Abstract: Provided herein are recombinant antibodies, antigen-binding fragments thereof, and fusion proteins thereof useful for binding to and inhibiting B7-H4. Also provided are nucleic acid molecules encoding the antibodies, antigen-binding fragments thereof, and fusion proteins thereof disclosed herein and therapeutic compositions thereof. Disclosed are further methods of using the disclosed antibodies, antigen-binding fragments thereof, and fusion proteins thereof for the treatment of disease.

Abstract: A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.

Abstract: A battery charging station includes a power bus, a power supplying unit, a first voltage converting unit and a processor. The power supplying unit receives a first power to generate a second power accordingly and transmits the second power to the power bus as a supplying power of the power bus. The first voltage converting unit is coupled to the power bus and is connected to a first battery removably disposed in the battery station. The processor sets the first voltage converting unit to operate in a first mode or a second mode, the first voltage converting unit in the first mode receives the supplying power from the power bus so as to charge the first battery. The first voltage converting unit in the second mode receives the electrical power from the first battery and generates a second mode power towards the power bus.

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

Abstract: An image display method used by an image surveillance system is provided. The image surveillance system includes a plurality of cameras. The camera is configured to shoot a part of a physical environment to form a real-time image. The image display method has the following steps: First, a three-dimensional space model corresponding to the physical environment is established. Next, based on the height, the shooting angle and the focal length of the camera, a corresponding viewing frustum is established for each of the camera. According to the viewing frustum, a shooting coverage area of the camera in the physical environment is obtained. Next, a virtual coverage area corresponding to the shooting coverage area is searched out in the three-dimensional space model. Next, the real-time image is imported to a three-dimensional space model and projected to the virtual coverage area.

Abstract: A method for forming a semiconductor structure includes following operations. A first substrate including a first side, a second side opposite to the first side, and a metallic pad disposed over the first side is received. A dielectric structure including a first trench directly above the metallic pad is formed. A second trench is formed in the dielectric structure and a portion of the first substrate. A sacrificial layer is formed to fill the first trench and the second trench. A third trench is formed directly above the metallic pad. A barrier ring and a bonding structure are formed in the third trench. A bonding layer is disposed to bond the first substrate to a second substrate. A portion of the second side of the first substrate is removed to expose the sacrificial layer. The sacrificial layer is removed by an etchant.

Abstract: A method of manufacturing a circuit board is provided. The method includes forming an open substrate, in which the open substrate includes a substrate body having a top surface and a bottom surface; an opening in the substrate body, in which the opening has a first sidewall and a second sidewall opposite to the first sidewall; and at least one first fixing portion and at least one second fixing portion extending from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. A heat dissipation block is inserted in the opening to clamp the heat dissipation block between the first fixing portion and the second fixing portion, in which the heat dissipation block includes the heat dissipation block comprises a ceramic or a composite material.

Abstract: The present disclosure provides a method for forming a semiconductor structure. The method includes the following operations. A metal layer is formed. An adhesion-enhancing layer is formed over the metal layer. A dielectric stack is formed over the adhesion-enhancing layer. A trench is formed in the dielectric stack. A barrier layer is formed conforming to the sidewall of the trench. A high-k dielectric layer is formed conforming to the barrier layer. A sacrificial layer is formed conforming to the high-k dielectric layer.

Abstract: A transparent film heater is provided, including a transparent conductive film, at least two main electrodes and at least four multiple electrodes. The transparent conductive film is disposed on a transparent substrate. At least two main electrodes are arranged on two sides of the transparent conductive film along an edge of the transparent conductive film. The at least four multiple electrodes are composed of a first pair of multiple electrodes and a second pair of multiple electrodes, and are arranged on the transparent conductive film. A first spacing region and a second spacing region are respectively located between adjacent end points of the two main electrodes along the edge of the transparent conductive film. The first pair of multiple electrodes are arranged in the first spacing region, and the second pair of multiple electrodes are arranged in the second spacing region.

Abstract: The present disclosure provides a method for forming a semiconductor structure. The method includes the following operations. A metal layer is formed. An adhesion-enhancing layer is formed over the metal layer by a silicide operation. A dielectric stack is formed over the adhesion-enhancing layer. A trench is formed in the dielectric stack by removing a portion of dielectric stack aligning with the metal layer. A barrier layer is formed conforming to the sidewall of the trench. A high-k dielectric layer is formed conforming to the barrier layer. A contact is formed in the trench and be connected to the metal layer.

Abstract: A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion.

Abstract: Analyte collection and testing systems and methods, and more particularly to disposable oral fluid collection and testing systems and methods. Described herein are methods and apparatuses to achieve significant improvements in the detection of fluorescence signals in the reader.

Abstract: A package substrate includes a multilayer circuit structure, a gas-permeable structure, a heat conducting component, a first circuit layer, a second circuit layer and a build-up circuit structure. The gas-permeable structure and the heat conducting component are respectively disposed in a first and a second through holes of the multilayer circuit structure. The first and the second circuit layers are respectively disposed on an upper and a lower surfaces of the multilayer circuit structure and expose a first and a second sides of the gas-permeable structure. The build-up circuit structure is disposed on the first circuit layer and includes at least one patterned photo-imageable dielectric layer and at least one patterned circuit layer alternately stacked. The patterned circuit layer is electrically connected to the first circuit layer by at least one opening. The build-up circuit structure and the first circuit layer exposed by a receiving opening form a recess.

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

Abstract: Analyte collection and testing systems and methods, and more particularly to disposable oral fluid collection and testing systems and methods. Described herein are methods and apparatuses to achieve significant improvements in the detection of fluorescence signals in the reader.

Abstract: Analyte collection and testing systems and methods, and more particularly to testing systems and methods that achieve significant improvements in the detection of fluorescence signals in the reader by modulating the applied optical excitation. Also described herein are optical detection apparatuses and methods for removable photonic chips that do not require translation for calibration when coupling the photonics chip with the sensing system. Also described herein are methods and apparatuses for accurately calibrating a dilution factor when reading from a photonics chip.

Abstract: The present invention provides a method for tracking image objects, adopting at least one first camera and at least one second camera, wherein the first camera shoots a physical environment to obtain a first image, and the second camera shoots the physical environment to obtain a second image that partially overlaps the first image The method comprises the steps of: (a) merging the first image with the second image, in order to form a composite image; and (b) framing and tracking at least one object of the composite image.

Abstract: An image display method used by an image surveillance system is provided. The image surveillance system includes a plurality of cameras. The camera is configured to shoot a part of a physical environment to form a real-time image. The image display method has the following steps: First, a three-dimensional space model corresponding to the physical environment is established. Next, based on the height, the shooting angle and the focal length of the camera, a corresponding viewing frustum is established for each of the camera. According to the viewing frustum, a shooting coverage area of the camera in the physical environment is obtained. Next, a virtual coverage area corresponding to the shooting coverage area is searched out in the three-dimensional space model. Next, the real-time image is imported to a three-dimensional space model and projected to the virtual coverage area.

Abstract: The method for labeling image objects is applied to a monitoring system that comprises a plurality of cameras, a first image analysis module and a plurality of second image analysis modules, wherein the plurality of cameras capture an image, having a background and at least one object, of a real environment, and the method comprises the steps of: (a) using the first image analysis module to frame and track the at least one object; (b) separating the framed object from the background; (c) classifying the object to one of the plurality of the second image analysis modules according to one initial feature of the object; (d) the plurality of second image analysis modules analyzing the initial feature in order to obtain an advance feature; and (e) labeling the object according to the advance feature.

Abstract: An optical film includes at least one light-absorbing film layer and at least one anti-reflection film layer formed on the at least one light-absorbing film layer. A material of the at least one light-absorbing film layer is a mixed powder of chromium metal and SixOy. The x and the y are respectively greater than 0 and positive integers. The disclosure further relates to an optical lens and a lens module. The optical film can reduce the effect of stray light on the imaging quality.