Patents by Inventor Nobuaki Hashimoto

Nobuaki Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10727166
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: July 28, 2020
    Assignee: Advanced Interconnect Systems Limited
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Patent number: 10716541
    Abstract: An ultrasonic device includes an element substrate, an ultrasonic transducer array disposed on a rear surface of the element substrate, and having a plurality of ultrasonic transducers arranged in an array, an electrode line connected to the ultrasonic transducer on the rear surface of the element substrate, and drawn to a terminal region located outside the ultrasonic transducer array in a planar view of the element substrate viewed from a normal direction, a sealing plate bonded to the rear surface side of the element substrate, and a through electrode penetrating the sealing plate in a thickness direction and connected to an electrode pad of the electrode line at a position, which is located outside a region opposed to the ultrasonic transducer array of the sealing plate and is opposed to the electrode pad.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: July 21, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Nobuaki Hashimoto
  • Patent number: 10708647
    Abstract: A digital broadcast receiving apparatus capable of executing a function with a higher added value is provided. A broadcast receiving apparatus configured to receive contents includes: a receiving unit configured to receive the contents; an interface via which the contents received by the receiving unit is outputted; a control unit configured to control an output state of the contents from the interface. In this case, the control unit is configured to determine the output state of the contents from the interface in accordance with a combination of control information indicating a copy control state of the contents, control information for specifying necessity or not of protection when to output the contents, information indicating resolution of video of the contents, and information indicating transmission characteristics of video of the contents, which are received by the receiving unit together with the contents.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: July 7, 2020
    Assignee: MAXELL, LTD.
    Inventors: Kazuhiko Yoshizawa, Takuya Shimizu, Yasunobu Hashimoto, Nobuo Masuoka, Nobuaki Kabuto
  • Patent number: 10651495
    Abstract: A fuel cell includes a first separator and a second separator. A second protrusion is formed on a first sealing portion of the first separator. A concave portion is formed in a second sealing portion of the second separator. When fuel cells are stacked together sequentially in the vertical direction without displacing relative to one another, the center of the second protrusion and the center of the concave portion are aligned with each other. Even if the fuel cells are displaced while being stacked together, the upper fuel cell in the vertical direction is moved to decrease the distance between the center of the second protrusion and the center of the corresponding concave portion.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: May 12, 2020
    Assignees: TOYOTA SHATAI KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Keiji Hashimoto, Satoshi Futami, Kousuke Kawajiri, Nobuaki Nonoyama
  • Patent number: 10636726
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: April 28, 2020
    Assignee: Advanced Interconnect Systems Limited
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Publication number: 20200066616
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: October 28, 2019
    Publication date: February 27, 2020
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Publication number: 20200006200
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: September 12, 2019
    Publication date: January 2, 2020
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Publication number: 20190300632
    Abstract: Ethylene-vinyl alcohol copolymer pellets comprise an ethylene-vinyl alcohol copolymer and water, and have a water content of not higher than 0.5 wt. %, wherein the ratio (Y/Z) of a lactone ring content (Y) to the sum (Z) of a carboxylic acid content (X) and the lactone ring content (Y) in terminal structures of the ethylene-vinyl alcohol copolymer is not less than 60 mol %. The pellets are excellent in high-temperature thermal decomposition-suppressing effect and thermal stability, and are free from odor emanation and coloration even if being processed at a higher temperature.
    Type: Application
    Filed: June 7, 2019
    Publication date: October 3, 2019
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Kota INOUE, Honoka HASHIMOTO, Nobuaki SATO
  • Publication number: 20190292359
    Abstract: A resin composition contains an ethylene-vinyl alcohol copolymer, wherein the ratio (Y/Z) of a lactone ring content (Y) to the sum (Z) of a carboxylic acid content (X) and the lactone ring content (Y) in terminal structures of the ethylene-vinyl alcohol copolymer is not less than 55 mol %, and at least one of a cinnamic acid component, a lubricant, a boron compound, and a conjugated polyene compound is present as a thermally stabilizing substance in a predetermined proportion based on the weight of the resin composition. Therefore, the resin composition is excellent in high-temperature thermal decomposition suppressing effect and thermal stability, and is free from odor emanation and coloration even if being processed at a higher temperature.
    Type: Application
    Filed: June 5, 2019
    Publication date: September 26, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Kota INOUE, Honoka HASHIMOTO, Nobuaki SATO
  • Publication number: 20190295927
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: June 7, 2019
    Publication date: September 26, 2019
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Patent number: 10424533
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: September 24, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Publication number: 20190253754
    Abstract: A broadcast reception device receives a digital broadcast service capable of executing an application cooperating with a broadcast program, and is provided with: a broadcast reception unit which receives broadcast waves of the digital broadcast service; a separation unit which separates video information relating to the broadcast program and application-related information from the received broadcast waves; a broadcast video decoding unit which decodes the video information relating to the broadcast program; an application acquisition unit which acquires an application on the basis of location information included in the application-related information; an application execution unit which executes the acquired application and acquires additional data from a server device; a video conversion unit which converts broadcast program video decoded by the broadcast decoding unit into high-quality video having a higher quality than the video using the acquired additional data; and a display unit which is able to disp
    Type: Application
    Filed: April 26, 2019
    Publication date: August 15, 2019
    Applicant: MAXELL, LTD.
    Inventors: Kazuhiko YOSHIZAWA, Tetsuya SAKAMOTO, Motoyuki SUZUKI, Yasunobu HASHIMOTO, Nobuaki KABUTO, Keisuke INATA
  • Publication number: 20190224325
    Abstract: Provided is a curcumin pharmaceutical preparation that is highly water soluble, can maintain the concentration of free curcumin in the blood sufficiently high by being administered parenterally, can effectively obtain a pharmacological action of curcumin, and is highly safe. A pharmaceutical composition for parenteral administration, including a water-soluble substance conjugate of curcumin as an active component.
    Type: Application
    Filed: June 28, 2017
    Publication date: July 25, 2019
    Applicants: THERABIOPHARMA INC., KYOTO UNIVERSITY
    Inventors: Hideaki KAKEYA, Masashi KANAI, Nobuaki TAKAHASHI, Tadashi HASHIMOTO, Atsushi IMAIZUMI, Hitomi OZAWA
  • Patent number: 10361144
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: July 23, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Publication number: 20190215566
    Abstract: A digital broadcast receiving apparatus capable of executing a function with a higher added value is provided. A broadcast receiving apparatus configured to receive contents includes: a receiving unit configured to receive the contents; an interface through which the contents received by the receiving unit are outputted; and a control unit configured to control an output state of the contents from the interface. The control unit is configured to determine an output state of the contents from the interface in accordance with a combination of control information indicating a copy control state of the contents, control information for specifying whether protection is required or not when the contents are to be outputted, information indicating resolution of video of the contents, and information indicating transmission characteristics of the video of the contents, which are received by the receiving unit together with the contents.
    Type: Application
    Filed: August 23, 2017
    Publication date: July 11, 2019
    Inventors: Takuya SHIMIZU, Kazuhiko YOSHIZAWA, Yasunobu HASHIMOTO, Nobuo MASUOKA, Nobuaki KABUTO
  • Patent number: 10321186
    Abstract: A broadcast reception device receives a digital broadcast service capable of executing an application cooperating with a broadcast program, and is provided with: a broadcast reception unit which receives broadcast waves of the digital broadcast service; a separation unit which separates video information relating to the broadcast program and application-related information from the received broadcast waves; a broadcast video decoding unit which decodes the video information relating to the broadcast program; an application acquisition unit which acquires an application on the basis of location information included in the application-related information; an application execution unit which executes the acquired application and acquires additional data from a server device; a video conversion unit which converts broadcast program video decoded by the broadcast decoding unit into high-quality video having a higher quality than the video using the acquired additional data; and a display unit which is able to disp
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: June 11, 2019
    Assignee: MAXELL, LTD.
    Inventors: Kazuhiko Yoshizawa, Tetsuya Sakamoto, Motoyuki Suzuki, Yasunobu Hashimoto, Nobuaki Kabuto, Keisuke Inata
  • Patent number: 10312182
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: June 4, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Patent number: 10283438
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: May 7, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Patent number: 10262923
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: April 16, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Publication number: 20190043786
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: October 8, 2018
    Publication date: February 7, 2019
    Inventors: Haruki Ito, Nobuaki Hashimoto