Abstract: A method for feeding an antistatic compound to a polymerization reactor comprising the steps of: a) dispersing, under mixing conditions, a catalyst powder and an antistatic compound in an oil, so as to form a suspension of catalyst powder and antistatic compound in said oil; b) successively adding, under mixing conditions, a molten thickening agent to said suspension from step a), while maintaining said suspension at a temperature such that said thickening agent solidifies on contact with said suspension; c) transferring the product obtained from b) to a polymerization reactor.

Abstract: Extruded articles, particularly films, comprising an ethylene polymer obtained by a polymerization process carried out in the presence the products obtained by contacting the following components: (a) a solid catalyst component comprising a magnesium halide, a titanium compound having at least a Ti-halogen bond and optionally one or more internal electron donor compounds, (b) an aluminum hydrocarbyl compound, (c) optionally an external electron donor compound, and (d) a polyalcohol partially esterified with carboxylic acids with alkyl groups having at least 10 carbon atoms.

Abstract: A print server may include an anonymous printer registration module configured to receive, at a cloud print service, a registration request from a printer over a network and return a registration response to the printer over the network. The anonymous printer registration module may include a claim code provider configured to provide a claim code included within the registration response to the printer over the network, wherein the printer is configured to provide the claim code to a user of the printer, and a printer matcher configured to receive the claim code from the user over the network and match a user account of the user within the cloud print service with the printer, in response to the receipt of the claim code from the user.

Abstract: A method for moving a reel of packaging material from a storage station to a supply station of a packaging unit involves clamping a peripheral edge of reel by using a pair of clamping elements of a clamping unit, rotating clamping elements relative to the reel, and supporting the reel on the pair of clamping elements by interacting with a portion of reel radially inner with respect to circumferential edge.

Abstract: A printer may include a registration requester configured to receive an initiation request from a user to initiate a registration of the printer, and further configured to send a registration request to a cloud print service over a network. The printer may include a claim facilitator configured to receive a registration response from the cloud print service over the network, the registration response including a claim code, and further configured to provide, using printer functionality, the claim code to the user. The printer also may include an authentication manager configured to request an authentication credential issued by the cloud print service in response to a matching of the printer with a user account of the user within the cloud print service, the matching based on a receipt of the claim code from the user at the cloud print service, and further configured to receive and store the authentication credential at the printer.

Abstract: To manufacture a layer of semiconductor material, a first wafer of semiconductor material is subjected to implantation to form a defect layer at a distance from a first face; the first wafer is bonded to a second wafer, by putting an insulating layer present on the second wafer in contact with the first face of the first wafer. Then, hydrogen atoms are introduced into the first wafer through a second face at an energy such as to avoid defects to be generated in the first wafer and at a temperature lower than 600° C. Thereby, the first wafer splits into a usable layer, bonded to the second wafer, and a remaining layer disposed between the defect layer and the second face of the first wafer. Prior to bonding, the first wafer is subjected to processing steps for obtaining integrated components.

Abstract: A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.

Abstract: Crystalline polymers and copolymers of propylene having total MIL values>2 g/10 minutes, total [?] values in tetrahydronaphthalene at 135° C.?2.8 dl/g, mW/MN values>20, a fraction insoluble in xylene at 25° C.?94, and including from 10 to 60% by weight of a fraction (A) having [?]?2.6, are prepared by way of sequential polymerization in at least two stages, in the presence of a particular Ziegler-Natta catalysts supported on magnesium halides. These polymers have high melt strength, high mechanical properties, and are particularly adequate for the manufacture of articles by using various conversion technologies, such as for example extrusion in thin sheets to be subjected to thermoforming, as well as for injection molding, and blow molding.

Abstract: A multistage process comprising the step of polymerizing propylene in the presence of a catalysts system, comprising one or more metallocene compound of formula (I): wherein M is an atom of a transition metal; p is an integer from 0 to 3, X, same or different, is a hydrogen atom, a halogen atom, or a hydrocarbon group; L is a divalent bridging R1 and R2, are C1-C20-alkyl radicals; T, equal to or different from each other, is a moiety of formula (IIb) or (IIa): wherein R3, R4, R5, R6, R7, R3?, R4?, R5?, R6?, R7?, are hydrogen atoms or hydrocarbon groups; with the proviso that at least one among R3, R4, R5, R6, R7 is different from hydrogen; R11 is a hydrogen atom or a hydrocarbon group; R8, R9 and R10, are hydrogen atoms or hydrocarbon groups; and further comprising the step of contacting, under polymerization conditions, in a gas phase, ethylene and one or more comonomers.

Abstract: A multistage process for obtaining an heterophasic propylene polymer comprising the following steps: step a) contacting under polymerization conditions propylene and optionally ethylene or one or more alpha olefins in the presence of a catalysts system, supported on a porous organic polymer, comprising: ii) one or more metallocene compounds of formula (I) wherein: M is an atom of a transition metal; p is an integer from 0 to 3; X, same or different, is a hydrogen atom, a halogen atom, or a hydrocarbon group; L is a divalent bridging group; R1, is a linear or branched, saturated or unsaturated C1-C20-alkyl radical; R2 is a branched C1-C20alkyl radical; T, equal to or different from each other, is a moiety of formula (IIIa) or (IIIb): wherein: the atom marked with the symbol * bonds the atom marked with the same symbol in the compound of formula (I); R5-R13, equal to or different from each other, are hydrogen atoms or hydrocarbon groups; ii) an alumoxane or a compound capable of forming an alkyl m

Abstract: A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.

Abstract: To manufacture a layer of semiconductor material, a first wafer of semiconductor material is subjected to implantation to form a defect layer at a distance from a first face; the first wafer is bonded to a second wafer, by putting an insulating layer present on the second wafer in contact with the first face of the first wafer. Then, hydrogen atoms are introduced into the first wafer through a second face at an energy such as to avoid defects to be generated in the first wafer and at a temperature lower than 600° C. Thereby, the first wafer splits into a usable layer, bonded to the second wafer, and a remaining layer disposed between the defect layer and the second face of the first wafer. Prior to bonding, the first wafer is subjected to processing steps for obtaining integrated components.

Abstract: A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.

Abstract: The process for manufacturing a through insulated interconnection is performed by forming, in a body of semiconductor material, a trench extending from the front (of the body for a thickness portion thereof; filling the trench with dielectric material; thinning the body starting from the rear until the trench, so as to form an insulated region surrounded by dielectric material; and forming a conductive region extending inside said insulated region between the front and the rear of the body and having a higher conductivity than the first body. The conductive region includes a metal region extending in an opening formed inside the insulated region or of a heavily doped semiconductor region, made prior to filling of the trench.

Abstract: A micromachined device made of semiconductor material is formed by: a semiconductor body; an intermediate layer set on top of the semiconductor body; and a substrate, set on top of the intermediate layer. A cavity extends in the intermediate layer and is delimited laterally by bottom fixed regions, at the top by the substrate, and at the bottom by the semiconductor body. The bottom fixed regions form fixed electrodes, which extend in the intermediate layer towards the inside of the cavity. An oscillating element is formed in the substrate above the cavity and is separated from top fixed regions through trenches, which extend throughout the thickness of the substrate. The oscillating element is formed by an oscillating platform set above the cavity, and by mobile electrodes, which extend towards the top fixed regions in a staggered way with respect to the fixed electrodes. The fixed electrodes and mobile electrodes are thus comb-fingered in plan view but formed on different levels.

Abstract: Crystalline polymers and copolymers of propylene having total MIL values>2 g/10 minutes, total [?] values in tetrahydronaphthalene at 135° C.?2.8 dl/g, Mw/Mn values>20, a fraction insoluble in xylene at 25° C.?94, and including from 10 to 60% by weight of a fraction (A) having [?]?2.6, are prepared by way of sequential polymerization in at least two stages, in the presence of a particular Ziegler-Natta catalysts supported on magnesium halides. These polymers have high melt strength, high mechanical properties, and are particularly adequate for the manufacture of articles by using various conversion technologies, such as for example extrusion in thin sheets to be subjected to thermoforming, as well as for injection molding, and blow molding.

Abstract: Crystalline polymers and copolymers of propylene having total MIL values>2 g/10 minutes, total [?] values in tetrahydronaphthalene at 135° C.?2/8 dl/g, Mw/Mn values>20, a fraction insoluble in xylene at 25° C.?94, and including from 10 to 60% by weight of a fraction (A) having [?]?2.6, are prepared by way of sequential polymerization in at least two stages, in the presence of particular Ziegler-Natta catalysts supported on magnesium halides. These polymers have high melt strength, high mechanical properties, and are particularly adequate for the manufacture of articles by using various conversion technologies, such as for example extrusion in thin sheets to be subjected to thermoforming, as well as for injection molding, and blow molding.

Abstract: A micromachined device made of semiconductor material is formed by: a semiconductor body; an intermediate layer set on top of the semiconductor body; and a substrate, set on top of the intermediate layer. A cavity extends in the intermediate layer and is delimited laterally by bottom fixed regions, at the top by the substrate, and at the bottom by the semiconductor body. The bottom fixed regions form fixed electrodes, which extend in the intermediate layer towards the inside of the cavity. An oscillating element is formed in the substrate above the cavity and is separated from top fixed regions through trenches, which extend throughout the thickness of the substrate. The oscillating element is formed by an oscillating platform set above the cavity, and by mobile electrodes, which extend towards the top fixed regions in a staggered way with respect to the fixed electrodes. The fixed electrodes and mobile electrodes are thus comb-fingered in plan view but formed on different levels.

Abstract: A movable mass forming a seismic mass is formed starting from an epitaxial layer and is covered by a weighting region of tungsten which has high density. To manufacture the mass, buried conductive regions are formed in the substrate. Then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions are formed on the buried conductive regions so as to partially cover them. An epitaxial layer is then grown, using a nucleus region. A tungsten layer is deposited and defined and, using a silicon carbide layer as mask, the suspended structure is defined. Finally, the sacrificial region is removed, forming an air gap.

Abstract: A movable mass forming a seismic mass is formed starting from an epitaxial layer and is covered by a weighting region of tungsten which has high density. To manufacture the mass, buried conductive regions are formed in the substrate. Then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions are formed on the buried conductive regions so as to partially cover them. An epitaxial layer is then grown, using a nucleus region. A tungsten layer is deposited and defined and, using a silicon carbide layer as mask, the suspended structure is defined. Finally, the sacrificial region is removed, forming an air gap.