Patents by Inventor Peter Scott Andrews

Peter Scott Andrews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170098746
    Abstract: Flip chip LEDs incorporate multi-layer reflectors and light transmissive substrates patterned along an internal surface adjacent to semiconductor layers. A multi-layer reflector may include a metal layer and a dielectric layer containing conductive vias. Portions of a multi-layer reflector may wrap around a LED mesa including an active region, while being covered with passivation material. A substrate patterned along an internal surface together with a multi-layer reflector enables reduction of optical losses. A light transmissive fillet material proximate to edge emitting surfaces of an emitter chip may enable adequate coverage with lumiphoric material. An emitter chip may be elevated with increased thickness of solder material and/or contacts, and may reduce luminous flux loss when reflective materials are present on a submount.
    Type: Application
    Filed: September 29, 2016
    Publication date: April 6, 2017
    Inventors: Michael John Bergmann, Matthew Donofrio, Peter Scott Andrews, Colin Blakely, Troy Gould, Jack Vu
  • Publication number: 20160320004
    Abstract: Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.
    Type: Application
    Filed: April 29, 2016
    Publication date: November 3, 2016
    Inventors: Florin A. Tudorica, Christopher P. Hussell, John Wesley Durkee, Peter Scott Andrews, Mark Cash, David Randolph
  • Patent number: 9450163
    Abstract: An SMD includes a substrate and one or more electrical contacts on a first surface of the substrate. Each one of the electrical contacts are configured to couple to a corresponding electrical contact located on a surface of a carrier, and are located within a concentric area of the first surface that is less than about 50% of a total area of the first surface. By providing the electrical contacts within the concentric area, the mechanical stress experienced by the electrical contacts can be significantly reduced when compared to conventional SMDs including electrical contacts on the outer edges thereof. Accordingly, the failure rate of the SMD due to separation of one or more of the electrical contacts from the carrier may be reduced.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: September 20, 2016
    Assignee: Cree, Inc.
    Inventors: Theodore D. Lowes, Peter Scott Andrews, Jesse Reiherzer, Amber Christine Salter
  • Patent number: 9300062
    Abstract: Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: March 29, 2016
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Kurt S. Wilcox, Peter Scott Andrews, Jesse Colin Reiherzer
  • Publication number: 20160013164
    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.
    Type: Application
    Filed: April 6, 2015
    Publication date: January 14, 2016
    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo
  • Patent number: 9209354
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: December 8, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Jesse Colin Reiherzer, David T. Emerson
  • Patent number: 9203004
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: December 1, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Jesse Colin Reiherzer, David T. Emerson
  • Patent number: 9194567
    Abstract: High voltage array light emitting devices and fixtures are disclosed. In one embodiment a light emitting device can include a submount, a light emission area disposed over the submount and a retention material adapted to be dispensed about the light emission area. The light emitting device can be operable at high voltages which are greater than approximately 40 volts (V). In one aspect, the retention material can be least partially disposed within the light emission area such that the retention material physically separates a first section of the light emission area from a second section of the light emission area.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: November 24, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Jesse Colin Reiherzer, Jeffrey Carl Britt, Praneet Athalye, Peter Scott Andrews
  • Patent number: 9147812
    Abstract: Methods of assembly for a semiconductor light emitting device package may include positioning a submount on a mounting substrate with a flux material therebetween and at least substantially free of solder material therebetween. The submount has a metal bonding layer facing the mounting substrate. A semiconductor light emitting device is positioned on a top side of the submount with a flux material therebetween to provide an assembled stack. The assembled stack is reflowed to attach the metal bonding layer of the submount to the mounting substrate and to attach the light emitting device to the submount.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: September 29, 2015
    Assignee: Cree, Inc.
    Inventor: Peter Scott Andrews
  • Patent number: 9099616
    Abstract: Light emitter packages and devices having improved wire bonding and related methods are disclosed. In one embodiment a light emitter package can include at least one light emitting diode (LED) chip electrically connected to an electrical element via a wire bond. The wire bond can be provided at improved wire bonding parameters such as a temperature of approximately 150° C. or less, a bonding time of approximately 100 ms or less, a power of approximately 1700 mW or less, and a force of approximately 100 grams force (gf) or less, or combinations thereof.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: August 4, 2015
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Sung Chul Joo
  • Patent number: 9082921
    Abstract: A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: July 14, 2015
    Assignee: Cree, Inc.
    Inventors: Kurt S. Wilcox, Bernd P. Keller, Theodore Lowes, Peter Scott Andrews
  • Publication number: 20150179897
    Abstract: Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (LED) chip disposed over the submount. The submount can contact at least two different sides of the at least one LED chip. In one aspect, a submount can include surface portions adapted to receive portions one or more LED chips. In one aspect, one or more LED chips can be embedded within the submount.
    Type: Application
    Filed: December 22, 2014
    Publication date: June 25, 2015
    Inventors: Peter Scott Andrews, Luis Adames
  • Patent number: 9041042
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: May 26, 2015
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: 9000470
    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: April 7, 2015
    Assignee: Cree, Inc.
    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo
  • Publication number: 20150048393
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 19, 2015
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: 8922108
    Abstract: Remote component devices, systems, and methods are disclosed. In one aspect, remote component devices, systems, and methods can include a body for lockably securing the remote component to a housing. Devices, systems, and methods can also include one or more light emitting devices disposed over the body. An optical material can be remotely located at least a first distance away from the one or more light emitting devices. Remote component devices, systems, and methods disclosed herein can be used as replacements and/or equivalent light products for standard filament light bulbs and compact fluorescent lamp (CFL) bulbs.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: December 30, 2014
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Florin A. Tudorica, David T. Emerson
  • Patent number: 8916896
    Abstract: Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (LED) chip disposed over the submount. The submount can contact at least two different sides of the at least one LED chip. In one aspect, a submount can include surface portions adapted to receive portions one or more LED chips. In one aspect, one or more LED chips can be embedded within the submount.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: December 23, 2014
    Assignee: CREE, Inc.
    Inventors: Peter Scott Andrews, Luis Adames
  • Patent number: 8895998
    Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: November 25, 2014
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Florin A. Tudorica, Erin R. F. Welch
  • Patent number: 8896013
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: November 25, 2014
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: D753612
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: April 12, 2016
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Erin Welch, Andrew Signor