Patents by Inventor Norihito Tsukahara
Norihito Tsukahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8115109Abstract: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.Type: GrantFiled: April 22, 2009Date of Patent: February 14, 2012Assignee: Panasonic CorporationInventors: Masayoshi Koyama, Norihito Tsukahara, Susumu Matsuoka
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Patent number: 8062489Abstract: An object of the present invention is to provide a method for stably forming an artificial lipid membrane while suppressing the leakage and evaporation of an electrolytic solution. The present invention is an artificial lipid membrane forming method for forming an artificial lipid membrane using an artificial lipid membrane forming apparatus. The artificial lipid membrane forming apparatus comprises a first chamber, a second chamber, a dividing wall, and an artificial lipid membrane forming portion. Each of the first chamber and the second chamber has a capacity of not smaller than 10 pl and not larger than 200 ?l. The artificial lipid membrane forming method of the present invention comprises the steps of: preparing the artificial lipid membrane forming apparatus; adding to the first chamber a first electrolytic solution having a viscosity of not lower than 1.Type: GrantFiled: December 17, 2010Date of Patent: November 22, 2011Assignee: Panasonic CorporationInventors: Akio Oki, Norihito Tsukahara, Masato Suzuki, Hiroaki Oka
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Patent number: 8025237Abstract: An antenna built-in module which incorporates an antenna, is thin and excellent in antenna characteristics, a card type information device and a method for manufacturing the same are provided. A wiring board (110) which has a wiring pattern (120) and in which an electronic component is mounted on at least one surface thereof, a magnetic substance (160) embedded in the other surface of the wiring board (110), an antenna pattern (170) provided on the magnetic substance (160), the wiring pattern (120) of the wiring board (110) and the antenna terminal electrode of the antenna pattern (170) are connected by a conductive via (200).Type: GrantFiled: November 8, 2006Date of Patent: September 27, 2011Assignee: Panasonic CorporationInventors: Shozo Ochi, Norihito Tsukahara, Yutaka Nakamura, Hirohisa Tanaka
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Patent number: 7935892Abstract: Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.Type: GrantFiled: April 14, 2006Date of Patent: May 3, 2011Assignee: Panasonic CorporationInventors: Kazuhiro Nishikawa, Hidenori Miyakawa, Norihito Tsukahara, Shigeaki Sakatani
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Publication number: 20110083793Abstract: An object of the present invention is to provide a method for stably forming an artificial lipid membrane while suppressing the leakage and evaporation of an electrolytic solution. The present invention is an artificial lipid membrane forming method for forming an artificial lipid membrane using an artificial lipid membrane forming apparatus. The artificial lipid membrane forming apparatus comprises a first chamber, a second chamber, a dividing wall, and an artificial lipid membrane forming portion. Each of the first chamber and the second chamber has a capacity of not smaller than 10 pl and not larger than 200 ?l. The artificial lipid membrane forming method of the present invention comprises the steps of: preparing the artificial lipid membrane forming apparatus; adding to the first chamber a first electrolytic solution having a viscosity of not lower than 1.Type: ApplicationFiled: December 17, 2010Publication date: April 14, 2011Applicant: PANASONIC CORPORATIONInventors: Akio OKI, Norihito Tsukahara, Masato Suzuki, Hiroaki Oka
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Patent number: 7924228Abstract: A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.Type: GrantFiled: July 11, 2006Date of Patent: April 12, 2011Assignee: Panasonic CorporationInventors: Shozo Ochi, Norihito Tsukahara, Kazuhiro Ikurumi
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Publication number: 20100244283Abstract: Dummy electrodes (15) are disposed on wiring connected to first electrodes (2) of the substrate (1), outside a junction region containing all of the first electrodes (2) and second electrodes (6) and in bonding resin (4), the dummy electrodes (15) not being involved in electrical connection between the substrate (1) and the component (5). When conductive particles (3) in the bonding resin (4) are melted by heating, molten solder self-assembles and solidifies between the first electrodes (2) and the second electrodes (6) and on the dummy electrodes (15). With this configuration, the solder self-assembles between the adjacent dummy electrodes (15) and causes a solder short circuit. Thus it is possible to eliminate excessive solder supply between the adjacent first electrodes (2) and the adjacent second electrodes (6), thereby preventing short circuits between the adjacent first electrodes (2) and the adjacent second electrodes (6).Type: ApplicationFiled: March 22, 2010Publication date: September 30, 2010Applicant: PANASONIC CORPORATIONInventors: Norihito Tsukahara, Masayoshi Koyama
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Publication number: 20100163630Abstract: An antenna built-in module which incorporates an antenna, is thin and excellent in antenna characteristics, a card type information device and a method for manufacturing the same are provided. A wiring board (110) which has a wiring pattern (120) and in which an electronic component is mounted on at least one surface thereof, a magnetic substance (160) embedded in the other surface of the wiring board (110), an antenna pattern (170) provided on the magnetic substance (160), the wiring pattern (120) of the wiring board (110) and the antenna terminal electrode of the antenna pattern (170) are connected by a conductive via (200).Type: ApplicationFiled: November 8, 2006Publication date: July 1, 2010Applicant: Matsushita Electric Industrial Co., LtdInventors: Shozo Ochi, Norihito Tsukahara, Yutaka Nakamura, Hirohisa Tanaka
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Publication number: 20100080912Abstract: A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.Type: ApplicationFiled: September 28, 2009Publication date: April 1, 2010Applicant: PANASONIC CORPORATIONInventors: Masayoshi Koyama, Norihito Tsukahara, Daido Komyoji
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Publication number: 20100052996Abstract: A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.Type: ApplicationFiled: July 10, 2006Publication date: March 4, 2010Inventors: Shozo Ochi, Norihito Tsukahara, Kazuhiro Ikurumi
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Publication number: 20090314528Abstract: A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate.Type: ApplicationFiled: June 17, 2009Publication date: December 24, 2009Applicant: Panasonic CorporationInventors: Takayuki Hirose, Norihito Tsukahara, Manabu Gokan
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Publication number: 20090266592Abstract: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.Type: ApplicationFiled: April 22, 2009Publication date: October 29, 2009Applicant: Panasonic CorporationInventors: Masayoshi Koyama, Norihito Tsukahara, Susumu Matsuoka
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Publication number: 20090133900Abstract: Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.Type: ApplicationFiled: April 14, 2006Publication date: May 28, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Kazuhiro Nishikawa, Hidenori Miyakawa, Norihito Tsukahara, Shigeaki Sakatani
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Patent number: 7471260Abstract: A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).Type: GrantFiled: February 2, 2006Date of Patent: December 30, 2008Assignee: Panasonic CorporationInventors: Shozo Ochi, Norihito Tsukahara, Kazuhiro Ikurumi, Hidenobu Nishikawa, Masato Hirano
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Patent number: 7381902Abstract: A wiring board comprises a patterned wiring formed of electrically conductive resin composed primarily of silver and embedded into a substrate in a manner that a surface thereof is exposed above the substrate, and a covering conductor formed primarily of carbon covering the surface of the patterned wiring. The wiring board of this structure is superior in resistance to moisture absorption and water, prevents silver migration attributable to the moisture, and reduces contact resistance in the connection between a terminal portion of the wiring board and an external apparatus.Type: GrantFiled: September 29, 2004Date of Patent: June 3, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Norihito Tsukahara, Kazuhiro Nishikawa
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Patent number: 7376318Abstract: A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive circuit, and a second conductive circuit manufactured by hardening conductive paste material in a predetermined shape on the first insulating layer, wherein an electronic part built-in by the first insulating layer and second insulating layer is connected to the second conductive circuit, and the first conductive circuit is connected to the second conductive circuit through a via hole.Type: GrantFiled: January 17, 2007Date of Patent: May 20, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Norihito Tsukahara, Kazuhiro Nishikawa
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Patent number: 7375421Abstract: Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit module of a multilayer structure is provided which is formed by embedding semiconductor chips and passive components in a sheet made from a thermoplastic resin; folding a module sheet, which is formed of circuit blocks provided with wiring patterns thereon, at the boundaries of the circuit blocks so as to be stacked into layers; and thermal-bonding and integrating the module sheet by applying heat and pressure. As a result, a highly reliable circuit module can be manufactured in a simple manner.Type: GrantFiled: June 8, 2005Date of Patent: May 20, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Daisuke Sakurai, Kazuhiro Nishikawa, Norihito Tsukahara
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Publication number: 20080111756Abstract: A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).Type: ApplicationFiled: February 2, 2006Publication date: May 15, 2008Inventors: Shozo Ochi, Norihito Tsukahara, Kazuhiro Ikurumi, Hidenobu Nishikawa, Masato Hirano
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Patent number: 7353600Abstract: A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for electrically insulating first conductive interconnection 2 and second conductive interconnection 6, onto insulator substrate 1; either making pillar-like member 3 stand on a prescribed position on first conductive interconnection 2 before applying resin film 41, or press fitting pillar-like member 3 into resin film 41 so as to reach either a surface vicinity of first conductive interconnection 2 or a portion of first conductive interconnection 2 after applying resin film 41; hardening resin film 41 to form interlevel insulator layer 42; pulling out pillar-like member 3 to form opening 5 in interlevel insulator layer 42; and forming second conductive interconnection 6 onto interlevel insulator layer 42 to include opening 5.Type: GrantFiled: September 15, 2004Date of Patent: April 8, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Norihito Tsukahara, Kazuhiro Nishikawa, Daisuke Sakurai
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Publication number: 20070277909Abstract: This invention provides such solder paste that prevents, when a minute-size passive component or a semiconductor integrated circuit element having a small terminal pitch is soldered by the solder paste, the solder particles from being oxidized to provide highly-reliable solder joint even when the solder paste is used in a very small amount. Specifically, solder paste obtained by mixing solder alloy powders with flux is structured so that the flux has, at a pre-heating temperature in a heating/melting step, a high temperature retention property by which the flux covers the surface of the solder alloy powders.Type: ApplicationFiled: September 6, 2005Publication date: December 6, 2007Inventors: Norihito Tsukahara, Kazuhiro Nishikawa