Abstract: A memory circuit includes multiple word lines, multiple pairs of complementary bank bit lines, multiple block select lines, and multiple of block circuits. Each of the block circuits includes a local bit line; a first transistor having a control terminal connected to the local bit line, a first bias terminal connected to a first bank bit line of a given pair of bank bit lines, and a second bias terminal connecting to a first voltage source; a second transistor having a control terminal connected to a corresponding one of the block select lines, a first bias terminal connected to a second bank bit line of the given pair of bank bit lines, and a second bias terminal connected to the local bit line; and a plurality of memory cells connected to the local bit line and to respective word lines in the memory circuit.

Abstract: A trench capacitor and related methods are disclosed including a trench having lateral extensions extending in only one direction from the trench filled with a capacitor material. In one embodiment, the trench capacitor includes a trench within a substrate, and at least one lateral extension extending from the trench in only one direction, wherein the trench and each lateral extension are filled with a capacitor material. The lateral extensions increase surface area for the trench capacitor, but do not take up as much space as conventional structures.

Abstract: A memory circuit includes multiple word lines, multiple pairs of complementary bank bit lines, multiple block select lines, and multiple of block circuits. Each of the block circuits includes a local bit line; a first transistor having a control terminal connected to the local bit line, a first bias terminal connected to a first bank bit line of a given pair of bank bit lines, and a second bias terminal connecting to a first voltage source; a second transistor having a control terminal connected to a corresponding one of the block select lines, a first bias terminal connected to a second bank bit line of the given pair of bank bit lines, and a second bias terminal connected to the local bit line; and a plurality of memory cells connected to the local bit line and to respective word lines in the memory circuit.

Abstract: A novel trench-type decoupling capacitor structure and low-cost manufacturing process to create trench decoupling capacitors (decaps). In a unique aspect, the invention necessitates the addition of only a simplified trench to a base logic design.

Abstract: Disclosed is a flexible command multiplication scheme for the built-in-self test (BIST) of a high-speed embedded memory array that segments BIST functionality into remote lower-speed executable instructions and local higher-speed executable instructions. A stand-alone BIST logic controller operates at a lower frequency and communicates with a command multiplier using a low-speed BIST instruction seed set. The command multiplier uses offset or directive registers to drive a logic unit or ALU to generate “n” sets of CAD information which are then time-multiplexed to the embedded memory at a speed “n” times faster than the BIST operating speed.

Abstract: The present invention provides collarless trench semiconductor memory devices having minimized vertical parasitic FET leakage and methods of forming the same.

Abstract: An integrated circuit system having a plurality of macros is provided. The integrated circuit system includes an external voltage supply input configured for supplying an external voltage to the integrated circuit; and a plurality of internal voltage supply generators, each of the plurality of internal voltage supply generators being connected to a respective macro of the plurality of macros and configured for receiving the external voltage via the external voltage supply input for generating an internal voltage supply for operating its respective macro. Each of the plurality of internal voltage supply generators includes circuitry for generating the internal voltage supply and circuitry for disconnecting at least a portion of its respective macro. The integrated circuit system can be applied to a semiconductor chip to save active or stand-by power. It can also be used to disconnect a defective portion of the chip and optionally replace it with a non-defective portion of the chip.

Abstract: A memory system includes a memory array, a plurality of wordline drivers, a row address decoder block which has a plurality of outputs connected to selected ones of the wordline drivers, a row selector block which has a selector lines connected to individual ones of the wordline drivers. A power management circuit having a power down input for a power down input signal (WLPWRDN) and a wordline power down output (WLPDN) is connected to the wordline drivers to lower the power consumption thereof as a function of the power down input signal.

Abstract: A memory system includes a memory array, a plurality of wordline drivers, a row address decoder block which has a plurality of outputs connected to selected ones of the wordline drivers, a row selector block which has a selector lines connected to individual ones of the wordline drivers. A power management circuit having a power down input for a power down input signal (WLPWRDN) and a wordline power down output (WLPDN) is connected to the wordline drivers to lower the power consumption thereof as a function of the power down input signal.

Abstract: A concurrent refresh mode is realized by allowing a memory array to be refreshed by way of a refresh bank select signal, while concurrently enabling a memory access operation in another array. The refresh address management is greatly simplified by the insertion of row address counter integrated within each array. In the preferred embodiment, any combination of a plurality of the memory arrays is refreshed simultaneously while enabling a memory access operation. This concurrent mode also supports a multi-bank operation.

Abstract: A memory system includes a memory array, a plurality of wordline drivers, a row address decoder block which has a plurality of outputs connected to selected ones of the wordline drivers, a row selector block which has a selector lines connected to individual ones of the wordline drivers. A power management circuit having a power down input for a power down input signal (WLPWRDN) and a wordline power down output (WLPDN) is connected to the wordline drivers to lower the power consumption thereof as a function of the power down input signal.

Abstract: A method and structure for an array of content addressable memory (CAM) cells is disclosed. Each of the CAM cells has a search line and a bitline parallel to the search line. Across the array, search lines and bit lines of the CAM cells are interdigitated so that the search lines and bitlines alternate across the array. CAM cell macro's are inverted with respect to adjacent macros to balance parasitic capacitances across the array.

Abstract: A method and structure for an array of content addressable memory (CAM) cells is disclosed. Each of the CAM cells has a search line and a bitline parallel to the search line. Across the array, search lines and bit lines of the CAM cells are interdigitated so that the search lines and bitlines alternate across the array. CAM cell macro's are inverted with respect to adjacent macros to balance parasitic capacitances across the array.

Abstract: An integrated circuit system having a plurality of macros is provided. The integrated circuit system includes an external voltage supply input configured for supplying an external voltage to the integrated circuit; and a plurality of internal voltage supply generators, each of the plurality of internal voltage supply generators being connected to a respective macro of the plurality of macros and configured for receiving the external voltage via the external voltage supply input for generating an internal voltage supply for operating its respective macro. Each of the plurality of internal voltage supply generators includes circuitry for generating the internal voltage supply and circuitry for disconnecting at least a portion of its respective macro. The integrated circuit system can be applied to a semiconductor chip to save active or stand-by power. It can also be used to disconnect a defective portion of the chip and optionally replace it with a non-defective portion of the chip.

Abstract: A method of manufacturing a semiconductor trench device comprises forming a dielectric on a substrate, the dielectric having an underlying oxide layer adjacent the substrate, etching a trench in the dielectric and the substrate, forming a recess in the underlying oxide layer, filling the recess with a nitride plug, filling the trench a conductive material and oxidizing the dielectric and the conductive material, wherein the nitride plug controls a shape of a corner of the trench.

Abstract: A method for forming a thermally stable ohmic contact structure that includes a region of monocrystalline semiconductor and a region of polycrystalline semiconductor. At least one region of dielectric material is formed between at least a portion of the region of monocrystalline semiconductor and the region of polycrystalline semiconductor, thereby controlling grain growth of the polycrystalline semiconductor.

Abstract: A method for forming a thermally stable ohmic contact structure that includes a region of monocrystalline semiconductor and a region of polycrystalline semiconductor. At least one region of dielectric material is formed between at least a portion of the region of monocrystalline semiconductor and the region of polycrystalline semiconductor, thereby controlling grain growth of the polycrystalline semiconductor.

Abstract: A semiconductor device manufacturing method for silicidizing silicon-containing areas in array regions of dynamic random access memory (DRAMS)and embedded DRAM (eDRAM) devices to lower electrical resistance, and improve device reliability at low temperatures.

Abstract: A DRAM semiconductor device wherein a substrate plate trench (SPT) memory cell is formed in an N−-type substrate, without an epitaxial layer in which the substrate is biased at circuit ground in order to ensure that the substrate surrounding the trench capacitors is biased into accumulation in order to avoid unacceptable loss of storage node capacitance which would be caused by allowing the substrate to go into depletion.

Abstract: A pair of transistors sharing a common electrodes e.g. a bitline in a DRAM array, has a self-aligned contact to the bitline in which the transistor gate stack has only a poly layer with a nitride cover; the aperture for the bitline contact is time-etched to penetrate only between the gates and not reach the silicon substrate; exposed nitride shoulders of the gate are etched to expose the poly; the remainder of the interlayer dielectric is removed by a selective etch; the exposed poly is re-oxidized to protect the gates; and the aperture bottom is cleaned; so that the thick gate stack of a DRAM is dispensed with in order to improve uniformity of line width across the chip beyond what the DRAM technique can deliver.