Abstract: Disclosed is a micro-coil assembly including a micro-coil unit which is inserted into an aneurysm or other vascular malformation of a patient and prevents inflow of blood by inducing thrombus, a coil pusher unit which is arranged adjacent to the micro-coil unit and delivers the micro-coil unit to the aneurysm or other vascular malformation of the patient, a tensile wire which is relatively movably arranged in the coil pusher unit, a tie which connects the micro-coil unit and the tensile wire, and a tie cutting unit which is arranged adjacent to the coil pusher unit such that at least a part of the tie cutting unit is movable between a setting position for maintaining the tie in a tied state and a cutting position for cutting the tie, and cuts the tie when moved to the cutting position.

Abstract: Aspects relate to systems, methods, and apparatus for a manufacturing tool. The manufacturing tool is comprised of a vacuum tool and an ultrasonic welder as a unified manufacturing tool. The manufacturing tool may be used to pick and position a manufacturing part that is then welded with the associated ultrasonic welder.

Abstract: Methods for protecting data on an integrated circuit including a memory are described. One method includes storing nonvolatile protection codes on the integrated circuit. The nonvolatile protection codes have a first value indicating a protected state or a second value indicating an unprotected state for respective sectors in a plurality of sectors of the memory. The method includes storing volatile protection codes on the integrated circuit. The volatile protection codes have a first value indicating a protected state or a second value indicating an unprotected state for respective sectors in the plurality of sectors. The method includes blocking modification in a particular sector using circuitry on the integrated circuit when the volatile protection code for the particular sector has the first value, else allowing modification in the particular sector, and setting the volatile protection codes to values of the nonvolatile protection codes in an initialization procedure.

Abstract: A method that incorporates teachings of the present disclosure may include, for example, the steps of transmitting media content to a group of set top boxes for presentation with an overlay superimposed onto the media content, receiving a first comment from a first set top box of the group of set top boxes where the first comment is presentable with the overlay and the media content by the group of set top boxes, determining a first advertisement based on the first comment, and transmitting the first advertisement to the first set top box for presentation with the overlay and the media content. Other embodiments are disclosed.

Abstract: The present disclosure provides a method of forming a capacitor structure and a capacitor structure. A semiconductor-on-insulator substrate is provided comprising a semiconductor layer, a buried insulating material layer and a semiconductor substrate material. A shallow trench isolation structure defining a first active region on the SOI substrate is formed, the first active region having a plurality of trenches formed therein. Within each trench, the semiconductor substrate material is exposed on inner sidewalls and a bottom face. A layer of insulating material covering the exposed semiconductor substrate material is formed, and an electrode material is deposited on the layer of insulating material in the first active region.

Abstract: Provided is a method of controlling an electronic device by using a remote control device comprising a touch screen, the method including selecting one of a plurality of functions supported by the electronic device via the touch screen, sequentially displaying a plurality of user interfaces, usable for controlling the function selected with an input detected by the touch screen, one-by-one, and controlling the electronic device by using one of the plurality of user interfaces that are sequentially displayed.

Abstract: A direct broadcast satellite (DBS) reception assembly may comprise an integrated circuit that is configurable between or among a plurality of configurations based on content requested by client devices served by the DBS reception assembly. In a first configuration, multiple satellite frequency bands may be digitized by the integrated circuit as a single wideband signal. In a second configuration, the satellite frequency bands may be digitized by the integrated circuit as a plurality of separate narrowband signals. The integrated circuit may comprise a plurality of receive paths, each of the receive chains comprising a respective one of a plurality of low noise amplifiers and a plurality of analog-to-digital converters.

Abstract: A display may be provided with an active central region and a peripheral inactive region. The display may have one or more flexible edges in the peripheral inactive region. Conductive lines may pass between components in the active central region such as display pixels and touch sensor electrodes and components in the inactive peripheral region such as gate driver circuitry and patterned interconnect lines. Each conductive line may have an unbent segment on a portion of a display layer in the active central region and may have a segment on the bent edge of the display layer. The display layer may be formed from a polymer or other flexible material. The bent segments may be configured to be less susceptible to increases in resistance from bending than the unbent segments.

Abstract: A planetary gear train of an automatic transmission for a vehicle includes: an input shaft and an output shaft; a first planetary gear set including a first, second, and third rotation elements; a second planetary gear set including a fourth, fifth, and sixth rotation elements; a third planetary gear set including a seventh, eighth, and ninth rotation elements; a fourth planetary gear set including a tenth, eleventh and twelfth rotation elements; a first shaft interconnecting the first rotational element and the twelfth rotational element; a second shaft connected with the second rotational element and the input shaft; a third shaft interconnecting the third rotational element and the fourth rotational element; a fourth shaft interconnecting the sixth rotational element and the seventh rotational element; a fifth shaft interconnecting the ninth rotational element and the tenth rotational element; and a sixth shaft connected with the eleventh rotational element and the output shaft.

Abstract: A kind of ferrite used as a three-way catalyst for treatment of exhaust gas from vehicle engines is revealed. Mono-nitrogen oxides (NOX), carbon monoxide (CO) and hydrocarbons (HC) in exhaust gas from vehicle engines can be removed effectively by the three-way catalyst made from ferrite containing at least one substitutional metal.

Abstract: A high-voltage MOS transistor includes a semiconductor substrate, a gate oxide layer on the semiconductor substrate, a gate on the gate oxide layer, a spacer covering a sidewall of the gate, a source on one side of the gate, and a drain on the other side of the gate. The gate includes at least a first discrete segment and a second discrete segment. The first discrete segment is not in direct contact with the second discrete segment. The spacer fills into a gap between the first discrete segment and the second discrete segment.

Abstract: Provided is an interferometer for inspecting a test sample. The interferometer includes: a light source for providing a light beam; a beam splitting element, splitting the light beam into first and second incident light, wherein the first incident light is reflected by the test sample into first reflection light; a reflecting element, reflecting the second incident light into second reflection light; an optical detection element, receiving the first and the second reflection light into an interference signal; and a signal processing module, coupled to the optical detection element, for performing spatial differential calculation on the interference signal to generate a demodulation image of the test sample.

Abstract: A package structure is provided. The package structure includes a leadframe including a plurality of connection portions; a device including a substrate, an active layer disposed on the substrate and a plurality of electrodes disposed on the active layer, wherein the electrodes of the device are connected to the connection portions of the leadframe; a conductive unit having a first side and a second side, wherein the first side of the conductive unit connects to the substrate of the device and the conductive unit connects to at least one of the connection portions of the leadframe; and an encapsulation material covering the device and the leadframe, wherein the second side of the conductive unit is exposed from the encapsulation material.

Abstract: A lightweight solar module building materials set includes a solar module, a perforated plate defining multiple perforations, and a support assembly which is essentially composed of a supportive plate and a honeycomb structure and can support the solar module and the perforated plate. The perforated plate, the honeycomb structure, and the supportive plate define multiple sound absorption compartments. Sound waves can enter the sound absorption compartments via the perforations of the perforated plate. The solar module includes a solar cell body, which is protected by a flexible transparent protective layer and supported by the support assembly, to conduct photoelectric conversion. The solar module building materials set can be mounted on an affixing means to construct a sound insulation wall, which can generate solar power and absorb sound waves. As such, the ratio of green energy supply and the comfort of life can be increased.

Abstract: A server device is provided. The server device includes a chassis with a containing space, first and second openings. The first and second openings are located at two opposite ends of the containing space. The chassis includes a motherboard module in the containing space; a power-supply module disposed in the containing space, electrically connected to the motherboard module, and capable of plugging in and out from the chassis via the first opening, wherein the power-supply module comprises a first power port located in the first opening; a power port connector comprising a second power port located in the second opening, and configured to selectively connect to the first power port located in the first opening; and a storage array module, electrically connected to the motherboard module and the power-supply module.

Abstract: A head-up display with variable focal length includes a projector which provides a beam with image, a magnifier lens module which is disposed on the route of the beam, and an array of lens which is movably disposed between the projector and the magnifier lens module. The beam forms an inter-image after passing the array of lens, then forms a virtual image after passing the magnifier lens module. To change the position of the virtual image, adjust the relative position between the array of lens and the magnifier lens module. A dispersion angle of the array of lens is ?d, a magnification of the magnifier lens module is M, a distance between the virtual image and user's eyes is VID, a visible range of user's eyes is Et, and satisfies the relationship as following: ?d=M*2*cot?1 (2VID/Et).

Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the device including gate structures on a substrate; source/drain layers on portions of the substrate that are adjacent the gate structures, respectively; first contact plugs contacting upper surfaces of the source/drain layers, respectively; a second contact plug contacting one of the gate structures, a sidewall of the second contact plug being covered by an insulating spacer; and a third contact plug commonly contacting an upper surface of at least one of the gate structures and at least one of the first contact plugs, at least a portion of a sidewall of the third contact plug not being covered by an insulating spacer.

Abstract: A package structure is provided. The package structure includes a molding compound. The package structure also includes an integrated circuit chip having a chip edge in the molding compound. The package structure further includes a passivation layer below the integrated circuit chip and the molding compound. In addition, the package structure includes a redistribution layer in the passivation layer. The package structure also includes first bumps electrically connected to the integrated circuit chip through the redistribution layer. The first bumps are inside the chip edge and arranged along the chip edge. The package structure further includes second bumps electrically connected to the integrated circuit chip through the redistribution layer. The second bumps are outside the chip edge and arranged along the chip edge. The first bumps are next to the second bumps. The first and second bumps are spaced apart from the chip edge.

Abstract: An electronic device is provided.

Abstract: The present disclosure relates to a foamable personal care composition, a personal care kit of parts, and uses thereof. In particular, the present disclosure relates to a foamable personal care composition and a personal care kit of parts used in skin or hair treatment.