Computer mainframe front panel

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a top, front and right side perspective view of a computer mainframe front panel showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof.

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a top, front and right side perspective view thereof, shown with the fronts in an open position.

Claims

The ornamental design for a computer mainframe front panel, as shown and described.

Referenced Cited
U.S. Patent Documents
D349108 July 26, 1994 Chang et al.
D474186 May 6, 2003 Frank et al.
D476992 July 8, 2003 Chien et al.
Patent History
Patent number: D513752
Type: Grant
Filed: Jul 30, 2004
Date of Patent: Jan 24, 2006
Assignee: Thermaltake Technology Co., Ltd. (Taipei Hsien)
Inventor: Pei-Shi Lin (Taipei Hsien)
Primary Examiner: Freda S. Nunn
Attorney: Rosenberg, Klein & Lee
Application Number: 29/210,333
Classifications
Current U.S. Class: Including Surface Texture (D14/444)