Patents by Inventor Peter Scott Andrews

Peter Scott Andrews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10453827
    Abstract: Light emitting diode (LED) devices and systems include a superstrate (e.g., a light-transmissive layer), LEDs attached to the superstrate at a die-attach layer formed thereon, and an encapsulant layer formed over and/or around the LEDs with a non-reflective or clear material. A method for producing LED devices and systems includes providing a superstrate with a die-attach layer formed thereon, attaching LEDs to the superstrate at the die-attach layer, forming conductive surfaces on a side of the LED opposite the die-attach layer, dispensing an encapsulant layer to at least partially encapsulate the LEDs, and forming one or more metal traces to electrically interconnect the conductive surfaces of at least some of the LEDs with each other.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: October 22, 2019
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Alan Wellford Dillon, Peter Scott Andrews
  • Publication number: 20190273070
    Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
    Type: Application
    Filed: May 16, 2019
    Publication date: September 5, 2019
    Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
  • Publication number: 20190252460
    Abstract: Solid-state lighting devices, for example, light-emitting diodes (LEDs), which include a primary light-extraction face and a secondary light-extraction face that generally opposes the primary light-extraction face are disclosed. In some embodiments, mirrors internal to the LED may be omitted, and omnidirectional light from the active region is allowed to freely exit the primary light-extraction face and the secondary light-extraction face. In other embodiments, the first light-extraction face and second light-extraction face include opposing sidewalls of an LED. In such embodiments, mirrors internal to the LED may be utilized to direct omnidirectional light from the active region toward the first light-extraction face and the second light-extraction face.
    Type: Application
    Filed: February 14, 2018
    Publication date: August 15, 2019
    Inventors: Peter Scott Andrews, Christopher P. Hussell
  • Publication number: 20190237638
    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
    Type: Application
    Filed: April 10, 2019
    Publication date: August 1, 2019
    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare
  • Patent number: 10361349
    Abstract: Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: July 23, 2019
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Joseph G. Clark, Troy Gould, Erin R. F. Welch
  • Patent number: 10312224
    Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: June 4, 2019
    Assignee: Cree, Inc.
    Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
  • Patent number: 10295124
    Abstract: Light emitter packages and related methods having improved performance are disclosed. In one aspect, a light emitter package can include at least one light emitter chip disposed over a substrate or submount. In some aspects, the package can include a reflective polymeric material or polymeric reflector (sometimes referred to as a “solder mask” or “solder mask material”), a reflective material, and a conductive material disposed adjacent each other within a portion of the light emitter package. In some aspects, the reflective material can include a metallic material or metallic reflector applied to side walls of traces and/or within portions of a gap between traces prior to application of the reflective polymeric material within the gap.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: May 21, 2019
    Assignee: Cree, Inc.
    Inventor: Peter Scott Andrews
  • Patent number: 10290777
    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: May 14, 2019
    Assignee: CREE, INC.
    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare
  • Publication number: 20190074417
    Abstract: Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.
    Type: Application
    Filed: September 1, 2017
    Publication date: March 7, 2019
    Inventors: Peter Scott Andrews, Joseph G. Clark, Troy Gould, Erin R. F. Welch
  • Publication number: 20190074266
    Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, a light extraction surface of each substrate portion includes protruding features and light extraction surface recesses. Lateral borders between different pixels are aligned with selected light extraction surface recesses. In some aspects, selected light extraction surface recesses extend through an entire thickness of the substrate. Other technical benefits may additionally or alternatively be achieved.
    Type: Application
    Filed: October 30, 2018
    Publication date: March 7, 2019
    Inventor: Peter Scott Andrews
  • Publication number: 20190044040
    Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, a light extraction surface of each substrate portion includes protruding features and light extraction surface recesses. Lateral borders between different pixels are aligned with selected light extraction surface recesses. In some aspects, selected light extraction surface recesses extend through an entire thickness of the substrate. Other technical benefits may additionally or alternatively be achieved.
    Type: Application
    Filed: August 3, 2018
    Publication date: February 7, 2019
    Inventor: Peter Scott Andrews
  • Patent number: 10043960
    Abstract: Light emitting diode (LED) packages and methods are disclosed herein. In one aspect, a light emitting package is disclosed. The light emitting package includes one or more areas of conductive material having a thickness of less than approximately 50 microns (?m). The package can further include at least one light emitting diode (LED) electrically connected to the conductive material and at least one thin gap disposed between areas of conductive material.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: August 7, 2018
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Jeffrey Carl Britt
  • Patent number: 9897267
    Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 20, 2018
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Sung Chul Joo, Erin Welch, Peter Scott Andrews, Joseph G. Clark, John A. Edmond, Jesse C. Reiherzer
  • Publication number: 20180033924
    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
    Type: Application
    Filed: July 21, 2017
    Publication date: February 1, 2018
    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare
  • Publication number: 20170345866
    Abstract: Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.
    Type: Application
    Filed: August 14, 2017
    Publication date: November 30, 2017
    Inventors: Sung Chul Joo, Peter Scott Andrews, Erin R. F. Welch
  • Publication number: 20170294418
    Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
    Type: Application
    Filed: January 9, 2017
    Publication date: October 12, 2017
    Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
  • Publication number: 20170294417
    Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
    Type: Application
    Filed: January 5, 2017
    Publication date: October 12, 2017
    Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
  • Patent number: 9780268
    Abstract: Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In some aspects, light emitter components can include a submount with a first side having a first surface area, first and second electrical contacts disposed on the first side of the submount, and at least one light emitter chip on the first side. In some aspects, the electrical contact area can be less than half of the first surface area of the first side of the submount. Components disclosed herein can include low profile parts or domes where a ratio between a dome height and a dome width is less than 0.5. A method of providing components can include providing a panel of material and LED chips, dispensing a liquid encapsulant material over the panel, and singulating the panel into individual submount based components after the encapsulant material has hardened.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: October 3, 2017
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Erin Welch, Jesse Colin Reiherzer, Peter Scott Andrews
  • Patent number: 9735198
    Abstract: Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 15, 2017
    Assignee: Cree, Inc.
    Inventors: Sung Chul Joo, Peter Scott Andrews, Erin Welch
  • Patent number: 9673363
    Abstract: A light emitting device includes a mounting substrate having a reflective layer that defines spaced apart anode and cathode pads, and a gap between them. A light emitting diode die is flip-chip mounted on the mounting substrate, such that the anode contact of the LED die is bonded to the anode pad and the cathode contact of the LED die is bonded to the cathode pad. A lens extends from the mounting substrate to surround the LED die. The reflective layer extends on the mounting substrate to cover substantially all of the mounting substrate that lies beneath the lens, excluding the gap, and may also extend beyond the lens.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: June 6, 2017
    Assignee: Cree, Inc.
    Inventors: Matthew Donofrio, John Adam Edmond, Peter Scott Andrews, David Der Chi Chang