Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: Embodiments disclosed herein include multi-die packages with open cavity bridges. In an example, an electronic apparatus includes a package substrate having alternating metallization layers and dielectric layers. The package substrate includes a first plurality of substrate pads and a second plurality of substrate pads. The package substrate also includes an open cavity between the first plurality of substrate pads and the second plurality of substrate pads, the open cavity having a bottom and sides. The electronic apparatus also includes a bridge die in the open cavity, the bridge die including a first plurality of bridge pads, a second plurality of bridge pads, and conductive traces. An adhesive layer couples the bridge die to the bottom of the open cavity. A gap is laterally between the bridge die and the sides of the open cavity, the gap surrounding the bridge die.

Abstract: An electrified powertrain that generates and transfers drive torque to a driveline of a hybrid vehicle includes first and second electric motors, an internal combustion engine (ICE), a first, second and third planetary gear set, and multiple clutches. The first planetary gear set is selectively coupled for rotation with the second electric motor, the first planetary gear set including a first sun gear, a first carrier and a first ring gear, wherein the first carrier is coupled to the driveline. The second planetary gear set is selectively coupled for rotation with the second electric motor output, the second planetary gear set including a second sun gear, a second carrier and a second ring gear. An input split device comprises the third planetary gear set that is selectively coupled for rotation with one of the first electric motor and the ICE.

Abstract: Methods, apparatus, and processor-readable storage media for detection of anomalous behavior on online platforms using machine learning techniques are provided herein. An example method includes obtaining a set of machine learning models configured to detect anomalous behavior associated with users interacting with an online platform and performing an incremental machine learning process on one or more of the machine learning models in the set. The incremental machine learning process may include obtaining data related to interactions of users with the online platform, updating at least one of the machine learning models in the set based on the obtained data, comparing the machine learning models, and selecting one of the machine learning models from the set to be used by the online platform based on the comparison. The method may further include determining, utilizing the selected machine learning model, that a given user is exhibiting anomalous behavior on the online platform.

Abstract: This disclosure concerns plant-derived organic compounds and their use thereof to promote the growth of plants and biofilms.

Abstract: Systems and methods for content selection and presentation are disclosed. Training data including indicating one or more interactions with one or more content elements and associated with one of a plurality of individual contexts is received. A selection model is trained by applying a reinforcement learning mechanism and an individual explore-exploit mechanism. A context for a user is selected by applying the selection model, which is configured to determine an expected future reward value of at least one of the plurality of individual contexts, determine an expected future reward value of a global context based on a past click-through rate, a reward value, and a future click-through rate, and, select the global context or one of the one or more individual contexts based on a comparison of the expected future reward values.

Abstract: A system and a method for managing workload of an application in a cloud infrastructure is disclosed. The cloud infrastructure may include an existing cloud infrastructure (ECI) and an Elastic Machine Pool Infrastructure (EMPI). The method may include connecting the EMPI to the ECI by configuring cloud control manager of the ECI. Further, the method may include receiving the workload from the application running on the cloud infrastructure. The workload may be allocated to an Elastic Virtual Machine (EVM) hosted by the EMPI or a VM hosted by the ECI based on at least one of an EMP profile of the application, status of the EVM, and workload characteristics of the EVM. Further, the one or more bare metal servers and the one or more EVMs may be managed based on at least one of the workload characteristics and the status of the EVM.

Abstract: A system for an engine to determine in situ under specified conditions the auto-ignition quality of the fuel used in a compression ignition engine is provided. The system may include an ion current sensor. The ion current sensor may access an engine cylinder for obtaining ion current data. A control unit may be in communication with the ion current sensor for receiving the ion current data. The control unit being configured to determine the auto-ignition quality of the fuel based on features of the ion current data.

Abstract: A method for scheduling requests in a storage system includes receiving, at a scheduler, a request associated with a first storage device, receiving, at the scheduler, task information from a neural network circuit, the task information being associated with a task performed by the first storage device, and modifying a processing of the request at the first storage device based on the task information.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

Abstract: A system for simulating operation of a battery pack comprising a plurality of battery modules includes an electrical model configured to simulate electrical behavior of a respective battery module and a thermal model configured to simulate thermal behavior of the respective battery module. The electrical model provides outputs coupled as inputs to the thermal model, and the thermal model provides outputs coupled as inputs to the electrical model. A coolant model is configured to couple with the thermal model, the coolant model to simulate cooling of the respective battery module based on a temperature and a heat transfer coefficient associated with the respective battery module.

Abstract: Memory stacks including replacement blocks and related methods are disclosed. An example integrated circuit disclosed herein includes a first layer including a memory die, and a second layer including a replacement block communicatively coupled to the memory die, the second layer including and a dielectric shell surrounding the replacement block.

Abstract: Systems, apparatus, articles of manufacture, and methods to reduce stress in integrated circuit packages are disclosed. An example semiconductor chip includes: a front surface; a back surface opposite the front surface; a first lateral surface extending between the front surface and the back surface; a second lateral surface extending between the front surface and the back surface; and a curved fillet at an intersection between the first lateral surface and the second lateral surface.

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Abstract: A query operation is performed to obtain information for a select entity of a computing environment. The information includes boost information of one or more boost features currently available for the select entity. The one or more boost features are to be used to temporarily adjust one or more processing attributes of the select entity. The boost information obtained from performing the query operation is provided in an accessible location to be used to perform one or more actions to facilitate processing in the computing environment.

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Abstract: A door assembly includes a structural wrapper defining an insulating cavity. The structural wrapper defines a sensor port. A sensor assembly is coupled to an outer surface of the structural wrapper proximate to the sensor port. The sensor assembly includes a connector having a base coupled to a housing. The base is coupled to the structural wrapper. The connector defines an interior in fluid communication with the insulating cavity. A pressure sensor is disposed within the housing. The pressure sensor is configured to sense a pressure within the insulating cavity. At least one plate is disposed at an open end of the housing. The pressure sensor includes sensor pins that extend through the at least one plate.

Abstract: A method is provided comprising storing, in a first subscriber data server, subscriber data for each of a plurality of wireless devices, the subscriber data enabling wireless communication services for the plurality of wireless devices in a wireless network; determining to migrate the subscriber data from the first subscriber data server to a second subscriber data server; upon determining to migrate the subscriber data, initiating a migration process for the subscriber data from the first subscriber data server to a second subscriber data server by copying the subscriber data from the first subscriber data server to the second subscriber data server; and while copying and one or more new wireless devices are being provisioned for the wireless communication services in the wireless network, adding new subscriber data for the one or more new wireless devices to both the first subscriber data server and to the second subscriber data server.

Abstract: A photonic integrated circuit (PIC), a semiconductor assembly including the PIC, a multi-chip package including the PIC, and a method of forming the PIC. The PIC includes a PIC substrate, and a semiconductor layer on a top surface of the PIC substrate and including a semiconductor material and an optical component. The PIC substrate defines an air cavity therein extending in a direction from a bottom surface of the PIC substrate toward and in registration with the optical component. The semiconductor layer is free of any opening therethrough in communication with the air cavity.

Abstract: A door assembly for an appliance includes a wrapper operably coupled with a liner to define an insulation cavity therebetween. An attachment assembly operably couples to the liner and defines a slot. A storage assembly couples with the attachment assembly. The storage assembly includes a bin. The storage assembly further includes a bracket operably coupling the bin to the attachment assembly via a retention feature. The bracket includes a support member defining a groove extending between ends of the bracket. The storage assembly further includes a rim extending from the bin and engaging the groove to secure the bin to the bracket.