Abstract: Systems, apparatus, computer-readable medium, and associated methods to monitor, analyze, and adjust at least one of a build and/or an additive manufacturing machine configuration are disclosed. An example apparatus includes memory circuitry, instructions, and processor circuitry to execute the instructions to implement at least a feature extractor, a variability analyzer, and an output generator. The feature extractor is to: i) group data for a plurality of builds associated with one or more additive manufacturing machines; and ii) extract features from the grouped data. The variability analyzer is to: i) process the grouped data with respect to the features to determine a measure of variability for each feature; and ii) compare the measure of variability for each feature to a respective allowable limit associated with the respective feature. The output generator is to provide actionable output to adjust at least a first additive manufacturing machine.

Abstract: Methods, apparatus, and processor-readable storage media for detection of anomalous behavior on online platforms using machine learning techniques are provided herein. An example method includes obtaining a set of machine learning models configured to detect anomalous behavior associated with users interacting with an online platform and performing an incremental machine learning process on one or more of the machine learning models in the set. The incremental machine learning process may include obtaining data related to interactions of users with the online platform, updating at least one of the machine learning models in the set based on the obtained data, comparing the machine learning models, and selecting one of the machine learning models from the set to be used by the online platform based on the comparison. The method may further include determining, utilizing the selected machine learning model, that a given user is exhibiting anomalous behavior on the online platform.

Abstract: A control system for controlling a powertrain of an electric vehicle is disclosed. The powertrain comprises a traction motor and a battery for powering the traction motor. The control system is configured to detect a low state of charge of the battery and to operate the powertrain in a low state of charge mode when the low state of charge is detected. In the low state of charge mode, the control system adjusts at least one parameter of the powertrain, such as traction motor torque, powertrain cooling, accessory cooling and accessory power consumption, to reduce power drawn from the battery.

Abstract: Disclosed are techniques for wireless communication. In an aspect, a UE determines a completion time associated with a communication event for a wakeup period, the wakeup period characterized by at least radio frequency (RF) circuitry being set to an active state. The UE schedules a transition from the wakeup period to a sleep period at the completion time, the sleep period characterized by at least the RF circuitry being set to an inactive state. The UE performs the communication event during the wakeup period. The UE transitions from the wakeup period to the sleep period at the completion time in accordance with the scheduling. The UE determines, after the transition from the wakeup period to the sleep period, a wakeup time associated with a next wakeup period.

Abstract: A computer-implemented method for providing an identical response to a similar issue that is received from different customers.

Abstract: Disclosed herein are methods for classifying a tumor using a trained classifier. The method may include providing a methylation profile to a classifier trained to identify tumor classes using unsupervised clustering, generating a classification of the tumor based on the methylation profile and a reference set, where the reference set is generated from training the classifier, generating a confidence score based on the correlation of the methylation profile to the classification from the classifier, and updating the classifier and reference set with the methylation profile and classification. The classifier may include a plurality of family sub-classifiers and/or a plurality of class sub-classifiers.

Abstract: The present invention relates to an immobilized deacylase in cross-linked cell aggregates, a preparation method and use thereof in deacylation of echinocandins. The immobilization of deacylase in cross-linked cell aggregates comprises the step of Production of Deacylase by fermentation Aggregation of cells Cross-linking of the cells. Present invention also relates to the use of the cross-linked cell aggregates of deacylase in deacylation of Echinocandin intermediates.

Abstract: Systems and methods manage data traffic by converging a mobile network operator (MNO) core network with a multiple-system operator (MSO) core network (e.g., a Hybrid-Mobile Virtual Network Operator (H-MVNO) core network). The system architecture includes one or more standards-based inter-network interfaces (e.g., as defined by Third Generation Partnership Project (3GPP) standards) established between the MSO core network and the MNO core network and/or a dedicated core to provide a data signal pathway between the MNO core network and the MSO core network. As such, a user equipment (UE) receives data services through the H-MVNO core network via the standards-based inter-network interface when the UE is connected to a radio access network (RAN) for the MNO core network. Various configurations provide data services for single-subscriber identity module (SIM) UEs and dual-SIM UEs. Voice/message services are provided by a voice/message core.

Abstract: An insulated structure for an appliance includes a plurality of walls, a cavity defined by the plurality of walls, and an aperture defined by one of the plurality of walls. The aperture is employed in evacuating the cavity to establish a less-than-atmospheric pressure within the cavity. A base structure is coupled to an interior surface of the one of the plurality of walls that defines the aperture. The base structure is aligned with the aperture. A pressure sensor is received by the base structure. The base structure and the pressure sensor together define a pressure-sensing assembly.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer; a redistribution layer (RDL) on the first layer, wherein the RDL includes conductive vias having a greater width towards a first surface of the RDL and a smaller width towards an opposing second surface of the RDL; wherein the first surface of the RDL is electrically coupled to the second surface of the first die by first solder interconnects having a first solder; and a second die in a second layer on the RDL, wherein the second die is electrically coupled to the RDL by second solder interconnects having a second solder, wherein the second solder is different than the first solder.

Abstract: A thermally conductive interface device produced from a thermally conductive interface material is disclosed. The device may be employed in a battery system of an electric or hybrid vehicle. The thermally conductive interface material comprises a composition of at least one silicone base, at least one inorganic filler, at least one silicone oil, a least one peroxide cross-linking agent, and/or at least one of a flame retardant and a colorant. The inorganic fillers and/or the silicone oils may be functionalized or non-functionalized. The silicone base may be a high consistency rubber (HCR) silicone.

Abstract: A vehicle mode triggered control system for a vehicle includes a hybrid control processor (HCP) configured to detect a current operating mode of the vehicle, determine a set of inactive sub-systems of a set of sub-systems of the vehicle that are not configured to operate during the current operating mode of the vehicle, wherein each of the set of sub-systems is configured to for limited mode-based operation and not during a full operating period of the vehicle, and execute application software including a plurality of application functions by executing a first set of application functions of the plurality of application functions at a first rate and executing a second set of application functions of the plurality of application functions at a slower second rate, wherein the second set of application functions are limited to one or more of the set of inactive sub-systems.

Abstract: An exhaust conduit assembly includes: an exhaust conduit body defining an exhaust flow path; an injection aperture extending through the exhaust conduit body; and a doser mount portion including: an inlet port configured to receive a coolant, a channel configured to receive the coolant from the inlet port, at least a portion of the channel extending around at least a portion of the injection aperture, the channel including a first section and a second section, and an outlet port configured to receive the coolant from the channel. The doser mount portion defines a cavity configured to receive at least a portion of a dosing module and a ridge defines a base of the cavity, wherein the first portion of the channel is disposed adjacent to the cavity and the second portion of the channel is disposed adjacent to the ridge.

Abstract: Embodiments may relate to a microelectronic package that includes a substrate with a cavity therein. A component may be positioned within the substrate, and exposed by the cavity. A solder bump may be positioned within the cavity and coupled with the component, and a bridge die may be coupled with the solder bump. Other embodiments may be described or claimed.

Abstract: Alignment markers are created on a carrier wafer prior to attachment of integrated circuit dies to the carrier wafer. The alignment markers can be used in aligning integrated circuit dies to the carrier wafer during attachment of the integrated circuit dies to the carrier wafer. A reconstituted wafer can be created from the integrated circuit dies attached to the carrier wafer and the alignment markers are part of the reconstituted wafer. The alignment markers can further be used to align a wafer bonding layer to the reconstituted wafer. The wafer bonding layer can be used in attaching the reconstituted wafer to an interposer, another wafer, or another microelectronic structure. The alignment markers are located outside an outer lateral boundary of the integrated circuit dies (such as between integrated circuit dies) and are not connected to any metal lines in the integrated circuit dies in the reconstituted wafer.

Abstract: A circuit comprising a first Fourier Transform block operable to perform a Fourier Transform and having a first input configured for receiving an I signal and a second input configured for receiving a Q signal; a first plurality of n of outputs for I channels and Q channels each comprising a different frequency bin output from the Fourier Transform; I and Q summing blocks comprising a set of connector lines connecting an ith one of I channels with an ith one of the Q channels; an inverse Fourier Transform block connected to the summing blocks and operable to perform an inverse Fourier Transform; a correlator for correlating the outputs of the inverse Fourier Transform; a Fourier Transform block for Fourier Transforming the correlator output; a comparator for comparing the correlation term to zero; and an error correction circuit for tuning the magnitude and phase of the I and Q channels using the comparator output as feedback.

Abstract: A synchronous high voltage control system for a fuel cell battery electric vehicle (FCBEV) includes a fuel cell propulsion system (FCPS) configured to control a fuel cell system of an electrified powertrain of the FCBEV based on a mode control signal, wherein FCPS is configured to control the fuel cell to selectively support a high voltage bus, and an electrified vehicle control unit (EVCU) configured to (i) supervise a battery pack control module (BPCM) that is configured to control contactors to connect or disconnect a high voltage battery system to and from the high voltage bus and (ii) generate the mode control signal for the FCPS, wherein the EVCU is configured to utilize the mode control signal to have synchronous behavior across all high voltage systems of the FCBEV including the high voltage battery system and the fuel cell system.

Abstract: Input/output (I/O) routing from one integrated circuit die to other integrated circuit dies in an integrated circuit component comprising heterogeneous and vertically stacked die is made from the top and bottom surfaces of the integrated circuit die to the other dies. Die-to-die I/O routing from the die to laterally adjacent die is made from the top surface of the die via one or more redistribution layers. Die-to-die routing from the die to vertically adjacent die is made via hybrid bonding on the bottom surface of the die. Embedded bridges or chiplets or not used for die-to-die I/O routing, which can free up space for more through-dielectric vias to provide power and ground connections to the die, which can provide for improved power delivery.

Abstract: A lighting system is provided for illuminating a cooking cavity in a cooking appliance. The lighting system includes a light guide rod configured to guide an illumination and a reflective element optically coupled to the light guide rod for reflecting the illumination from the light guide rod toward the cooking cavity. A guide for insertion of the light guide rod extends longitudinally between an insertion end and a reflective element connection end coupled to the reflective element. The guide defines an inner surface that is tapered, becoming narrower from the insertion end towards the reflective element connection end, for guiding the light guide rod during optical coupling with the reflective element.

Abstract: Systems, apparatus, and articles of manufacture are disclosed to enable integrated circuit packages with double hybrid bonded dies and methods of manufacturing the same include an integrated circuit (IC) package including a first semiconductor die including first metal vias spaced apart along a first layer of a first dielectric material, the first metal vias connected to respective first metal pads of the first semiconductor die, a second semiconductor die including second metal pads of the second semiconductor die, and a hybrid bond layer including a third dielectric material and third metal vias spaced apart along the third dielectric material, a subset of the third metal vias electrically coupling ones of the first metal pads to respective ones of the second metal pads, a first one of the third metal vias positioned beyond a lateral side of the first semiconductor die.