Computer mainframe front panel
Latest Thermaltake Technology Co., Ltd. Patents:
Description
FIG. 1 is a top, front and right side perspective view of a computer mainframe front panel showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof.
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a top, front and left side perspective view thereof, shown with the fronts in an open position; and,
FIG. 9 is a top, front and right side perspective view thereof, shown with the fronts in an open position.
Claims
The ornamental design for a computer mainframe front panel, as shown and described.
Referenced Cited
Patent History
Patent number: D505426
Type: Grant
Filed: May 28, 2004
Date of Patent: May 24, 2005
Assignee: Thermaltake Technology Co., Ltd. (Taipei Hsien)
Inventor: Pei-Shi Lin (Taipei Hsien)
Primary Examiner: Freda S. Nunn
Attorney: Rosenberg, Klein & Lee
Application Number: 29/206,267
Type: Grant
Filed: May 28, 2004
Date of Patent: May 24, 2005
Assignee: Thermaltake Technology Co., Ltd. (Taipei Hsien)
Inventor: Pei-Shi Lin (Taipei Hsien)
Primary Examiner: Freda S. Nunn
Attorney: Rosenberg, Klein & Lee
Application Number: 29/206,267
Classifications
Current U.S. Class:
Door Or Panel (D14/441)