Abstract: A wearable device includes a sensor device and a clothes to which the sensor device is attached. The clothes includes a clothes body and an insertion and extraction portion that has an opening formed in the clothes body and enables the sensor device to be inserted into or extracted from the clothes body. The sensor device includes a humidity sensor configured to measure humidity in the clothes body and a housing having a first region exposed to an inside of the clothes body and a second region exposed to an outside of the clothes body, while the sensor device is inserted from the insertion and extraction portion into the clothes body. The humidity sensor is accommodated in the first region of the housing.

Abstract: A head-mounted device capable of more highly accurately measuring the physical conditions of a wearer as a worker that are necessary for estimating the possibility of heat stroke is provided. A head-mounted device includes an outer shell; a first channel as a gap between a head of a wearer and the outer shell; a second channel provided in the outer shell and connected to the first channel; a fan configured to send air from one of the first channel and the second channel to the other; a salinity sensor configured to measure salt concentration of sweat of the wearer; a first humidity sensor configured to measure an absolute humidity of intake air entering one of the first channel and the second channel; and a second humidity sensor configured to measure an absolute humidity of exhaust air exiting from the other of the first channel and the second channel.

Abstract: A head-mounted device capable of more highly accurately measuring the physical conditions of a wearer as a worker that are necessary for estimating the possibility of heat stroke is provided. A head-mounted device includes an outer shell; a first channel as a gap between a head of a wearer and the outer shell; a second channel provided in the outer shell and connected to the first channel; a fan configured to send air from one of the first channel and the second channel to the other; a salinity sensor configured to measure salt concentration of sweat of the wearer; a first humidity sensor configured to measure an absolute humidity of intake air entering one of the first channel and the second channel; and a second humidity sensor configured to measure an absolute humidity of exhaust air exiting from the other of the first channel and the second channel.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A head-mounted device includes: an outer shell; a first flow channel that is a gap between a head of a wearer and the outer shell; a second flow channel provided in the outer shell and joining the first flow channel; a fan configured to blow air from one of the first flow channel and the second flow channel to the other of the first flow channel and the second flow channel; a first humidity sensor configured to measure an absolute humidity of intake air entering one of the first flow channel and the second flow channel; and a second humidity sensor configured to measure an absolute humidity of exhaust air exiting from the other of the first flow channel and the second flow channel.

Abstract: A head-mounted device includes: an outer shell; a first flow channel that is a gap between a head of a wearer and the outer shell; a second flow channel provided in the outer shell and joining the first flow channel; a fan configured to blow air from one of the first flow channel and the second flow channel to the other of the first flow channel and the second flow channel; a first humidity sensor configured to measure an absolute humidity of intake air entering one of the first flow channel and the second flow channel; and a second humidity sensor configured to measure an absolute humidity of exhaust air exiting from the other of the first flow channel and the second flow channel.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: An ultrasonic device includes an element substrate, an ultrasonic transducer array disposed on a rear surface of the element substrate, and having a plurality of ultrasonic transducers arranged in an array, an electrode line connected to the ultrasonic transducer on the rear surface of the element substrate, and drawn to a terminal region located outside the ultrasonic transducer array in a planar view of the element substrate viewed from a normal direction, a sealing plate bonded to the rear surface side of the element substrate, and a through electrode penetrating the sealing plate in a thickness direction and connected to an electrode pad of the electrode line at a position, which is located outside a region opposed to the ultrasonic transducer array of the sealing plate and is opposed to the electrode pad.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.