Patents by Inventor Osamu Ichikawa

Osamu Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4620094
    Abstract: Disclosed is a photoelectric encoder for providing an electrical pulse signal corresponding to the rotational position and direction of a disk rotor. The encoder possesses a feedback means including a second light sensitive means and associated circuit for obtaining the stabilized output signal thereof in spite of the fluctuation of the power source voltage and/or ambient temperature or adhesion of extraneous substances to light emitting and/or sensing elements and others.
    Type: Grant
    Filed: June 5, 1984
    Date of Patent: October 28, 1986
    Assignees: Sharp Kabushiki Kaisha, Brother Industries, Ltd.
    Inventors: Zempei Tani, Kiyoshi Ebina, Osamu Ichikawa, Mamoru Imaizumi
  • Patent number: 4465543
    Abstract: An apparatus transposes a matrix of semiconductor pellets mounted on a first adhesive tape to a second adhesive tape in such a manner that the respective pellet rows are arranged spaced from the adjacent pellet rows. It has pellet-supporting means having an inclined plane and apical plane. The first adhesive tape bearing the matrix is carried stepwise along the inclined plane toward the apical plane to successively bring the respective rows of the matrix to the apical plane. Above the apical plane, a second adhesive tape is carried in a direction intersecting the pellet columns at right angles with the adhesive plane thereof facing the matrix. When each row mounted on the first tape is on the apical plane, the second tape is pressed against the row. Each time one pellet row is transposed to the second tape, the pellet-supporting means is shifted in a direction intersecting the pellet columns at right angles.
    Type: Grant
    Filed: September 22, 1982
    Date of Patent: August 14, 1984
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Tetsuo Sadamasa, Osamu Ichikawa, Tatsuro Beppu
  • Patent number: 4445132
    Abstract: One surface of a substrate of an LED module for a flat panel display has 8.times.8 element areas divided into a matrix form. Row electrodes extend on element areas arranged along the row direction, and column electrodes insulated from the row electrodes extend on element areas arranged in the column direction. At least one LED pellet is disposed for each element area and is connected to the row and column electrode associated with this area. A connecting pad is disposed as spaced apart from the four pellets in a unit area defined as a region consisting of four element areas. This connecting pad is connected to one of the row and column electrodes in the four element areas and is also connected through the substrate to a connecting pin arranged on the other surface of the substrate of the LED module.
    Type: Grant
    Filed: June 3, 1981
    Date of Patent: April 24, 1984
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Osamu Ichikawa, Tetsuo Sadamasa
  • Patent number: 4432131
    Abstract: In a method for manufacturing a display, a substrate having a surface on which a plurality of light-emitting diodes are aligned is disposed such that the surface opposes a surface of a table. A resin of a light-emitting and electrically insulating material which is kept in a fluid state is filled by capillarity into a space defined by the surface of the substrate and the surface of the table. The resin is then hardened, and the table is removed from a hardened resin. A display is obtained wherein at least the space between the adjacent LEDs is filled with the hardened resin.
    Type: Grant
    Filed: September 3, 1982
    Date of Patent: February 21, 1984
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Tetsuo Sadamasa, Osamu Ichikawa
  • Patent number: 4322735
    Abstract: A display device has a relatively large insulation substrate on which a metal layer is formed. On the metal layer on the insulation substrate, there are at least one pair of ceramic unit substrates which are disposed in close vicinity to each other, respectively having thereon metal layers bearing light emitting diodes. The metal layer on the insulation substrate is connected with the metal layers on the unit substrates at its end portions by means of, e.g., flexible lead frames.
    Type: Grant
    Filed: May 5, 1980
    Date of Patent: March 30, 1982
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Tetsuo Sadamasa, Osamu Ichikawa