Abstract: Lithography apparatus and device manufacturing methods are disclosed in which means are provided for reducing the extent to which vibrations propagate between a first element of a projection system and a second element of a projection system. Approaches disclosed include the use of plural resilient members in series as part of a vibration isolation system, plural isolation frames for separately supporting first and second projection system frames, and modified connection positions for the interaction between the first and second projection system frames and the isolation frame(s).

Abstract: A semiconductor lithography projection exposure apparatus includes a projection lens which includes a manipulator. The manipulator includes an optical element; a base frame; a sensor frame arranged on the base frame; and a sensor arranged on the sensor frame. The manipulator is configured to correct wavefront aberrations of used optical radiation that pass through the optical element during the operation of the projection lens. The manipulator is arranged directly after an object plane of the apparatus along a path of the used optical radiation. The sensor is configured to measure a deformation or a deflection of the optical element. A coefficient of thermal expansion of the sensor frame is within 16 ppm/K of a coefficient of thermal expansion of the base frame.

Abstract: The invention relates to a lens comprising several optical elements that are disposed in a lens housing. At least one sensor array encompassing at least one capacitive sensor unit and/or at least one inductive sensor unit is provided for determining the relative position between a first optical element and a second optical element or between a load-bearing structural element of the lens and a second optical element.

Abstract: Optical modules used in exposure processes, in particular to optical modules of microlithography systems, are disclosed. Methods for deforming an optical element of an optical module as well as to optical imaging arrangements, optical imaging of methods and a method of manufacturing an optical element, are also disclosed. The disclosed technology may be used in the context of photolithography processes for fabricating microelectronic devices, in particular semiconductor devices, or in the context of fabricating devices, such as masks or reticles, used during such photolithography processes.

Abstract: A microlithographic projection exposure apparatus has a mirror array having a base body and a plurality of mirror units. Each mirror unit includes a mirror and a solid-state articulation, which has at least one articulation part that connects the mirror to the base body. A control device makes it possible to modify the alignment of the respective mirror relative to the base body. Mutually opposing surfaces of the mirror and of the base body, or of a mirror support body connected to it, are designed as corresponding glide surfaces of a sliding bearing.

Abstract: A vibration-compensated optical system for a lithography apparatus includes an optical element, a carrying element, an actuator for actuating the optical element relative to the carrying element, a first elastic element which directly couples the optical element to the carrying element, a reaction mass, and a second elastic element. The actuator couples the optical element to the reaction mass. The second elastic element directly couples the reaction mass to the carrying element. For a mass (m1) of the optical element, a stiffness (k1) of the first elastic element, a mass (m2) of the reaction mass and a stiffness (k2) of the second elastic element the following holds true: m 1 m 2 = k 1 k 2 .

Abstract: An optical imaging arrangement includes an optical projection unit and a control device. The optical projection unit includes a support structure and a group of optical element units adapted to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask unit onto a substrate of a substrate unit. The group of optical element units includes a first optical element unit and a plurality of second optical element units, the first optical element unit and the second optical element units, under a control by the control device, being actively supported by the support structure.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: An optical arrangement includes at least one optical element and a support element for the optical element. The optical element and the support element are connected together by way of at least three decoupling elements. The decoupling elements are formed monolithically with the optical element and with the support element.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: An optical system for semiconductor lithography including a plurality of optical components, as well as related components and methods, are disclosed. The apparatus can include an optical component that can be moved by a distance along a straight line within a time of between 5 ms and 500 ms. The straight line can have a polar and azimuth angle of between 0° and 90°, and a distance between the straight line and an optical axis of the apparatus being less than a cross-sectional dimension of a projection exposure beam bundle of the projection exposure apparatus. The apparatus can also include a guide unit configured to guide the optical component.

Abstract: A reflective optical element includes a body with a first reflective surface of a high precision geometrical form, which can be used for reflecting light in a wavelength range less than 50 nm in an EUV-lithographic projection exposure system. The body includes first and a second non-reflecting surfaces. Further, the body includes a single connection area formed on the first non-reflecting surface with at least one fixation surface inside the connection area for fixing the entire optical element directly or indirectly to at least one bearing surface of a bearing element. The second non-reflecting surface is different from the single connection area formed on the first non-reflective surface. The second non-reflecting surface at least partly surrounds the single connection area. At least one stress relief recess is formed into the body. The stress relief recess at least partly separates the first non-reflective surface from the second non-reflecting surface.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: An optical arrangement has a plurality of optical elements capable of transmitting a beam. A partial housing is provided which extends from a surface of an optical element in the direction of the beam emanating from the optical element, or of the beam incident on the optical element, and whose shape is adapted to the shape of the beam. The partial housing is surrounded at least partially by a measurement structure which is mechanically decoupled therefrom. The measurement structure has at least one sensor.

Abstract: An optical arrangement includes a multiplicity of optical elements and a carrier structure which carries the optical elements. The carrier structure is composed of at least two releasably interconnected modules. Each module is composed of at least one carrier structure subelement. A subhousing is produced by a multiplicity of carrier structure subelements and/or modules. The subhousing has a geometry that varies, at least in regions, in correspondence to a usable beam path in the projection exposure apparatus, the usable beam path being defined as an envelope of all light bundles which can propagate from all field points in a field plane to an image plane of the projection exposure apparatus. A projection exposure apparatus for EUV lithography includes such an optical arrangement.

Abstract: The invention relates to a lens comprising several optical elements that are disposed in a lens housing. At least one sensor array encompassing at least one capacitive sensor unit and/or at least one inductive sensor unit is provided for determining the relative position between a first optical element and a second optical element or between a load-bearing structural element of the lens and a second optical element.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: Lithography apparatus and device manufacturing methods are disclosed in which means are provided for reducing the extent to which vibrations propagate between a first element of a projection system and a second element of a projection system. Approaches disclosed include the use of plural resilient members in series as part of a vibration isolation system, plural isolation frames for separately supporting first and second projection system frames, and modified connection positions for the interaction between the first and second projection system frames and the isolation frame(s).

Abstract: A pouch for enclosing a case containing a collectible item is provided, in which the case contains a label along an edge of the case. The pouch includes a window formed on the pouch and positioned such that the label is visible through the window when the case is enclosed within the pouch. A plurality of pouches containing cases may be stored adjacent one another, with the labels being visible through the windows.