Patents by Inventor Peter Scott Andrews

Peter Scott Andrews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10811573
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: October 20, 2020
    Assignee: Cree, Inc.
    Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
  • Publication number: 20200309347
    Abstract: Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.
    Type: Application
    Filed: June 15, 2020
    Publication date: October 1, 2020
    Inventors: Florin A. Tudorica, Christopher P. Hussell, John Wesley Durkee, Peter Scott Andrews, Mark Cash, David Randolph
  • Patent number: 10734363
    Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, a light extraction surface of each substrate portion includes protruding features and light extraction surface recesses. Lateral borders between different pixels are aligned with selected light extraction surface recesses. In some aspects, selected light extraction surface recesses extend through an entire thickness of the substrate. Other technical benefits may additionally or alternatively be achieved.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: August 4, 2020
    Assignee: CREE, INC.
    Inventor: Peter Scott Andrews
  • Patent number: 10707386
    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: July 7, 2020
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare
  • Publication number: 20200203419
    Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, an underfill material with improved surface coverage is provided between adjacent pixels of a pixelated-LED chip. The underfill material may be arranged to cover all lateral surfaces between the adjacent pixels. In some aspects, discontinuous substrate portions are formed before application of underfill materials. In some aspects, a wetting layer is provided to improve wicking or flow of underfill materials during various fabrication steps.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 25, 2020
    Inventors: Peter Scott Andrews, Steven Wuester
  • Publication number: 20200194288
    Abstract: An apparatus and associated method for high speed and/or mass transfer of electronic components onto a substrate comprises transferring, using an ejector assembly, electronics components (e.g., light emitting devices) from a die sheet onto an adhesive receiving structure to form a predefined pattern including electronic components thereon, and then transferring the electronic components defining the predefined pattern onto a substrate (e.g., a translucent superstrate) for light emission therethrough to create a high-density (e.g., high resolution) display device utilizing, for example, mini- or micro-LED display technologies.
    Type: Application
    Filed: February 20, 2020
    Publication date: June 18, 2020
    Inventors: Christopher P. Hussell, Peter Scott Andrews
  • Publication number: 20200194636
    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare
  • Patent number: 10683971
    Abstract: Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: June 16, 2020
    Assignee: Cree, Inc.
    Inventors: Florin A. Tudorica, Christopher P. Hussell, John Wesley Durkee, Peter Scott Andrews, Mark Cash, David Randolph
  • Patent number: 10686107
    Abstract: Light emitter devices, components and methods are disclosed. In one aspect, a light emitter component of a light emitter device is disclosed. The light emitter component can include a silver (Ag) portion at least partially disposed over a surface of the component. The component can further include a protective layer at least partially disposed over the Ag portion, the protective layer at least partially including an organic barrier material that increases or improves chemical resistance of the Ag portion. In some aspects, the protective layer includes a polyxylylene (e.g., poly(p-xylylene), a substituted poly(p-xylylene), a fluorocarbon containing poly(p-xylylene), and/or any other polymer prepared from a xylylene and/or comprising —CH2—(C6H4)—CH2— based repeating units. In some aspects, the protective layer includes Parylene.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: June 16, 2020
    Assignee: Cree, Inc.
    Inventors: Shaow B. D. Lin, Peter Scott Andrews
  • Patent number: 10651357
    Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, a light extraction surface of each substrate portion includes protruding features and light extraction surface recesses. Lateral borders between different pixels are aligned with selected light extraction surface recesses. In some aspects, selected light extraction surface recesses extend through an entire thickness of the substrate. Other technical benefits may additionally or alternatively be achieved.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: May 12, 2020
    Assignee: CREE, INC.
    Inventor: Peter Scott Andrews
  • Patent number: 10615325
    Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, a light extraction surface of each substrate portion includes protruding features and light extraction surface recesses. Lateral borders between different pixels are aligned with selected light extraction surface recesses. In some aspects, selected light extraction surface recesses extend through an entire thickness of the substrate. Other technical benefits may additionally or alternatively be achieved.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: April 7, 2020
    Assignee: CREE, INC.
    Inventor: Peter Scott Andrews
  • Publication number: 20200105984
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
    Type: Application
    Filed: November 18, 2019
    Publication date: April 2, 2020
    Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
  • Patent number: 10573543
    Abstract: An apparatus and associated method for high speed and/or mass transfer of electronic components onto a substrate comprises transferring, using an ejector assembly, electronics components (e.g., light emitting devices) from a die sheet onto an adhesive receiving structure to form a predefined pattern including electronic components thereon, and then transferring the electronic components defining the predefined pattern onto a substrate (e.g., a translucent superstrate) for light emission therethrough to create a high-density (e.g., high resolution) display device utilizing, for example, mini- or micro-LED display technologies.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: February 25, 2020
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews
  • Patent number: 10529696
    Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: January 7, 2020
    Assignee: Cree, Inc.
    Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
  • Patent number: 10529773
    Abstract: Solid-state lighting devices, for example, light-emitting diodes (LEDs), which include a primary light-extraction face and a secondary light-extraction face that generally opposes the primary light-extraction face are disclosed. In some embodiments, mirrors internal to the LED may be omitted, and omnidirectional light from the active region is allowed to freely exit the primary light-extraction face and the secondary light-extraction face. In other embodiments, the first light-extraction face and second light-extraction face include opposing sidewalls of an LED. In such embodiments, mirrors internal to the LED may be utilized to direct omnidirectional light from the active region toward the first light-extraction face and the second light-extraction face.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: January 7, 2020
    Assignee: CREE, INC.
    Inventors: Peter Scott Andrews, Christopher P. Hussell
  • Patent number: 10522722
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: December 31, 2019
    Assignee: Cree, Inc.
    Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
  • Patent number: 10483318
    Abstract: Solid-state lighting devices, for example, light-emitting diodes (LEDs), which include a primary light-extraction face and a secondary light-extraction face that generally opposes the primary light-extraction face are disclosed. In some embodiments, mirrors internal to the LED may be omitted, and omnidirectional light from the active region is allowed to freely exit the primary light-extraction face and the secondary light-extraction face. In other embodiments, the first light-extraction face and second light-extraction face include opposing sidewalls of an LED. In such embodiments, mirrors internal to the LED may be utilized to direct omnidirectional light from the active region toward the first light-extraction face and the second light-extraction face.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: November 19, 2019
    Assignee: CREE, INC.
    Inventors: Peter Scott Andrews, Christopher P. Hussell
  • Publication number: 20190333791
    Abstract: An apparatus and associated method for high speed and/or mass transfer of electronic components onto a substrate comprises transferring, using an ejector assembly, electronics components (e.g., light emitting devices) from a die sheet onto an adhesive receiving structure to form a predefined pattern including electronic components thereon, and then transferring the electronic components defining the predefined pattern onto a substrate (e.g., a translucent superstrate) for light emission therethrough to create a high-density (e.g., high resolution) display device utilizing, for example, mini- or micro-LED display technologies.
    Type: Application
    Filed: April 30, 2018
    Publication date: October 31, 2019
    Inventors: Christopher P. Hussell, Peter Scott Andrews
  • Publication number: 20190326485
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
    Type: Application
    Filed: April 19, 2018
    Publication date: October 24, 2019
    Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
  • Patent number: D902448
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: November 17, 2020
    Assignee: Cree, Inc.
    Inventors: Roshan Murthy, Peter Scott Andrews, Kenneth M. Davis, Jesse Reiherzer