Abstract: Input/output (I/O) routing from one integrated circuit die to other integrated circuit dies in an integrated circuit component comprising heterogeneous and vertically stacked die is made from the top and bottom surfaces of the integrated circuit die to the other dies. Die-to-die I/O routing from the die to laterally adjacent die is made from the top surface of the die via one or more redistribution layers. Die-to-die routing from the die to vertically adjacent die is made via hybrid bonding on the bottom surface of the die. Embedded bridges or chiplets or not used for die-to-die I/O routing, which can free up space for more through-dielectric vias to provide power and ground connections to the die, which can provide for improved power delivery.

Abstract: Alignment markers are created on a carrier wafer prior to attachment of integrated circuit dies to the carrier wafer. The alignment markers can be used in aligning integrated circuit dies to the carrier wafer during attachment of the integrated circuit dies to the carrier wafer. A reconstituted wafer can be created from the integrated circuit dies attached to the carrier wafer and the alignment markers are part of the reconstituted wafer. The alignment markers can further be used to align a wafer bonding layer to the reconstituted wafer. The wafer bonding layer can be used in attaching the reconstituted wafer to an interposer, another wafer, or another microelectronic structure. The alignment markers are located outside an outer lateral boundary of the integrated circuit dies (such as between integrated circuit dies) and are not connected to any metal lines in the integrated circuit dies in the reconstituted wafer.

Abstract: A synchronous high voltage control system for a fuel cell battery electric vehicle (FCBEV) includes a fuel cell propulsion system (FCPS) configured to control a fuel cell system of an electrified powertrain of the FCBEV based on a mode control signal, wherein FCPS is configured to control the fuel cell to selectively support a high voltage bus, and an electrified vehicle control unit (EVCU) configured to (i) supervise a battery pack control module (BPCM) that is configured to control contactors to connect or disconnect a high voltage battery system to and from the high voltage bus and (ii) generate the mode control signal for the FCPS, wherein the EVCU is configured to utilize the mode control signal to have synchronous behavior across all high voltage systems of the FCBEV including the high voltage battery system and the fuel cell system.

Abstract: A lighting system is provided for illuminating a cooking cavity in a cooking appliance. The lighting system includes a light guide rod configured to guide an illumination and a reflective element optically coupled to the light guide rod for reflecting the illumination from the light guide rod toward the cooking cavity. A guide for insertion of the light guide rod extends longitudinally between an insertion end and a reflective element connection end coupled to the reflective element. The guide defines an inner surface that is tapered, becoming narrower from the insertion end towards the reflective element connection end, for guiding the light guide rod during optical coupling with the reflective element.

Abstract: Systems, apparatus, and articles of manufacture are disclosed to enable integrated circuit packages with double hybrid bonded dies and methods of manufacturing the same include an integrated circuit (IC) package including a first semiconductor die including first metal vias spaced apart along a first layer of a first dielectric material, the first metal vias connected to respective first metal pads of the first semiconductor die, a second semiconductor die including second metal pads of the second semiconductor die, and a hybrid bond layer including a third dielectric material and third metal vias spaced apart along the third dielectric material, a subset of the third metal vias electrically coupling ones of the first metal pads to respective ones of the second metal pads, a first one of the third metal vias positioned beyond a lateral side of the first semiconductor die.

Abstract: A computer-implemented method includes determining that a specific type of information is to be identified in a set of data. The method further includes sampling the set of data according to various sampling criteria to identify the specified type of information. The sampling criteria include at least a recency criterion indicating that the data to be sampled has been updated within a specified timeframe and a lineage criterion indicating that the data to be sampled is within a maximum hierarchical distance from a source data structure. The method also includes identifying, from the data that was sampled according to the sampling criteria, one or more data structures that include the specified type of information. The method further includes applying security policies to the identified data structures based on the type of information that was identified in the set of data. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: A cooking appliance includes a wall partitioning a compartment into first and second zones and a housing disposed in the compartment and extending through an opening in the wall such that a first portion of the housing is in the first zone and a second portion of the housing is in the second zone. A flange assembly circumscribes the housing and is disposed against the wall at the opening to inhibit air flow though the opening. The flange assembly has a first member and a second member slidably received in the first member.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for generating a computer chip placement. One of the methods includes obtaining netlist data for a computer chip; and generating a computer chip placement, comprising placing a respective macro node at each time step in a sequence comprising a plurality of time steps, the placing comprising, for each time step: generating an input representation for the time step; processing the input representation using a node placement neural network having a plurality of network parameters, wherein the node placement neural network is configured to process the input representation in accordance with current values of the network parameters to generate a score distribution over a plurality of positions on the surface of the computer chip; and assigning the macro node to be placed at the time step to a position from the plurality of positions using the score distribution.

Abstract: A method for processing an image of a subterranean formation includes performing edge detection on the image to produce a first processed image. The method also includes performing gridlines localizer on the first processed image to produce a second processed image. The method also includes performing noise filtering on the second processed image to produce a third processed image. The method also includes performing pattern recognition on the third processed image to determine that the image that corresponds to the third processed image is linear scale type or logarithmic scale type.

Abstract: Hybrid bonding interconnect (HBI) architectures for scalability. Embodiments implement a bonding layer on a semiconductor die that includes a thick oxide layer overlaid with a thin layer of a hermetic material including silicon and at least one of carbon and nitrogen. The conductive bonds of the semiconductor die are placed in the thick oxide layer and exposed at the surface of the hermetic material. Some embodiments implement a non-bonding moisture seal ring (MSR) structure.

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Abstract: The invention provides methods of making immune effector cells (e.g., T cells, NK cells) that can be engineered to express a chimeric antigen receptor (CAR), compositions and reaction mixtures comprising the same, and methods of treatment using the same.

Abstract: Systems and methods enhance handling, within an access point (AP) of a local area network, of content from a content provider. A content session core of the AP opens a session with the content provider and allows interaction between a user of a first end device and the content provider via the session. Content from the content provider is received at the content session core and forwarded for play on the first end device. The content session core may mirror the content to a second real end device without requiring an additional session with the content provider, and may switch play of the content from the first to the second end devices without disconnecting the session with the content provider. A wireless LAN controller enhances a connectivity experience of a mobile device by determining its location and predicting when to handoff connectivity between wireless APs of the LAN.

Abstract: A baffle for a membrane device. The membrane device includes a membrane, a feed flow inlet, and a feed flow outlet, such as for water filtration. The baffle includes a proximal end and a distal end, wherein the baffle is operable to extend along at least a portion of the membrane so that the proximal end is toward the feed flow inlet of the membrane device and the distal end is toward the feed outlet of the membrane device. The baffle includes a first geometry portion and a second geometry portion. The first geometry portion includes a higher aspect ratio than the second geometry portion and the first geometry portion is arranged closer to the proximal end of the baffle than the second geometry portion. Also described is a method of producing the baffle and a membrane device containing the baffle.

Abstract: Photonic packages and device assemblies that include photonic integrated circuits (PICs) coupled to optical lenses on lateral sides of the PICS. An example photonic package comprises a package support, an integrated circuit (IC), an insulating material, a PIC having an active side and a lateral side substantially perpendicular to the active side. At least one optical structure is on the active side. A substantial portion of the active side is in contact with the insulating material, and the PIC is electrically coupled to the package support and to the IC. The photonic package further includes an optical lens coupled to the PIC on the lateral side. In some embodiments, the photonic package further includes an interposer between the PIC or the IC and the package support.

Abstract: Disclosed is a number of variations that may include a method, system, or computer product useful in determining an intended yaw or yaw rate that a driver desires using a model, comparing the yaw or yaw rate with the actual vehicle yaw or yaw rate to determining a yaw error or yaw rate error, using the yaw error or yaw rate error in a model predictive control to determine the brake pressure required to minimize or reduced to zero the yaw error or the yaw rate error.

Abstract: An EOL bracket assembly for an appliance includes an EOL plug configured to hold a plurality of wires for attachment to an external power source; an EOL bracket having a through aperture, an interior detent defined within the aperture for receiving and retaining the EOL plug, and flexible latches for securing the EOL bracket into a through hole of a panel of the appliance; and an EOL cap defining a cap body sized to cover the EOL bracket when installed into the panel, the EOL cap defining locking snaps for securing the EOL cap into cutouts of the through hole around the EOL bracket.

Abstract: A number of variations are disclosed including a system and method for modifying, in real-time, at least one brake or powertrain application to individual roadwheels of a vehicle to increase lateral maneuver capability in a vehicle having an operational, partially operational, failing, or failed electronic steering system. The system and method may include modifying at least one brake or powertrain command to individual roadwheels where vehicle instability is detected.