Abstract: An optical imaging arrangement includes an optical projection unit and a control device. The optical projection unit includes a support structure and a group of optical element units adapted to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask unit onto a substrate of a substrate unit. The group of optical element units includes a first optical element unit and a plurality of second optical element units, the first optical element unit and the second optical element units, under a control by the control device, being actively supported by the support structure.

Abstract: The invention relates to a lens comprising several optical elements that are disposed in a lens housing. At least one sensor array encompassing at least one capacitive sensor unit and/or at least one inductive sensor unit is provided for determining the relative position between a first optical element and a second optical element or between a load-bearing structural element of the lens and a second optical element.

Abstract: There is provided an optical module for an objective. The optical module includes (a) a first holding device with an inner circumference, which extends in a first circumferential direction, (b) at least one first supporting device for supporting a first optical element and being fixed at said inner circumference of said first holding device, (c) an annular circumferential first assembly space being defined by displacing said first supporting device once in a revolving manner along said first circumferential direction, (d) at least one second supporting device being provided for supporting a second optical element and being fixed at said inner circumference of said first holding device, and (e) an annular circumferential second assembly space being defined by displacing said second supporting device once in a revolving manner along said first circumferential direction. The first assembly space intersects the second assembly space.

Abstract: In some embodiments, the disclosure provides a system that includes an optical element group including a plurality of optical elements configured to project a pattern of an object in an object plane to an image plane. The system also includes a unit configured to detect an image selected from an image of at least part of the projection the pattern of the object, and an image of a measurement element arranged in the area of the object. The image is created via at least some of the optical elements in the optical element group. The unit is configured to determine an imaging error in the projection of the pattern of the object from the object plane to the image plane. The device is configured to be used in microlithography.

Abstract: An optical assembly supported in an arrangement, especially in an objective or in an illuminating or exposure system, in the interior of a housing comprising at least one optical element, especially a lens, a mirror, or an aperture, wherein the at least one element is influenceable by at least one manipulator is characterized in that the at least one manipulator is arranged either outside of the housing or in a holding means that is separated entirely or to a large extent by the help of a decoupling means, and that there is provided an effective coupling between the manipulator and the element to be influenced by the manipulator in the interior of the arrangement.

Abstract: There is provided an optical imaging arrangement comprising: a mask unit comprising a pattern, a substrate unit comprising a substrate, an optical projection unit comprising a group of optical element units, the optical projection unit being adapted to transfer an image of the pattern onto the substrate, a first imaging arrangement component, the first imaging arrangement component being a component of one of the optical element units, a second imaging arrangement component, the second imaging arrangement component being different from the first imaging arrangement component and being a component of one of the mask unit, the optical projection unit and the substrate unit, and a metrology arrangement. The metrology arrangement captures a spatial relationship between the first imaging arrangement component and the second imaging arrangement component. The metrology arrangement comprises a reference element, the reference element being mechanically connected directly to the first imaging arrangement component.

Abstract: Semiconductor lithography system includes a plurality of optical components, including an optical component movable a distance along a straight line within a time of between 5 ms and 500 ms. The straight line can have a polar and azimuth angle of between 0° and 90°, and a distance between the straight line and an optical axis of the apparatus being less than a cross-sectional dimension of a projection exposure beam bundle of the projection exposure apparatus. The apparatus can also include a guide unit configured to guide the optical component. The apparatus can further include a drive unit configured to drive the optical component via drive forces so that torques generated by inertial forces of the optical component and of optional components concomitantly moved with the optical component, and the torques generated by the drive forces, which act on the guide unit, compensate for one another to less than 10%.

Abstract: An illumination system of a microlithographic projection exposure apparatus has a pupil surface and an essentially flat arrangement of desirably individually drivable beam deviating elements for variable illumination of the pupil surface. Each beam deviating element allows deviation of a projection light beam incident on it to be achieved as a function of a control signal applied to the beam deviating element. A measurement illumination instrument directs a measurement light beam, independent of the projection light beams, onto a beam deviating element. A detector instrument records the measurement light beam after deviation by the beam deviating element. An evaluation unit determines the deviation of the projection light beam from measurement signals provided by the detector instrument.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: The disclosure relates to arrangements and methods for vibration isolation of a payload from a body. An arrangement for vibration isolation of a payload from a body having vibrations includes a sensor for measuring vibrations, and an actuator for generating a compensation force on the payload, at least on the basis of the measurement of the sensor. At least one balancing mass is arranged in the reaction path of a reaction force associated with the compensation force, and the sensor is mounted on the body.

Abstract: An optical system for semiconductor lithography including a plurality of optical components, as well as related components and methods, are disclosed. The apparatus can include an optical component that can be moved by a distance along a straight line within a time of between 5 ms and 500 ms. The straight line can have a polar and azimuth angle of between 0° and 90°, and a distance between the straight line and an optical axis of the apparatus being less than a cross-sectional dimension of a projection exposure beam bundle of the projection exposure apparatus. The apparatus can also include a guide unit configured to guide the optical component.

Abstract: An optical apparatus includes an interchange mechanism and an optical assembly of an illumination system or a projection objective. At least one of the plurality of optical elements of the optical assembly is selected from among a plurality of ones selectable from the interchange mechanism which facilitates exchange of one for another in the beam path. To reduce transmission of vibration from the interchange mechanism to the optical assembly, the interchange mechanism is mounted on a structure which is substantially dynamically decoupled from the housing, and a selected selectable optical element is located at an operating position at which it is separate from the interchange mechanism.

Abstract: An optical arrangement includes a multiplicity of optical elements and a carrier structure which carries the optical elements. The carrier structure is composed of at least two releasably interconnected modules. Each module is composed of at least one carrier structure subelement. A subhousing is produced by a multiplicity of carrier structure subelements and/or modules. The subhousing has a geometry that varies, at least in regions, in correspondence to a usable beam path in the projection exposure apparatus, the usable beam path being defined as an envelope of all light bundles which can propagate from all field points in a field plane to an image plane of the projection exposure apparatus. A projection exposure apparatus for EUV lithography includes such an optical arrangement.

Abstract: An optical arrangement includes at least one optical element and a support element for the optical element. The optical element and the support element are connected together by way of at least three decoupling elements. The decoupling elements are formed monolithically with the optical element and with the support element.

Abstract: Lithography apparatus and device manufacturing methods are disclosed in which means are provided for reducing the extent to which vibrations propagate between a first element of a projection system and a second element of a projection system. Approaches disclosed include the use of plural resilient members in series as part of a vibration isolation system, plural isolation frames for separately supporting first and second projection system frames, and modified connection positions for the interaction between the first and second projection system frames and the isolation frame(s).

Abstract: A reflective optical element includes a body with a first reflective surface of a high precision geometrical form, which can be used for reflecting light in a wavelength range less than 50 nm in an EUV-lithographic projection exposure system. The body includes first and a second non-reflecting surfaces. Further, the body includes a single connection area formed on the first non-reflecting surface with at least one fixation surface inside the connection area for fixing the entire optical element directly or indirectly to at least one bearing surface of a bearing element. The second non-reflecting surface is different from the single connection area formed on the first non-reflective surface. The second non-reflecting surface at least partly surrounds the single connection area. At least one stress relief recess is formed into the body. The stress relief recess at least partly separates the first non-reflective surface from the second non-reflecting surface.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: An optical apparatus includes an interchange mechanism and an optical assembly of an illumination system or a projection objective. At least one of the plurality of optical elements of the optical assembly is selected from among a plurality of ones selectable from the interchange mechanism which facilitates exchange of one for another in the beam path. To reduce transmission of vibration from the interchange mechanism to the optical assembly, the interchange mechanism is mounted on a structure which is substantially dynamically decoupled from the housing, and a selected selectable optical element is located at an operating position at which it is separate from the interchange mechanism.

Abstract: A method for calibrating a position measuring device of an optical device, including a measurement step in which a movable unit of the optical device is moved according to a predefinable scheme in at least one degree of freedom and a position of the movable unit is determined in the at least one degree of freedom. The position of the movable unit is determined in the at least one degree of freedom in a first measurement via a first measuring device of the position measuring device, and the position of the movable unit is determined in the at least one degree of freedom in a second measurement via a second measuring device of the position measuring device sing a reference element connected to the movable unit. In a calibration step, the first measuring device is calibrated using the results of the first measurement and the second measurement. An encoder system is used as the second measuring device. The reference element includes a reference grid of the encoder system.