Abstract: An image display method used by an image surveillance system is provided. The image surveillance system includes a plurality of cameras. The camera is configured to shoot a part of a physical environment to form a real-time image. The image display method has the following steps: First, a three-dimensional space model corresponding to the physical environment is established. Next, based on the height, the shooting angle and the focal length of the camera, a corresponding viewing frustum is established for each of the camera. According to the viewing frustum, a shooting coverage area of the camera in the physical environment is obtained. Next, a virtual coverage area corresponding to the shooting coverage area is searched out in the three-dimensional space model. Next, the real-time image is imported to a three-dimensional space model and projected to the virtual coverage area.

Abstract: The method for labeling image objects is applied to a monitoring system that comprises a plurality of cameras, a first image analysis module and a plurality of second image analysis modules, wherein the plurality of cameras capture an image, having a background and at least one object, of a real environment, and the method comprises the steps of: (a) using the first image analysis module to frame and track the at least one object; (b) separating the framed object from the background; (c) classifying the object to one of the plurality of the second image analysis modules according to one initial feature of the object; (d) the plurality of second image analysis modules analyzing the initial feature in order to obtain an advance feature; and (e) labeling the object according to the advance feature.

Abstract: An optical film includes at least one light-absorbing film layer and at least one anti-reflection film layer formed on the at least one light-absorbing film layer. A material of the at least one light-absorbing film layer is a mixed powder of chromium metal and SixOy. The x and the y are respectively greater than 0 and positive integers. The disclosure further relates to an optical lens and a lens module. The optical film can reduce the effect of stray light on the imaging quality.

Abstract: A battery charging station includes a power bus, a power supplying unit, a first voltage converting unit and a processor. The power supplying unit receives a first power to generate a second power accordingly and transmits the second power to the power bus as a supplying power of the power bus. The first voltage converting unit is coupled to the power bus and is connected to a first battery removably disposed in the battery station. The processor sets the first voltage converting unit to operate in a first mode or a second mode, the first voltage converting unit in the first mode receives the supplying power from the power bus so as to charge the first battery. The first voltage converting unit in the second mode receives the electrical power from the first battery and generates a second mode power towards the power bus.

Abstract: A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion.

Abstract: The present disclosure provides a method for forming a semiconductor structure. The method includes the following operations. A metal layer is formed. An adhesion-enhancing layer is formed over the metal layer by a silicide operation. A dielectric stack is formed over the adhesion-enhancing layer. A trench is formed in the dielectric stack by removing a portion of dielectric stack aligning with the metal layer. A barrier layer is formed conforming to the sidewall of the trench. A high-k dielectric layer is formed conforming to the barrier layer. A contact is formed in the trench and be connected to the metal layer.

Abstract: Pharmaceutical compositions containing a combination of anti-chondrogenesis agents are disclosed. Methods of reducing scleral chondrogensis, reducing one or more ocular chondrogenic proteins, reducing inflammation induced chondrogensis and treating myopia by administering an effective amount of one or more anti-chondrogensis agents are also provided. The pharmaceutical compositions are useful for treating myopia.

Abstract: A method for forming a semiconductor structure includes following operations. A first substrate including a first side, a second side opposite to the first side, and a metallic pad disposed over the first side is received. A dielectric structure including a first trench directly above the metallic pad is formed. A second trench is formed in the dielectric structure and a portion of the first substrate. A sacrificial layer is formed to fill the first trench and the second trench. A third trench is formed directly above the metallic pad. A barrier ring and a bonding structure are formed in the third trench. A bonding layer is disposed to bond the first substrate to a second substrate. A portion of the second side of the first substrate is removed to expose the sacrificial layer. The sacrificial layer is removed by an etchant.

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

Abstract: A semiconductor structure includes a first substrate, a metallic pad disposed over the first substrate, a dielectric structure disposed over the first substrate and exposing a portion of the metallic pad, a bonding structure disposed over and electrically connected to the metallic pad, a barrier ring surrounding the bonding structure, and a through-hole penetrating the first substrate and the dielectric structure. The bonding structure includes a bottom and a sidewall, the bottom of the bonding structure is in contact with the metallic pad, a first portion of the sidewall of the bonding structure is in contact with the dielectric structure, and a second portion of the sidewall of the bonding structure is in contact with the barrier ring.

Abstract: The present disclosure provides a semiconductor structure, including providing a metal layer, an adhesion-enhancing layer over the metal layer, a dielectric stack over the adhesion-enhancing layer, a contact penetrating the dielectric stack and the adhesion-enhancing layer and connecting with the metal layer, a barrier layer disposed between the contact and the dielectric stack, and a high-k dielectric layer disposed between the contact and the barrier layer.

Abstract: A method of manufacturing a circuit board having a heat dissipation block includes forming an opening through a substrate to form an open substrate. The opening has a first sidewall and a second sidewall opposite to each other, and the open substrate includes a substrate body surrounding the opening, at least one first fixing portion extending from the substrate body toward the opening and protruding from the first sidewall, and at least one second fixing portion extending from the substrate body toward the opening and protruding from the second sidewall. The heat dissipation block is then clamped between the first fixing portion and second fixing portion to fix the heat dissipation block in the opening.

Abstract: The present invention provides a 3D visual intelligent simulation monitoring system and a simulation display method thereof, comprising a plurality of monitoring devices and at least one central control device. The monitoring devices capture video screens and generate a plurality of image signals to the central control device. A signal receiving unit of the central control device receives the image signals of the monitoring devices and transmits to an operational simulation unit, and the operational simulation unit operates the image signals with a location data and a geographic data incorporatively and generates at least one 3D simulation image. Thereby monitoring personnel can directly monitor with the 3D simulation image of the central control device, thus achieving comprehensive viewing and perfect monitoring, and functions of responding and manipulating at the first instant through the central control device.

Abstract: One embodiment of safety apparatus for a lithium ion battery module comprises a health monitoring component configured to detect degradation of a battery cell within the lithium ion battery module and transmit an output signal; and a safety protection component configured to receive the output signal and at least disable operation of the lithium ion battery module.

Abstract: Pharmaceutical compositions containing a combination of anti-chondrogenesis agents are disclosed. Methods of reducing scleral chondrogensis, reducing one or more ocular chondrogenic proteins, reducing inflammation induced chondrogensis and treating myopia by administering an effective amount of one or more anti-chondrogensis agents are also provided. The pharmaceutical compositions are useful for treating myopia.

Abstract: The invention provides methods and devices for generating optical pulses in one or more waveguides using a spatially scanning light source. A detection system, methods of use thereof and kits for detecting a biologically active analyte molecule are also provided. The system includes a scanning light source, a substrate comprising a plurality of waveguides and a plurality of optical sensing sites in optical communication with one or more waveguide of the substrate, a detector that is coupled to and in optical communication with the substrate, and means for spatially translating a light beam emitted from said scanning light source such that the light beam is coupled to and in optical communication with the waveguides of the substrate at some point along its scanning path. The use of a scanning light source allows the coupling of light into the waveguides of the substrate in a simple and cost-effective manner.

Abstract: A package substrate includes a multilayer circuit structure, a gas-permeable structure, a heat conducting component, a first circuit layer, a second circuit layer and a build-up circuit structure. The gas-permeable structure and the heat conducting component are respectively disposed in a first and a second through holes of the multilayer circuit structure. The first and the second circuit layers are respectively disposed on an upper and a lower surfaces of the multilayer circuit structure and expose a first and a second sides of the gas-permeable structure. The build-up circuit structure is disposed on the first circuit layer and includes at least one patterned photo-imageable dielectric layer and at least one patterned circuit layer alternately stacked. The patterned circuit layer is electrically connected to the first circuit layer by at least one opening. The build-up circuit structure and the first circuit layer exposed by a receiving opening form a recess.

Abstract: Pharmaceutical compositions containing a combination of anti-chondrogenesis agents are disclosed. Methods of reducing scleral chondrogenesis, reducing one or more ocular chondrogenic proteins, reducing inflammation induced chondrogenesis and treating myopia by administering an effective amount of one or more anti-chondrogenesis agents are also provided. The pharmaceutical compositions are useful for treating myopia.

Abstract: A semiconductor structure includes a first substrate, a metallic pad disposed over the first substrate, a dielectric structure disposed over the first substrate and exposing a portion of the metallic pad, a bonding structure disposed over and electrically connected to the metallic pad, a barrier ring surrounding the bonding structure, and a through-hole penetrating the first substrate and the dielectric structure. The bonding structure includes a bottom and a sidewall, the bottom of the bonding structure is in contact with the metallic pad, a first portion of the sidewall of the bonding structure is in contact with the dielectric structure, and a second portion of the sidewall of the bonding structure is in contact with the barrier ring.