Abstract: An X-ray inspection system of the present application is capable of blocking the effect of heat from an X-ray source, thereby making it possible to place a heat-sensitive circuit component in the same housing space as the X-ray source. The X-ray inspection system includes a housing 10 provided with an upper housing space 11, in which an X-ray source 32 housed in a cooling container 30 is placed. Due to pressure of a pump 36, a cooling medium circulates between the cooling container 30 and a heat radiating device 33, thereby suppressing the temperature rise of the cooling container 30. Since the cooling container 30 is placed in the upper housing space 11, the upper housing space 11 serves as a cooling space, suppressing the temperature rise. Therefore, heat-sensitive or heat-producing circuit components can be placed in the upper housing space 11.

Abstract: A memory mat (101) includes a main body portion (200) that includes a first capacitor (203A), a linear conductive film (204) that is formed between the main body portion (200) and a peripheral circuit (104), and a second capacitor (203B) that is formed to be in contact with the conductive film (204) at a bottom of the second capacitor (203B). The first capacitor (203A) is in contact with a contact layer (202) at a bottom of the first capacitor (203A).

Abstract: According to the first aspect of the present invention, a drain electrode and a pixel electrode are electrically connected to each other on a protective film formed on a semiconductor active layer, and thereby it is possible to easily connect the drain electrode and the pixel electrode to each other and to improve a yield.

Abstract: A memory mat (101) includes a main body portion (200) that includes a first capacitor (203A), a linear conductive film (204) that is formed between the main body portion (200) and a peripheral circuit (104), and a second capacitor (203B) that is formed to be in contact with the conductive film (204) at a bottom of the second capacitor (203B). The first capacitor (203A) is in contact with a contact layer (202) at a bottom of the first capacitor (203A).

Abstract: Semiconductor device manufacturing method includes forming a first mask, having a first opening to implant ion into semiconductor substrate and being used to form first layer well, on semiconductor substrate; forming first-layer well having first and second regions by implanting first ion into semiconductor substrate using first mask; forming second mask, having second opening to implant ion into semiconductor substrate and being used to form second layer well, on semiconductor substrate; and forming second-layer well below first layer well by implanting second ion into semiconductor substrate using second mask. First region is formed closer to an edge of first-layer well than second region. Upon implanting first ion, first ion deflected by first inner wall of first mask is supplied to first region. Upon implanting second ion, second ion deflected by second inner wall of second mask is supplied to second region.

Abstract: One embodiment of the present invention is a thin film transistor having a substrate, a gate electrode formed on the substrate, a gate insulating film, a semiconductor layer formed on the gate insulating film, a protective film formed on the semiconductor layer and the gate insulating film and having first and second opening sections which are separately and directly formed on the semiconductor layer, a source electrode formed on the protective film and electrically connected to the semiconductor layer at the first opening section of the protective film, and a drain electrode formed on the protective film and electrically connected to the semiconductor layer at the second opening section of the protective film.

Abstract: An inspection apparatus is provided for inspecting a package having a content wrapped with a translucent packaging sheet, the package having an outline including front and rear edges and two side edges and having a seal where the packaging sheet is sealed formed inside at least one of the front and rear edges. The inspection apparatus includes a lighting disposed on one side of a gap across which the package is to be conveyed from an upstream conveyor mechanism to a downstream conveyor mechanism, a camera disposed on the other side of the gap, and an image processor for processing an image captured by the camera. The image processor is capable of obtaining a strip-shaped partial image including the seal from an entire image of the package, thereby enabling determination of whether a foreign substance is present in the partial image.

Abstract: According to the first aspect of the present invention, a drain electrode and a pixel electrode are electrically connected to each other on a protective film formed on a semiconductor active layer, and thereby it is possible to easily connect the drain electrode and the pixel electrode to each other and to improve a yield.

Abstract: Semiconductor device manufacturing method includes forming a first mask, having a first opening to implant ion into semiconductor substrate and being used to form first layer well, on semiconductor substrate; forming first-layer well having first and second regions by implanting first ion into semiconductor substrate using first mask; forming second mask, having second opening to implant ion into semiconductor substrate and being used to form second layer well, on semiconductor substrate; and forming second-layer well below first layer well by implanting second ion into semiconductor substrate using second mask. First region is formed closer to an edge of first-layer well than second region. Upon implanting first ion, first ion deflected by first inner wall of first mask is supplied to first region. Upon implanting second ion, second ion deflected by second inner wall of second mask is supplied to second region.

Abstract: A semiconductor device comprises a memory cell region, a peripheral circuit region and a boundary region. In the memory cell region, a concave lower electrode and a foundation layer have a same uppermost surface positioned in a height of H above the plane-A. In the boundary region, one concave lower conductive region and a foundation layer have a same uppermost surface positioned in a height of H above the plane-A.

Abstract: An embodiment of the present invention is an transparent thin film transistor which has an substantially transparent substrate, a gate line made of a thin film of a substantially transparent conductive material, a substantially transparent gate insulating film, a substantially transparent semiconductor active layer, a source line made of a thin film of a metal material and a drain electrode made of a thin film of a substantially transparent conductive material. In addition, the source line and the drain electrode are formed apart from each other and sandwich the substantially transparent semiconductor active layer. Moreover, at least any one of the thin film of the gate line and the thin film of the source line is stacked with a thin film of a metal material.

Abstract: According to one embodiment, a voice mail apparatus includes a voice processor which processes voice messages by a arbitrary processing gain, a gain controller which monitors a signal level of an output signal of the voice processor, and controls the processing gain of the voice processor to change the signal level into a specified level, and a processing controller which makes the gain controller to perform gain control of a learning voice by inputting a portion of the voice message into the voice processor as the learning voice when processing of the voice message is requested or based on predetermined conditions.

Abstract: One embodiment of the present invention is a thin film transistor having a substrate, a gate electrode formed on the substrate, a gate insulating film, a semiconductor layer formed on the gate insulating film, a protective film formed on the semiconductor layer and the gate insulating film and having first and second opening sections which are separately and directly formed on the semiconductor layer, a source electrode formed on the protective film and electrically connected to the semiconductor layer at the first opening section of the protective film, and a drain electrode formed on the protective film and electrically connected to the semiconductor layer at the second opening section of the protective film.

Abstract: An embodiment of the present invention is an transparent thin film transistor which has an substantially transparent substrate, a gate line made of a thin film of a substantially transparent conductive material, a substantially transparent gate insulating film, a substantially transparent semiconductor active layer, a source line made of a thin film of a metal material and a drain electrode made of a thin film of a substantially transparent conductive material. In addition, the source line and the drain electrode are formed apart from each other and sandwich the substantially transparent semiconductor active layer. Moreover, at least any one of the thin film of the gate line and the thin film of the source line is stacked with a thin film of a metal material.

Abstract: A semiconductor device comprises a memory cell region, a peripheral circuit region and a boundary region. In the memory cell region, a concave lower electrode and a foundation layer have a same uppermost surface positioned in a height of H above the plane-A. In the boundary region, one concave lower conductive region and a foundation layer have a same uppermost surface positioned in a height of H above the plane-A.

Abstract: According to one embodiment, a voice mail apparatus includes a first determining module which determines whether a dual tone multi frequency (DTMF) signal for identifying a processing request of the voice message is contained in a received signal by detecting and comparing a first parameter of a transmission signal from the mail box and the first parameter of the received signal to the mail box, a second determining module which determines whether the DTMF signal is contained in the received signal by detecting and comparing a second parameter of the transmission signal from the mail box and the second parameter of the received signal to the mail box, and a controller which controls execution/stop of processing of the voice message based on a determination result by the second determining module.

Abstract: According to one embodiment, a voice mail apparatus includes a voice processor which processes voice messages by a arbitrary processing gain, a gain controller which monitors a signal level of an output signal of the voice processor, and controls the processing gain of the voice processor to change the signal level into a specified level, and a processing controller which makes the gain controller to perform gain control of a learning voice by inputting a portion of the voice message into the voice processor as the learning voice when processing of the voice message is requested or based on predetermined conditions.

Abstract: A method for manufacturing a capacitor includes depositing an interlayer insulating film on or above a plug connected to a switching element, forming a hole in the interlayer insulating film such that the opening portion of the hole is surrounded by an overhang structure and that the plug is exposed in the bottom of the hole, removing the overhang structure, forming a lower electrode on the inner surface of the deep hole, forming a dielectric on the lower electrode, and forming an upper electrode on the dielectric. The above steps prevent the formation of a gap in the capacitor, since the overhang structure as a cause of the gap is removed. The coverage by the dielectric is also prevented from being poor.

Abstract: The present invention provides a semiconductor device manufacturing method of a semiconductor device having a contact plug, in which a contact hole formed by a surface portion of a high-concentration N-type diffusion layer formed on a semiconductor silicon substrate surface and an interlayer insulating film is implanted with indium ions at an energy ranging from 30 to 120 keV and an implantation amount ranging from 1.0×1013/cm2 to 5.0×1014/cm2 to grow an indium-containing layer on the surface portion of the high-concentration N-type diffusion layer at the bottom of the contact hole.

Abstract: The present invention provides a semiconductor device manufacturing method of a semiconductor device having a contact plug, in which a contact hole formed by a surface portion of a high-concentration N-type diffusion layer formed on a semiconductor silicon substrate surface and an interlayer insulating film is implanted with indium ions at an energy ranging from 30 to 120 keV and an implantation amount ranging from 1.0×1013/cm2 to 5.0×1014/cm2 to grow an indium-containing layer on the surface portion of the high-concentration N-type diffusion layer at the bottom of the contact hole.