Abstract: In an embodiment, a device includes: a first fin; a gate structure over the first fin; a first source/drain region adjacent the gate structure; an etch stop layer over the first source/drain region; a conductive line over the etch stop layer, the conductive line isolated from the first source/drain region by the etch stop layer, a top surface of the conductive line being coplanar with a top surface of the gate structure; and a power rail contact extending through the first fin, the power rail contact connected to the first source/drain region.

Abstract: The present disclosure relates to a semiconductor device having a backside source/drain contact, and method for forming the device. The semiconductor device includes a source/drain feature having a top surface and a bottom surface, a first silicide layer formed in contact with the top surface of the source/drain feature, a first conductive feature formed on the first silicide layer, and a second conductive feature having a body portion and a first sidewall portion extending from the body portion, wherein the body portion is below the bottom surface of the source/drain feature, and the first sidewall portion is in contact with the first conductive feature.

Abstract: An anti-opening container includes a first box and a second box. The first box includes a first body, a first box section and a first gripping section. The first box section is formed by the extension of the first body. The second box includes a second body, a second box section, a second gripping section, an extension section, and a fastener section. The second box section is formed by the extension of the second body. The fastener section is connected to the extension section via a perforated line. The fastener section is embedded in the first box section. When the first gripping section and the second gripping section are displaced in opposite directions, the perforated line breaks, and the first box section and the fastener section are separated from the second box section together to separate the first box and the second box.

Abstract: An anti-opening container includes a first box and a second box. The first box includes a first body and a first box section. The first body includes a first side wall. The first box section is formed by the extension of the first side wall. The second box includes a second body, a second box section and an extension section. The second body includes a second base and a second side wall. The second box section is formed by the extension of the second side wall. When the first box and the second box are combined, the first box section is stacked on the second box section. The extension section is formed by the extension of the second side wall, and includes a fastener and a gripping section. When the fastener fits into the first fastening groove, the gripping section is located outside the first fastening groove.

Abstract: A method for forming a nanosheet device is provided. The method includes epitaxially growing a conformal semiconductor layer from a first stack of semiconductor layers and a second stack of the semiconductor layers. Each of the first and second stack of semiconductor layers includes a plurality of first semiconductor layers and a plurality of second semiconductor layers alternately stacked on each other. A space between the first and second stacks of semiconductor layers is filled with a dielectric fin. The conformal semiconductor layer and the second semiconductor layers may be removed. A metal gate structure is formed over the first semiconductor layers and filling openings created by removal of the conformal semiconductor layer and the second semiconductor layer. A process may be performed on the metal gate structure to form an isolation between the portions of the metal gate structure being separated by a patterning process.

Abstract: In an embodiment, a device includes: a first nanostructure over a substrate, the first nanostructure including a channel region and a first lightly doped source/drain region, the first lightly doped source/drain region adjacent the channel region; a first epitaxial source/drain region wrapped around four sides of the first lightly doped source/drain region; an interlayer dielectric over the first epitaxial source/drain region; a source/drain contact extending through the interlayer dielectric, the source/drain contact wrapped around four sides of the first epitaxial source/drain region; and a gate stack adjacent the source/drain contact and the first epitaxial source/drain region, the gate stack wrapped around four sides of the channel region.

Abstract: The present disclosure provides a method of forming a semiconductor device including an nFET structure and a pFET structure where each of the nFET and pFET structures include a semiconductor substrate and a gate trench. The method includes depositing an interfacial layer in each gate trench, depositing a first ferroelectric layer over the interfacial layer, removing the first ferroelectric layer from the nFET structure, depositing a metal oxide layer in each gate trench, depositing a second ferroelectric layer over the metal oxide layer, removing the second ferroelectric layer from the pFET structure, and depositing a gate electrode in each gate trench.

Abstract: Semiconductor devices and method of forming the same are disclosed herein. A semiconductor device according to the present disclosure includes a first dielectric layer having a first top surface and a contact via extending through the first dielectric layer and rising above the first top surface of the first dielectric layer.

Abstract: A semiconductor device includes a substrate, a first semiconductor fin and a second semiconductor fin protruding from the substrate, an isolation feature disposed on the substrate and on sidewalls of the first and second semiconductor fins, a gate structure disposed on the isolation feature. The semiconductor device also includes a dielectric fin disposed on the isolation feature and sandwiched between the first and second semiconductor fins. A middle portion of the dielectric fin separates the gate structure into a first gate structure segment engaging the first semiconductor fin and a second gate structure segment engaging the second semiconductor fin.

Abstract: In an embodiment, a device includes: a first fin; a gate structure over the first fin; a first source/drain region adjacent the gate structure; an etch stop layer over the first source/drain region; a conductive line over the etch stop layer, the conductive line isolated from the first source/drain region by the etch stop layer, a top surface of the conductive line being coplanar with a top surface of the gate structure; and a power rail contact extending through the first fin, the power rail contact connected to the first source/drain region.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: A method for forming a semiconductor arrangement comprises forming a fin over a semiconductor layer. A gate structure is formed over a first portion of the fin. A second portion of the fin adjacent to the first portion of the fin and a portion of the semiconductor layer below the second portion of the fin are removed to define a recess. A stress-inducing material is formed in the recess. A first semiconductor material is formed in the recess over the stress-inducing material. The first semiconductor material is different than the stress-inducing material.

Abstract: An integrated circuit includes a semiconductor nanostructure transistor. The semiconductor nanostructure transistor includes a plurality of semiconductor nanostructures corresponding to channel regions conductor Nanostructure transistor. A gate metal surrounds the semiconductor nanostructures. The gate metal has differing gate length dimension above the semiconductor nanostructures compared to the gate length between the semiconductor nanostructures.

Abstract: In an embodiment, a device includes: a first nanostructure over a substrate, the first nanostructure including a channel region and a first lightly doped source/drain region, the first lightly doped source/drain region adjacent the channel region; a first epitaxial source/drain region wrapped around four sides of the first lightly doped source/drain region; an interlayer dielectric over the first epitaxial source/drain region; a source/drain contact extending through the interlayer dielectric, the source/drain contact wrapped around four sides of the first epitaxial source/drain region; and a gate stack adjacent the source/drain contact and the first epitaxial source/drain region, the gate stack wrapped around four sides of the channel region.

Abstract: The present disclosure relates to a semiconductor device having a backside source/drain contact, and method for forming the device. The semiconductor device includes a source/drain feature having a top surface and a bottom surface, a first silicide layer formed in contact with the top surface of the source/drain feature, a first conductive feature formed on the first silicide layer, and a second conductive feature having a body portion and a first sidewall portion extending from the body portion, wherein the body portion is below the bottom surface of the source/drain feature, and the first sidewall portion is in contact with the first conductive feature.

Abstract: A semiconductor device according to the present disclosure includes a vertical stack of channel members, a gate structure over and around the vertical stack of channel members, and a first source/drain feature and a second source/drain feature. Each of the vertical stack of channel members extends along a first direction between the first source/drain feature and the second source/drain feature. Each of the vertical stack of channel members is spaced apart from the first source/drain feature by a silicide feature.

Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a substrate, an isolation layer, a gate stack structure, and a dielectric layer. The method includes partially removing the gate stack structure to form a first trench in the gate stack structure. The method includes forming an isolation structure in the first trench. The method includes removing the first gate stack and the second gate stack to form a first recess and a second recess in the dielectric layer. The method includes forming an n-type gate stack and a p-type gate stack in the first recess and the second recess respectively. The method includes forming a conductive line over the n-type gate stack, the p-type gate stack, and the isolation structure. The conductive line electrically connects the n-type gate stack to the p-type gate stack.

Abstract: The present disclosure provides a method of forming a semiconductor device including an nFET structure and a pFET structure where each of the nFET and pFET structures include a semiconductor substrate and a gate trench. The method includes depositing an interfacial layer in each gate trench, depositing a first ferroelectric layer over the interfacial layer, removing the first ferroelectric layer from the nFET structure, depositing a metal oxide layer in each gate trench, depositing a second ferroelectric layer over the metal oxide layer, removing the second ferroelectric layer from the pFET structure, and depositing a gate electrode in each gate trench.

Abstract: A method of fabricating a semiconductor device includes providing a dummy structure including channel layers disposed over a frontside of a substrate, inner spacers disposed between adjacent channels of the channel layers and at lateral ends of the channel layers, and a gate structure interposing the plurality of channel layers. The dummy structure is disposed at an active edge adjacent to an active region. Perform an etching process to etch the gate structure and the plurality of channel layers to form a cut region along the active edge. Deposit a conductive material in the cut region to form a conductive feature. The method further includes thinning the substrate from a backside of the substrate to expose the conductive feature and forming a backside metal wiring layer on the backside of the substrate. The backside metal wiring layer is in electrical connection with the conductive feature.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.