controller to communicate with an external endpoint system is disclosed. More specifically, the substrate processing system comprises a controller and an endpoint detection system that are coupled together via a RS-232 interface. A SECS compliant communication protocol is employed to effect communication between the controller and endpoint detection system to increase wafer processing information exchange and data exchange.

Abstract: In an endpoint detection method for a process performed in a substrate processing chamber with an energized gas, a process variable of the process is detected. The process variable comprising at least one of (i) a radiation emitted by the energized gas, (ii) a radiation reflected from a substrate in the chamber, (iii) a reflected power level of the energized gas, and (iv) a temperature in the chamber. An endpoint signal is issued when the process variable is indicative of an endpoint of the process. A process parameter of the process is also detected, the process parameter comprising at least one of (i) a source power, (ii) an RF forward power, reflected power, or match components, (iii) an RF peak-to-peak voltage, current or phase, (iv) a DC bias level, (v) a chamber pressure or throttle valve position, (vi) a gas composition or flow rate, (vii) a substrate temperature or composition, (viii) a temperature of a chamber component or wall, and (ix) a magnetic confinement level or magnet position.

Abstract: A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.

Abstract: A chemical mechanical polishing apparatus has a polishing pad, a carrier to hold a substrate against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween. An eddy current monitoring system is positioned to generate an alternating magnetic field in proximity to the substrate, an optical monitoring system generates a light beam and detects reflections of the light beam from the substrate, and a controller receives signals from the eddy current monitoring system and the optical monitoring system.

Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. An extreme intensity measurement is derived from a plurality of intensity measurements made as the light beam moves across the substrate. The beam sweeps across the substrate a plurality of times to generate a plurality of extreme intensity measurements, and a polishing endpoint is detected based on the plurality of extreme intensity measurements.

Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. An extreme intensity measurement is derived from a plurality of intensity measurements made as the light beam moves across the substrate. The beam sweeps across the substrate a plurality of times to generate a plurality of extreme intensity measurements, and a polishing endpoint is detected based on the plurality of extreme intensity measurements.

Abstract: A method for contactless inductive transmission of programming data to a programmable time fuse included in a shell for a single shot, semi-automatic, or fully automatic shell firing barrel weapon. While the shell is situated in a cartridge chamber of a barrel of the weapon, data is transmitted to the programmable time fuse from a programming device of the weapon via a transmitting coil arranged around the cartridge chamber of the barrel to a receiving coil arranged in the shell. At least a part of the barrel lying between the coils is replaced by a non-magnetic material and designed so that it does not form an electrically conductive short circuited layer that would prevent transmission between the coils.

Abstract: A shell-firing barrel weapon system for a single shot, semi-automatic or fully automatic firing, including a rifled barrel comprising a programming member for programming with programming pulses fuses in shells fired from the weapon before or in conjunction with firing of the shells. At least one contact is located in the barrel of the weapon and connected to the programming member for transmitting a programming pulse from the programming member to the fuses of the shells. The at least one contact is electrically insulated from the barrel and protrudes into the barrel beyond bars of rifling of the barrel. An electrically conductive contact ring is concentrically arranged on the shells. The contact ring is electrically insulated from main parts of the shells and has an external diameter that is smaller than a diameter of the bars of the rifling of the barrel.

Abstract: There is disclosed a bridge or like pillar (1) erected in a moving body of water in which the water may periodically flow in strata in one as well as the other of two opposite main flow directions. The pillar is provided with a flow compensation device including a motor-driven stream generator (9) which functions to set part of the water in motion thus compensating for the flow resistance exerted by the pillar in the water body.