Abstract: A number of variations are disclosed including a system and method for modifying, in real-time, at least one brake or powertrain application to individual roadwheels of a vehicle to increase lateral maneuver capability in a vehicle having an operational, partially operational, failing, or failed electronic steering system. The system and method may include modifying at least one brake or powertrain command to individual roadwheels where vehicle instability is detected.

Abstract: The present disclosure relates generally to methods and systems useful in imaging applications, especially biological imaging applications, and applications in the metrology, atmospheric, scientific and medical fields. In one aspect, the disclosure provides a method of imaging an object, including illuminating the object with incident radiation through one or more adaptive optical elements; receiving transmitted radiation from the object at a photodetector to provide a base image; and performing the following steps one or more times: adjusting the one or more adaptive optical elements, the adjustment including modifying an optical transfer function of the one or more adaptive optical elements, and receiving transmitted radiation from the object at the photodetector to provide an adjusted image; wherein the adjustment and receiving steps are performed until the adjusted image has substantially reduced aberrations compared to the base image.

Abstract: An apparatus and method for adaptive handling of slides using a robot arm. The apparatus includes at least a computing device comprised of a processor and a memory communicatively connected to the processor. The memory instructs the processor to receive a calibration procedure, wherein the calibration procedure is generated using a plurality of waypoints. The processor controls the at least a robotic arm as a function of the calibration procedure, wherein the calibration procedure is configured to cause the robotic arm to pick, using a pick waypoint of the plurality of waypoints, and place, using a place waypoint of the plurality of waypoints, a slide. The processor receives a plurality of feedback from the at least a robotic arm. The processor generates, using the plurality of feedback, an adapted pick waypoint. The memory instructs the processor to generate, using the plurality of feedback, an adapted place waypoint.

Abstract: Example methods and systems for network status visualization are described. In one example, a computer system may obtain status information associated with a set of multiple object-attribute pairs. Each object-attribute pair may include one of multiple objects and one of multiple attributes. The computer system may generate and display a user interface (UI) view that includes an array of multiple interactive UI elements to display the status information. In response to detecting a first interaction with a first interactive UI element, the computer system may update the UI view to display and enable selection of a first action. In response to detecting a second interaction with a second interactive UI element, the computer system may update the UI view to display and enable selection of a second action.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

Abstract: A polymeric container including a finish defining an opening. A base is configured to support the container upright. A grip area is between the opening and the base. A plurality of grip panels are at the grip area. Each one of the grip panels has a depth, a height, and a width. The depth is at least 17% of the height, and the depth is at least 10% of the width.

Abstract: An electronic device carrier structure can include a substrate including a plurality of electrical contacts spaced apart on the substrate, a plurality of electrically conductive balls, each of the electrically conductive balls being on a respective one of the plurality of electrical contacts, solder attaching each of the electrically conductive balls to respective ones of the electrical contacts to form an attachment boundary where the solder ends on a surface of each of the plurality of electrically conductive balls, and a polymer layer extending on the substrate onto the plurality of electrically conductive balls to form a surface of the polymer layer at a contact point on the plurality of electrically conductive balls that is above the attachment boundary and below an apex of each of the plurality of electrically conductive balls.

Abstract: A number of variations may include a method or system using human driving characteristics in autonomous vehicle driving method or system.

Abstract: A data processing system implements accessing content items from a plurality of data sources, generating a knowledge graph by analyzing each of the content items with a language model to obtain embedding vectors representing each first content items, receiving a query and an indication of a format for results of the query from a first client device, generating query embeddings for the query using the first language model, searching the knowledge graph based on the query embeddings to obtain the results of the query, generating a representation of the results of the query according to the indication of the format for the results of the query, and causing the first client device to present the representation of the results of the query on a user interface of the first client device.

Abstract: A data processing system implements techniques for implementing AI-driven software modules. The data processing system automates the generation of software for analyzing complex data sets. The modules can be used to implement software modules for an information analysis and decision support platform that accurately acquires, assesses, compares, and analyzes large volumes of data across the various domains of the pharmaceutical and/or medical device spaces in a timely and efficient manner. The techniques provided herein provide utilize language models that are trained to automate the development software modules that utilize the knowledge graph. The modules are generated from natural language queries presented by a user which are analyzed and used to generate a template for the software module.

Abstract: Disclosed herein are microelectronic assemblies, related apparatuses, and methods. In some embodiments, a microelectronic assembly may include a first die in a first layer; and a second and third die in a second layer, the second layer coupled to the first layer by hybrid bond interconnects having a first pad and a second pad, wherein the first pad is coupled to a first via in the second die and the first pad is offset from the first via by a first dimension, and the second pad is coupled to a second via in the third die and the second pad is offset from the second via by a second dimension different than the first dimension. In some embodiments, the first pad is offset from the first via in a first direction and the second pad is offset from the second via in a second direction different than the first direction.

Abstract: In aspect, a computerized method for deploying a containerized product without an orchestrator comprising: providing a single service builder and a single deployer pipeline that is used across for a plurality of services; implementing an automation flow, wherein each service of the plurality of services comprises a plurality of configuration keys and wherein the automation flow dynamically populates and injects plurality of configuration keys into a container during a deployment operation; and implementing an automation of the automation flow.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first layer with a first die having a first contact; a second die having a second contact; and a pad layer, on the first and second dies, including a first pad and a second pad, where the first pad is coupled to and offset from the first contact in a first direction, and the second pad is coupled to and is offset from the second contact in a second direction different than the first direction; and a second layer including a third die having third and fourth contacts, where the first layer is coupled to the second layer by metal-to-metal bonds and fusion bonds, the first contact is coupled to the third contact by the first pad, and the second contact is coupled to the fourth contact by the second pad.

Abstract: A method implements customer sentiment analysis using logs and feedback. Log data is received. The log data is processed with a text generation model to generate synthesized text. The synthesized text is processed with a sentiment prediction model to generate a sentiment prediction. The sentiment prediction model is trained with a training label received responsive to a similarity score of a training vector meeting a similarity threshold. The sentiment prediction is presented.

Abstract: An apparatus comprising an integrated circuit device comprising a fiducial area of a first layer, the fiducial area comprising a metal area and a metal free area; and a plurality of zones that are metal free in multiple layers adjacent to the first layer, wherein the zones are defined by a footprint based on the fiducial area of the first layer and a second fiducial area of a second integrated circuit device, the footprint comprising multiple slits.

Abstract: An apparatus comprising a first integrated circuit device, the first integrated circuit device comprising a fiducial having a length size greater than a width size of the fiducial, wherein the fiducial comprises at least one first area and at least one second area, wherein the at least one first area is to stop light from a light source and the at least one second area is to pass light from the light source during a determination of an alignment between the first integrated circuit device and a second integrated circuit device.

Abstract: An apparatus comprising a first integrated circuit device, the first integrated circuit device comprising a first layer with an area comprising metallization and metal-free slits; and a fiducial in a second layer above the first layer, the fiducial formed over the area comprising the metallization and metal-free slits.

Abstract: In one embodiment, an integrated circuit package includes a first (top) package substrate, a photonics integrated circuit (PIC) die coupled to the first package substrate, and a second package substrate coupled to a bottom side of the first package substrate. The package further includes a pedestal coupled to a top side of the second package substrate in an area of the second package substrate that extends beyond an edge of the first package substrate at which the PIC die is located.

Abstract: Systems and methods for performing handovers for a user equipment (UE) include storing a dynamically-triggered search timer value and a high priority public land mobility network (PLMN) identifier at the UE (e.g., using a universal subscriber identity module (USIM). The UE generates a periodic measurement report with a list of PLMN identifiers associated with nearby access network nodes. In response to entering idle mode, the UE 102 determines whether the list of PLMN identifiers includes the high priority PLMN. In response to the list of PLMN identifiers including the high priority PLMN, the UE 102 initiates a dynamically-triggered search for a handover at a time indicated by the dynamically-triggered search timer value rather than by a larger minimum periodic search timer value. Accordingly, the dynamically-triggered search occurs quickly (e.g., between 5 and 30 seconds) after the UE enters the idle mode as compared to minimum periodic search timer-based handover searches.

Abstract: Photonic packages and device assemblies that include photonic integrated circuits (PICs) coupled to optical lenses on lateral sides of the PICs. An example photonic package comprises a package support, an integrated circuit (IC), an insulating material, a PIC having an active side and a lateral side substantially perpendicular to the active side. At least one optical structure is on the active side. A substantial portion of the active side is in contact with the insulating material, and the PIC is electrically coupled to the package support and to the IC. The photonic package further includes an optical lens coupled to the PIC on the lateral side. In some embodiments, the photonic package further includes an interposer between the PIC or the IC and the package support.