Abstract: Disclosed is an optical module for a lens, especially a microlithographic apparatus, comprising a first holding device (2) with an inner circumference (2.1) that extends in a first circumferential direction (2.2), and at least one first supporting device (3.1) which is fastened to the inner circumference (2.1) of said first holding device (2) and is used for supporting a first optical element (5.1), an annular circumferential first assembly space (3.18) being defined by displacing the first supporting device (3.1) once in a revolving manner along the first circumferential direction (2.2). At least one second supporting device (3.2) which is fixed to the inner circumference (2.1) of the first holding device (2) is provided for supporting a second optical element (5.2), an annular circumferential second assembly space (3.28) being defined by displacing the second supporting device (3.2) once in a revolving manner along the first circumferential direction (2.2). The first assembly space (3.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: A semiconductor lithography projection exposure apparatus includes a projection lens which includes a manipulator. The manipulator includes an optical element; a base frame; a sensor frame arranged on the base frame; and a sensor arranged on the sensor frame. The manipulator is configured to correct wavefront aberrations of used optical radiation that pass through the optical element during the operation of the projection lens. The manipulator is arranged directly after an object plane of the apparatus along a path of the used optical radiation. The sensor is configured to measure a deformation or a deflection of the optical element. A coefficient of thermal expansion of the sensor frame is within 16 ppm/K of a coefficient of thermal expansion of the base frame.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: A vibration-compensated optical system for a lithography apparatus includes an optical element, a carrying element, an actuator for actuating the optical element relative to the carrying element, a first elastic element which directly couples the optical element to the carrying element, a reaction mass, and a second elastic element. The actuator couples the optical element to the reaction mass. The second elastic element directly couples the reaction mass to the carrying element. For a mass (m1) of the optical element, a stiffness (k1) of the first elastic element, a mass (m2) of the reaction mass and a stiffness (k2) of the second elastic element the following holds true: m 1 m 2 = k 1 k 2 .

Abstract: An optical apparatus includes an interchange mechanism and an optical assembly of an illumination system or a projection objective. At least one of the plurality of optical elements of the optical assembly is selected from among a plurality of ones selectable from the interchange mechanism which facilitates exchange of one for another in the beam path. To reduce transmission of vibration from the interchange mechanism to the optical assembly, the interchange mechanism is mounted on a structure which is substantially dynamically decoupled from the housing, and a selected selectable optical element is located at an operating position at which it is separate from the interchange mechanism.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: An optical imaging arrangement includes an optical element and a piezoelectric device. The optical element includes an optical element body carrying an optical surface on a front side of the optical element body. The piezoelectric device includes a first electrode and at least one piezoelectric element. The first electrode is configured to cooperate with the at least one piezoelectric element and at least one second electrode, when the at least one second electrode is located on a rear side of the optical element body and the at least one piezoelectric element is located between the first electrode and the at least one second electrode, the rear side of the optical element body being opposite to the front side of the optical element body. The first electrode is located on the front side of the optical element body, and the at least one piezoelectric element is formed by at least one piezoelectric section of the optical element body.

Abstract: An optical module is configured to be used in a microlithography objective. The optical module includes a first holding device with a circumference extending in a first circumferential direction and a first supporting device configured to support a first optical element. The first supporting device is fixed at the circumference of the first holding device. The optical module also includes a plurality of second supporting devices configured to support a second optical element, the second supporting devices being fixed at the circumference of the first holding device. The first supporting device does not contact the second supporting devices. The first optical element is separate from the second optical element. Along the first circumferential direction, the first supporting device is located in a non-equidistant manner between two neighboring second supporting devices.

Abstract: An optical imaging arrangement includes an optical projection system and a support structure system. The optical projection system includes a group of optical elements configured to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask onto a substrate. The support structure system includes an optical element support structure and a metrology support structure. The optical element support structure supports the group of optical elements, while the metrology support structure supports a group of metrology devices associated with the group of optical elements and configured to capture status information representative of at least one of a position and an orientation of each of the optical elements in at least one degree of freedom up to all six degrees of freedom.

Abstract: The disclosure pertains to an optical apparatus, in particular for microlithography, that includes an optical module, a support structure and a connection apparatus. The connection apparatus includes at least one connection unit which includes a first connector part and a second connector part. The first connector part is connected to the optical module, and the second connector part is connected to the support structure.

Abstract: An optical apparatus includes an interchange mechanism and an optical assembly of an illumination system or a projection objective. At least one of the plurality of optical elements of the optical assembly is selected from among a plurality of ones selectable from the interchange mechanism which facilitates exchange of one for another in the beam path. To reduce transmission of vibration from the interchange mechanism to the optical assembly, the interchange mechanism is mounted on a structure which is substantially dynamically decoupled from the housing, and a selected selectable optical element is located at an operating position at which it is separate from the interchange mechanism.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: Optical modules used in exposure processes, in particular to optical modules of microlithography systems, are disclosed. Methods for deforming an optical element of an optical module as well as to optical imaging arrangements, optical imaging of methods and a method of manufacturing an optical element, are also disclosed. The disclosed technology may be used in the context of photolithography processes for fabricating microelectronic devices, in particular semiconductor devices, or in the context of fabricating devices, such as masks or reticles, used during such photolithography processes.

Abstract: A method for controlling a vibrating optical element of a lithographic system the optical element having a predetermined number of degrees of freedom comprises: detecting a number of displacements of the optical element, each displacement corresponding to a degree of freedom, wherein the number of detected displacements is larger than the number of degrees of freedom; for each displacement according to a degree of freedom, generating a sensor signal corresponding to a movement in a degree of freedom; wherein the optical element moves as a function of a rigid body transformation matrix, the optical element movement including a first type of movement and a second type of movement; and modifying the sensor signals as a function of a modified transformation matrix, wherein the modified transformation matrix at least partially reduces at least one eigen mode or resonance of one of the first type of movements or the second type of movements.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: The disclosure pertains to an optical apparatus, in particular for microlithography, that includes an optical module, a support structure and a connection apparatus. The connection apparatus includes at least one connection unit which includes a first connector part and a second connector part. The first connector part is connected to the optical module, and the second connector part is connected to the support structure.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: The invention relates to a lens comprising several optical elements that are disposed in a lens housing. At least one sensor array encompassing at least one capacitive sensor unit and/or at least one inductive sensor unit is provided for determining the relative position between a first optical element and a second optical element or between a load-bearing structural element of the lens and a second optical element.