Abstract: The invention provides an immersion fluid module including a tank, a heat exchanger, a condenser, and at least one pipe. The tank contains a first fluid. An electronic device is disposed in the tank and is at least partially immersed in the first fluid in a liquid state. The heat exchanger is disposed in the tank and is at least partially immersed in the first fluid in the liquid state. The condenser is disposed in the tank. The pipe connects the heat exchanger and the condenser. A second fluid is provided to the pipe, and a temperature of the second fluid is higher than a preset value. When an ambient temperature of the electronic device is lower than the preset value, the second fluid flows through the heat exchanger to raise the ambient temperature of the electronic device. The invention also provides a server system.

Abstract: A computer-implemented method, according to one embodiment, includes obtaining information about a plurality of remote storage systems. Each of the remote storage systems includes a cache. The method further includes generating a routing table based on the information, the routing table indicating potential write data migration paths from a cache of a local storage system to the caches of the remote storage systems. A write data migration plan is generated based on the routing table. The write data migration plan specifies which of the caches of the remote storage systems to migrate at least some write data originally intended to be stored on the cache of the local storage system to. In response to a determination that a first predetermined condition associated with the cache of the local storage system is met, the method includes causing the write data migration plan to be performed.

Abstract: The present disclosure relates to the technical field of preparation of trisilylamine (TSA), in particular to a method for preparing TSA at an ultra-low temperature. The present disclosure provides a method for preparing TSA without a solvent at an ultra-low temperature, where by-products generated by a reaction can be easily removed by filtration with a metal ion-adsorption permeable membrane. The TSA obtained by the reaction has a gas chromatography (GC) purity of 99.5%, a receivable yield of not less than 85% (in terms of ammonia), and a metal ion purity of 6N. In addition, the method has a simple device, a high reaction degree of raw materials, a lower cost, a great market value, and a better industrial production benefit.

Abstract: A curved full-array LED light panel, a curved backlight module including the curved full-array LED light panel, and a curved LCD including the backlight module are disclosed. The curved full-array LED light panel includes a flexible reflective sheet and a plurality of LED light bars wherein a plurality of LEDs are disposed. The plurality of LED light bars are attached to a sheet-rear side of the flexible reflective sheet alone a direction parallel to the height direction of the full-array LED light panel, and the plurality of LEDs disposed on the LED light bars are exposed from a plurality of openings of the flexible reflective sheet toward an LCD panel. Along a direction parallel to the width direction of the full-array LED light panel, the flexible reflective sheet is deformed to form a curved reflective surface. Each of the LED light bars further comprises a bar-shaped PCB, and a plurality of LED dimming-zone circuits are disposed on the bar-shaped PCB.

Abstract: A storage device is disclosed herein. The storage device comprises: a non-volatile memory, where the non-volatile memory includes a block of N wordlines partitioned into a plurality of sub-blocks; and control circuitry coupled to the N wordlines. The control circuitry is configured to: determine a program status of an unselected sub-block of the plurality of sub-blocks before performing an operation on a selected sub-block of the plurality of sub-blocks; based on determining that the program status of the unselected sub-block is programmed, perform a precharge operation including applying a first precharge time; and based on determining that the program status of the unselected sub-block is not programmed, perform a precharge operation including applying a second precharge time, wherein the first precharge time is for a longer period than the second precharge time.

Abstract: The present invention provides a medium-carbon boron-containing steel. The chemical components of the medium-carbon boron-containing steel are as follows in mass percentage: 0.37-0.45% of C; 0.17-0.37% of Si; 0.60-0.90% of Mn; 0.020-0.060% of Al; 0.0008-0.0035% of B; 0.030-0.060% of Ti; P?0.025%; S?0.025%; Cr?0.25%; Ni?0.20%; Mo?0.10%; Cu?0.20%; and the remainder is Fe and inevitable impurities. The controlled rolling and controlled cooling method suitable for the on-line normalizing treatment of medium-carbon boron-containing steel sequentially comprises the following steps: heating, rough rolling, finishing rolling, cooling by passing through water, and cold bed slow cooling. The medium-carbon boron-containing steel can meet the requirements of having a hardness of 190-220 HBW, an actual grain size that is ?7 grade, and a banded structure that is ?2 grade.

Abstract: Disclosed are a brush head fixture for production of a toothbrush head and a manufacturing method of the toothbrush head. The brush head fixture includes a fixture main body, a bristle accommodating part, a material sealing surface, and one or more positioning holes. The bristle accommodating part is configured for accommodating the free end of implanted bristles in the process of manufacturing the toothbrush head. The material sealing surface is located on one side of the fixture main body away from the bristle accommodating part and configured for preventing the material of the coating layer from entering the bristle accommodating part when forming the coating layer. The positioning hole penetrates through the wall of the fixture main body between the material sealing surface and the bristle accommodating part. The positioning hole is configured for injection molding the retaining part, and also for positioning the retaining part obtained through injection molding.

Abstract: A processor can include various processing pipelines that perform different data processing operations, with different pipelines having dedicated logic and memory circuits. A power management circuit can determine when to supply power to various pipelines, including the logic and memory circuits of the various pipelines, depending on a current operating mode of the processor. When a memory circuit transitions to a lower power state such as a sleep state, data can be saved to a different memory circuit that is not transitioning to a lower power state, and when the memory circuit is powered up again, the data can be restored from the different memory circuit.

Abstract: A method includes etching a semiconductor substrate to form a trench, with the semiconductor substrate having a sidewall facing the trench, and depositing a first semiconductor layer extending into the trench. The first semiconductor layer includes a first bottom portion at a bottom of the trench, and a first sidewall portion on the sidewall of the semiconductor substrate. The first sidewall portion is removed to reveal the sidewall of the semiconductor substrate. The method further includes depositing a second semiconductor layer extending into the trench, with the second semiconductor layer having a second bottom portion over the first bottom portion, and a second sidewall portion contacting the sidewall of the semiconductor substrate. The second sidewall portion is removed to reveal the sidewall of the semiconductor substrate.

Abstract: A multiple-lens optical fingerprint reader for reading fingerprints through a display has an image sensor integrated circuit with photosensor array(s); a spacer; and multiple lenses in a microlens array, each lens of multiple lenses focuses light arriving at that lens from a finger adjacent the display through the spacer to form an image on associated photosensors on a photosensor array of the integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the fingerprint through arrayed microlenses onto a photosensor array of an integrated circuit, reading the array to overlapping electronic fingerprint images; extracting features from the overlapping electronic fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.

Abstract: A camera lens module includes an image sensor and a sandwiched lens structure formed over the image sensor, the sandwiched lens structure including a layer lens between a first glass substrate and a second glass substrate, and a baffle formed between the layer lens and the first glass substrate or between the layer lens and the second glass substrate.

Abstract: One embodiment provides for a graphics processing unit to accelerate machine-learning operations, the graphics processing unit comprising a multiprocessor having a single instruction, multiple thread (SIMT) architecture, the multiprocessor to execute at least one single instruction; and a first compute unit included within the multiprocessor, the at least one single instruction to cause the first compute unit to perform a two-dimensional matrix multiply and accumulate operation, wherein to perform the two-dimensional matrix multiply and accumulate operation includes to compute an intermediate product of 16-bit operands and to compute a 32-bit sum based on the intermediate product.

Abstract: Methods and system for a database management system (DBMS) in which a leader thread is elected from concurrent transaction threads stored in one or more data nodes. While the leader thread copies its own thread transaction log onto a reserved portion of the shared log buffer, the leader thread permits other transaction threads to attach to a thread chain starting with the leader thread. Once the leader has completed copying its thread transaction log onto the shared log buffer, it then reserves a portion of the shared log buffer, and copies the member thread transaction logs onto the shared log buffer to reduce the contention for shared buffer may be reduced.

Abstract: A semiconductor device structure and method for manufacturing the same are provided. The method includes forming a first resistive element over a substrate, and the first resistive element has a first sidewall extending in a first direction and a second sidewall opposite to the first sidewall and extending in the first direction. The method further includes forming a first conductive feature and a second conductive feature over and electrically connected to the first resistive element and forming a second resistive element over the first resistive element and spaced apart from the first resistive element in a second direction. In addition, the second resistive element is located between the first sidewall and the second sidewall of the first resistive element in a top view, and the first resistive element and the second resistive element are made of different nitrogen-containing materials.

Abstract: A self-illuminating camera includes a camera and an illuminator. The camera includes an image sensor and a first lens of a pair of two identical lenses. The illuminator is adjacent to the camera and includes a light source and a second lens of the pair of two identical lenses. The illuminator has a field of illumination that at least partially overlaps a field of view of the camera.

Abstract: A detection device includes a substrate and a die. The substrate provides a first voltage. The die is disposed adjacent to the substrate. The die includes a plurality of resistor paths, a selection circuit, an ADC (Analog-to-Digital Converter), and a digital circuit. The selection circuit selects one of the resistor paths as a target path. The target path provides a second voltage. The ADC generates a digital signal according to the first voltage and the second voltage. The digital circuit processes the digital signal.

Abstract: Provided are an ultrasound image detection system and a method thereof based on artificial intelligence (AI) automatic labeling of anatomical structures, including: a receiving module, an image recognition module having an object detection model, an image processing module and a display module, wherein the image recognition module utilizes the object detection model to perform object detection on the image to be recognized, which is received by the receiving module, and then obtains a plurality of object recognition images with object detection results. Then, the image processing module detects missed anatomical structures according to the object detection results of the plurality of object recognition images, thereby outputting an object detection image. Additionally, the display module displays the object detection image. Therefore, the anatomical structures in the ultrasound image can be automatically and instantly recognized by AI so as to provide accurate judgment basis for medical personnel.

Abstract: An acceleration sensor includes an upper base plate; a lower base plate; and a gallium-based liquid metal encapsulated in graphene. The lower base plate includes a first surface including at least one diamond channel, and the upper base plate includes a second surface including a metal electrode corresponding to the at least one diamond channel in position; the liquid metal is disposed in a center of the at least one diamond channel; the first surface is bonded to the second surface through an adhesive; the liquid metal is movable in the at least one diamond channel and is in electrical contact with the metal electrode of the upper base plate during movement.

Abstract: An ESD protection device includes an N-type semiconductor substrate, a P-type semiconductor layer, a first N-type well, a P-type well, a second N-type well, a first P-type heavily-doped area, a first N-type heavily-doped area, and a second P-type heavily-doped area. The semiconductor layer is formed on the substrate. The wells are formed in the semiconductor layer. The second N-type well directly touches the substrate. The first P-type heavily-doped area is formed in the first N-type well. The first N-type heavily-doped area and the second P-type heavily-doped area are formed in the P-type well. The second P-type heavily-doped area is coupled to the second N-type well through an external conductive wire and replaced with a second N-type heavily-doped area.