Patents by Inventor Ping Chen
Ping Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240108065Abstract: The present invention discloses an atomizing device, an atomizing assembly thereof, and a manufacturing process of the atomizing assembly. The atomizing assembly includes: a liquid conducting member configured for adsorbing an atomizable medium, and provided with at least two installation positions; a heating assembly sewn to the liquid conducting member; and electrodes, including at least two conductive electrodes respectively arranged on the installation positions and electrically connected to the heating assembly to enable the heating assembly to heat and atomize the atomizable medium on the liquid conducting member when electrified. The conductive electrode is fixed to the installation position in an assembly manner, so that the dry burning caused by the disengagement of the heating assembly and the liquid conducting member due to that the conductive electrode is stressed to pull the heating assembly during the assembly process is avoided; meanwhile, the manufacturing process is convenient and efficient.Type: ApplicationFiled: July 21, 2023Publication date: April 4, 2024Inventor: Ping Chen
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Publication number: 20240108063Abstract: The present invention discloses an atomizing device, an atomizing assembly, and a manufacturing process of the atomizing assembly. The atomizing assembly includes a first liquid conducting member, a heating assembly and an electrode. The first liquid conducting member is flexible and configured for adsorbing an atomizable medium. The heating assembly is fixed to the first liquid conducting member through sewing. The electrode is connected to the heating assembly, so that the heating assembly heats and atomizes the atomizable medium in the first liquid conducting member when electrified. The heating material is fixed to the liquid conducting substrate based on the sewing principle, to form the atomizing assembly with good reliability, easy to batch production, and having good contact between the heating and the liquid conducting substrate.Type: ApplicationFiled: July 21, 2023Publication date: April 4, 2024Inventor: Ping Chen
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Publication number: 20240108064Abstract: The present invention discloses an atomizing device, an atomizing assembly, and a manufacturing process of the atomizing assembly. The atomizing assembly includes a first liquid conducting member and an electrode. The first liquid conducting member is flexible and configured for adsorbing an atomizable medium. The electrode includes a conductive electrode including a conductive area that is formed by sewing a conductive wire on the first liquid conducting member and electrically connected to a heating assembly. The conductive area of the conductive electrode of the atomizing assembly is sewn to the first liquid conducting member, the production is relatively simple and easy to implement, the electrically conductive material is fixed on the liquid conducting substrate based on the sewing principle, to form the atomizing assembly with good reliability, easy to batch production, and having good contact between the heating assembly and the liquid conducting substrate.Type: ApplicationFiled: July 21, 2023Publication date: April 4, 2024Inventor: Ping Chen
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Publication number: 20240111339Abstract: A cabling structure of a foldable electronic device includes a first body, a second body, a hinge module connecting the first body and the second body, a sliding member movably disposed in the second body, a flexible electrical connecting member connected to the first body, the second body, and the sliding member and being driven when the first body and the second body are rotated relatively, and a restoring module disposed in the second body and providing a force to the sliding member. The first body and the second body are rotated relatively to each other through the hinge module. When being rotated relatively to each other, the first body and the second body drive the flexible electrical connecting member and the sliding member. The restoring module restores the sliding member and the flexible electrical connecting member via the force.Type: ApplicationFiled: May 8, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen
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Publication number: 20240111330Abstract: A foldable electronic device is provided, including a first body, a second body, a supporting member, a first hinge connecting the first body and the supporting member, a second hinge connecting the supporting member and the second body, and a gravity-type latch movably disposed in the supporting member. The first body and the supporting member are rotated relatively to be folded or unfolded via the first hinge, and the second body and the supporting member are rotated relatively to be folded or unfolded via the second hinge. In a transforming process of the first body folding to the supporting member and together unfolding relative to the second body, the gravity-type latch is latched onto the first body once the unfolding angle is less than a predetermined value, and the gravity-type latch is de-latched from the first body once the unfolding angle is equal to or greater than the predetermined value.Type: ApplicationFiled: May 4, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Jui-Yi Yu, Chun-Hsien Chen, Hui-Ping Sun, Chun-Hung Wen, Yen-Chou Chueh
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Patent number: 11947416Abstract: A system and related method identify a weakness of a workflow in a complex system. The method collects runtime data about the complex system. The complex system comprises a plurality of subcomponents, and the method identifies an abnormal operation in the complex system. The method constructs a multi-dimensional cause-and-effect relation matrix among the plurality of subcomponents, and filters one or more related operations using the multi-dimensional cause-and-effect relation matrix.Type: GrantFiled: December 14, 2021Date of Patent: April 2, 2024Assignee: International Business Machines CorporationInventors: Wei Xian, Gang Lyu, Dong Ping Song, Geng Hu, Yao Dong Zhang, Ke Qiang Chen
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Patent number: 11948224Abstract: One embodiment provides an apparatus comprising a memory stack including multiple memory dies and a parallel processor including a plurality of multiprocessors. Each multiprocessor has a single instruction, multiple thread (SIMT) architecture, the parallel processor coupled to the memory stack via one or more memory interfaces. At least one multiprocessor comprises a multiply-accumulate circuit to perform multiply-accumulate operations on matrix data in a stage of a neural network implementation to produce a result matrix comprising a plurality of matrix data elements at a first precision, precision tracking logic to evaluate metrics associated with the matrix data elements and indicate if an optimization is to be performed for representing data at a second stage of the neural network implementation, and a numerical transform unit to dynamically perform a numerical transform operation on the matrix data elements based on the indication to produce transformed matrix data elements at a second precision.Type: GrantFiled: November 1, 2022Date of Patent: April 2, 2024Assignee: Intel CorporationInventors: Elmoustapha Ould-Ahmed-Vall, Sara S. Baghsorkhi, Anbang Yao, Kevin Nealis, Xiaoming Chen, Altug Koker, Abhishek R. Appu, John C. Weast, Mike B. Macpherson, Dukhwan Kim, Linda L. Hurd, Ben J. Ashbaugh, Barath Lakshmanan, Liwei Ma, Joydeep Ray, Ping T. Tang, Michael S. Strickland
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Publication number: 20240107895Abstract: A semiconductor device includes a substrate having an array region defined thereon, a ring of magnetic tunneling junction (MTJ) region surrounding the array region, a gap between the array region and the ring of MTJ region, and metal interconnect patterns overlapping part of the ring of MTJ region. Preferably, the array region includes a magnetic random access memory (MRAM) region and a logic region and the ring of MTJ region further includes a first MTJ region and a second MTJ region extending along a first direction and a third MTJ region and a fourth MTJ region extending along a second direction.Type: ApplicationFiled: December 4, 2023Publication date: March 28, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chung-Liang Chu, Jian-Cheng Chen, Yu-Ping Wang, Yu-Ruei Chen
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Publication number: 20240106235Abstract: A high anti-interference microsystem based on System In Package (SIP) for a power grid is provided. The high anti-interference microsystem comprises a ceramic cavity, a ceramic substrate, a magnetic cover plate, a digital signal processing circuit, an analog signal conditioning circuit and a shield, wherein the ceramic cavity supports the ceramic substrate, the magnetic cover plate is in sealed contact with the ceramic cavity, and the ceramic substrate is arranged in a cavity formed by the ceramic cavity and the magnetic cover plate; a sealed shell of the microsystem based on SIP is composed of the magnetic cover plate and the ceramic cavity; the digital signal processing circuit and the analog signal conditioning circuit are arranged on the ceramic substrate and respectively process received signals to be processed; the shield covers an outer side of the sealed shell and is used for shielding external magnetic field interference.Type: ApplicationFiled: August 2, 2023Publication date: March 28, 2024Applicant: Electric Power Research Institute of State Grid Zhejiang Electric Power Co., LTDInventors: Xianjun SHAO, Xiaoxin CHEN, Yiming ZHENG, Chen LI, Jianjun WANG, Ping QIAN, Hua XU, Shaoan WANG, Shaohe WANG, Haibao MU, Huibin TAO, Lin ZHAO, Wenzhe ZHENG, Dun QIAN
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Patent number: 11942363Abstract: A method includes etching a semiconductor substrate to form a trench, with the semiconductor substrate having a sidewall facing the trench, and depositing a first semiconductor layer extending into the trench. The first semiconductor layer includes a first bottom portion at a bottom of the trench, and a first sidewall portion on the sidewall of the semiconductor substrate. The first sidewall portion is removed to reveal the sidewall of the semiconductor substrate. The method further includes depositing a second semiconductor layer extending into the trench, with the second semiconductor layer having a second bottom portion over the first bottom portion, and a second sidewall portion contacting the sidewall of the semiconductor substrate. The second sidewall portion is removed to reveal the sidewall of the semiconductor substrate.Type: GrantFiled: August 9, 2022Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shih-Yao Lin, Kuei-Yu Kao, Chen-Ping Chen, Chih-Han Lin
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Patent number: 11944016Abstract: A magnetoresistive random access memory, including a substrate, a conductive plug in the substrate, wherein the conductive plug has a notched portion on one side of the upper edge of the conductive plug, and a magnetic memory cell with a bottom electrode electrically connecting with the conductive plug, a magnetic tunnel junction on the bottom electrode and a top electrode on the magnetic tunnel junction, wherein the bottom surface of the magnetic memory cell and the top surface of the conductive plug completely align and overlap each other.Type: GrantFiled: March 11, 2022Date of Patent: March 26, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hung-Chan Lin, Yu-Ping Wang, Hung-Yueh Chen
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Patent number: 11940737Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.Type: GrantFiled: May 7, 2021Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
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Patent number: 11943525Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.Type: GrantFiled: February 17, 2022Date of Patent: March 26, 2024Assignee: OmniVision Technologies, Inc.Inventors: Teng-Sheng Chen, Wei-Ping Chen, Jau-Jan Deng, Wei-Feng Lin
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Patent number: 11940367Abstract: A device for simulating carbon dioxide storage in a deep saline aquifer, including a CO2 gas source, first and second valves, first and second pressure pumps, first, second and third pressure gauges, a water storage tank, a simulation box, a first flow meter, a gas-liquid separator, a recycling tank, a microcomputer-display assembly, a structure plate, core holders, an injection pipeline, a connection pipeline, a baffle, a piezometer, a second flow meter, a heater, a lifter and an acoustic logging tool. The CO2 gas source, the first valve, the first pressure pump and the first pressure gauge for gas injection. The water storage tank, a second pressure pump and a second pressure gauge for water injection. The second valve, the third pressure gauge, the first flow meter, the gas-liquid separator and the recycling tank form an output pipeline.Type: GrantFiled: November 3, 2023Date of Patent: March 26, 2024Assignee: Southwest Petroleum UniversityInventors: Ping Yue, Hongnan Yang, Yuan Lei, Xu Zheng, Peng Song, Pengyu Chen, Zhouhua Wang, Simin Qu
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Patent number: 11942390Abstract: A device includes a device layer comprising a first transistor; a first interconnect structure on a front-side of the device layer; and a second interconnect structure on a backside of the device layer. The second interconnect structure includes a first dielectric layer on the backside of the device layer; a contact extending through the first dielectric layer to a source/drain region of the first transistor; a conductive line electrically connected to the source/drain region of the first transistor through the contact; and a thermal dissipation path thermally connected to the device layer, the thermal dissipation path extending to a surface of the second interconnect structure opposite the device layer. The thermal dissipation path comprises a dummy via.Type: GrantFiled: June 6, 2022Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wen-Sheh Huang, Yu-Hsiang Chen, Chii-Ping Chen
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Patent number: 11943373Abstract: An identity certificate may be issued to a blockchain node. The issuance may include issuing a first identity certificate to a first terminal and receiving a second identity certificate issuance request that is from the first terminal. A second identity certificate may be issued to the first terminal, and a third identity certificate issuance request is received from the second terminal. A third identity certificate is issued to the second terminal, so that the second terminal forwards the third identity certificate to the third terminal.Type: GrantFiled: June 2, 2021Date of Patent: March 26, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Mao Cai Li, Zong You Wang, Kai Ban Zhou, Chang Qing Yang, Hu Lan, Li Kong, Jin Song Zhang, Yi Fang Shi, Geng Liang Zhu, Qu Cheng Liu, Qiu Ping Chen
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GPS Interference Source Positioning Method, Apparatus, Electronic Device, and Readable Storage Media
Publication number: 20240094406Abstract: The present invention provides a GPS interference source positioning method, apparatus, electronic device, and readable storage medium, which relates to the technical field of wireless communications.Type: ApplicationFiled: June 13, 2023Publication date: March 21, 2024Inventors: Zhiyong FENG, Sai HUANG, Jingchun LI, Yiliang CHEN, Ping ZHANG, Shuo CHANG -
Publication number: 20240098932Abstract: A foldable electronic device, including a first body, a second body, an air valve movably disposed in the first body, at least one triggering member, and a hinge connecting the first body and the second body, is provided. The first body has multiple openings respectively located at two opposite surfaces. The triggering member is movably disposed in the first body and has a part exposed outside the first body. The air valve and the triggering member are mutually on moving paths of each other. The first body and the second body are rotated to be folded or unfolded relative to each other by the hinge. A part of the triggering member is suitable for bearing a force such that the triggering member drives the air valve, so that the air valve opens or closes the openings.Type: ApplicationFiled: July 19, 2023Publication date: March 21, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Yu-Ming Lin, Chun-Hsien Chen
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Publication number: 20240095159Abstract: A method for assessing test adequacy of deep neural networks based on element decomposition is provided. The network testing is divided into black box testing and white box testing, of which key elements are decomposed and defined. Network parameters including a weight matrix and a bias vector are extracted. Importance values of neurons in individual layers of the deep neural network are calculated and clustered, and an importance value hot map of neurons in each layer is generated based on clustering results. Mutation testing, and index calculation and evaluation are performed.Type: ApplicationFiled: November 22, 2023Publication date: March 21, 2024Inventors: Yinxiao MIAO, Yifei LIU, Ping YANG, Xiujian ZHANG, Zhonghao CHENG, Long ZHANG, Tianqi WAN, Haoyi CHEN, Jing SUN, Yijia DING
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Patent number: 11934223Abstract: A foldable electronic device, including a first body having a first shaft member, at least one second body having a second shaft member, and a latching member, is provided. The first shaft member and the second shaft member are coaxially pivoted together. The first shaft member has a recess. The second shaft member has a locking hole. The latching member is movably disposed in the recess and the locking hole, so that when the latching member leaves the locking hole, the first body and the second body are relatively pivoted through the first shaft member and the second shaft member, or when the latching member moves into the locking hole, the latching member interferes with the first shaft member and the second shaft member to block the first body and the second body from relatively pivoting.Type: GrantFiled: May 30, 2022Date of Patent: March 19, 2024Assignee: Acer IncorporatedInventors: Hui-Ping Sun, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen